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2038-60-SM-RP

产品描述Gas Discharge Tubes - GDTs / Gas Plasma Arrestors GAS DISCHARGE TUBE
产品类别分立半导体    二极管   
文件大小228KB,共3页
制造商Bourns
官网地址http://www.bourns.com
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2038-60-SM-RP概述

Gas Discharge Tubes - GDTs / Gas Plasma Arrestors GAS DISCHARGE TUBE

2038-60-SM-RP规格参数

参数名称属性值
是否Rohs认证不符合
包装说明O-LELF-R2
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time5 weeks
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码O-LELF-R2
元件数量1
端子数量2
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
认证状态Not Qualified
表面贴装YES
技术AVALANCHE
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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*R
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
n
Balanced Mini-TRIGARD™
(5 mm diameter, 7.5 mm length)
n
Ideal for board level protection of
broadband circuits
n
Symmetrical breakdown voltage (L-L, L-G)
n
Leadless, surface mount for economical
assembly
M
PL
IA
NT
n
High surge current rating, low insertion loss
n
Stable breakdown throughout life
n
RoHS compliant* versions available
Bourns offers a symmetrical surface mount (SM) 3-electrode GDT surge protection device. The industry-leading quality and features of the
Bourns
®
miniature-TRIGARD
TM
series GDT continue in the 2038 symmetrical version. The 2038 series is ideal for board level protection of
high bandwidth applications such as xDSL, cable broadband and high speed Ethernet, due to its symmetrical turn on characteristics as well as
high energy-handling capability, long and stable life performance and low capacitance of less than 1 pF. The 2038 series breakdown
voltages are nearly equal line to line as well as line to ground. Bourns
®
Gas Discharge Tubes (GDT) are designed to prevent damage from
transient disturbances by acting as a “crowbar” in creating a virtual short-to-ground circuit during conduction. When an electrical surge
exceeds the defined breakdown voltage level of the GDT, the gas becomes ionized and rapid conduction takes place. When the surge passes
and the system voltage returns to normal levels, the GDT returns to its high-impedance (off) state.
*R
oH
S
CO
2038 Series Miniature Symmetrical 3-Electrode Surface Mount Gas Discharge Tube
Characteristics
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Test Methods per ITU-T K.12, IEEE C62.31 and IEC 61643-311 GDT standards.
Characteristic
DC Sparkover ± 25 % @ 100 V/s
L1/L2 to Gnd
(1)
Typical Impulse Sparkover
(2)
L1/L2 to Gnd
100V/μs
1000V/μs
Characteristic
DC Sparkover ± 25 % @ 100 V/s
L1/L2 to Gnd
(1)
Typical Impulse Sparkover
(2)
L1/L2 to Gnd
100V/μs
1000V/μs
(2)
LE
AD
F
RE
E
2038-15-SM
2038-20-SM
2038-23-SM
Model No.
230 V
2038-30-SM
2038-35-SM
150 V
200 V
300 V
350 V
350 V
500 V
2038-42-SM
425 V
575 V
2038-47-SM
2038-60-SM
Model No.
600 V
850 V
1100 V
450 V
600 V
500 V
650 V
2038-80-SM
600 V
750 V
2038-110-SM
420 V
675 V
850 V
470 V
750 V
950 V
800 V
1150 V
1400 V
1100 V
1500 V
1700 V
Impulse Sparkover voltage is defined as typical values of distribution.
Impulse Transverse Delay ............................... 100 V/µs............................................................< 50 ns
Insulation Resistance (IR) ............................... 100 V ................................................................> 10
9
Ω
Glow Voltage ................................................... 10 mA................................................................~ 70 V
Arc Voltage ...................................................... 1 A .....................................................................~ 10 V
Glow-Arc Transition Current .......................................................................................................< 0.5 A
Capacitance..................................................... 1 MHz ...............................................................< 1 pF
DC Holdover Voltage
(3)
................................... 135 V (80 V for Model 2038-15) .......................< 150 ms
Impulse Discharge Current .............................. 10000 A, 8/20 µs
(4)
...........................................1 operation min.
5000 A, 8/20 µs .................................................> 10 operations
200 A, 10/1000 µs .............................................> 300 operations
200 A, 10/700 µs ..............................................> 500 operations
10 A, 10/1000 µs ..............................................> 1500 operations
Alternating Discharge Current ......................... 10 Arms, 1 s
(4)
..................................................1 operation min.
5 Arms, 1 s ........................................................> 10 operations
Operating Temperature............................................................................................................... -40 to +90 °C
Climatic Category (IEC 60068-1)................................................................................................ 40/90/21
Notes:
• 2038-35 UL Recognized
, file E153537, 2038-110 CSA Approved
, file LR93265 (UL 1449).
• The rated discharge current for Mini-TRIGARD™ GDTs is the total current equally divided between each line to ground.
• Surface Mount (SM) parts may show a temporary increase in DCBD after the solder reflow process. Most devices will recover within 24 hours
time. It should be noted that there is no quality defect nor change in protection levels during the temporary change in DCBD.
• Sparkover limits after life ±30 %. IR >108
Ω.
• Operating characteristics per RUS PE-80 and Telcordia GR 1361 available on request.
• At delivery AQL 0.65 Level II, DIN ISO 2859.
• Bourns recommends reflowing surface mount devices per IPC/JEDEC J-STD-020 rev D.
(1)
Line to Line DC Sparkover tolerance typically less than +30 % at 100 V/s.
(3)
Network applied.
(4)
DC Sparkover may exceed ±30 % but will continue to protect without venting.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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