NTC thermistors for
temperature measurement
SMD NTC thermistors,
case size 0805 (2012), automotive series
Series/Type:
Date:
B574**V5
December 2016
© EPCOS AG 2016. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V5
Automotive series
Applications
Temperature measurement and compensation
Features
Qualification based on AEC-Q200 Rev-D
Multilayer SMD NTC with inner electrodes
Nickel barrier termination
For temperature measurement up to 150
°C
Excellent long-term aging stability in high
temperature and high humidity environment
UL approval (E69802)
Options
Alternative resistance ratings, resistance
tolerances and B value tolerances available on
request.
Delivery mode
Cardboard tape, 180-mm reel
General technical data
Operating temperature range
Max. power
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
Dimensional drawing
Dimensions in mm
Approx. weight 13 mg
T
op
(at 25
°C,
on PCB) P
251)
∆R
R
/R
R
T
R
(on PCB)
δ
th1)
(on PCB)
τ
c1)
C
th1)
40 ... 150
210
±3, ±5
25
approx. 3.5
approx. 10
approx. 35
°C
mW
%
°C
mW/K
s
mJ/K
Electrical specification and ordering codes
R
25
Ω
4.7 k
4.7 k
10 k
10 k
10 k
33 k
47 k
100 k
∆R
R
/R
R
%
±3, ±5
±3, ±5
±3, ±5
±3, ±5
±3, ±5
±3, ±5
±3, ±5
±3, ±5
No. of R/T
characteristic
8500
8507
8500
8502
8507
8502
8502
8507
B
25/50
K
3590
4386
3590
3940
4386
3940
3940
4386
B
25/85
K
3635
4455
3635
3980
4455
3980
3980
4455
B
25/100
K
3650
±3%
4480
±3%
3650
±3%
4000
±3%
4480
±3%
4000
±3%
4000
±3%
4480
±3%
Ordering code
B57442V5472+062
B57452V5472+062
B57442V5103+062
B57451V5103+062
B57452V5103+062
B57451V5333+062
B57451V5473+062
B57452V5104+062
+ = Resistance tolerance
H =
±3%
J =
±5%
1) Depends on mounting situation
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 2 of 19
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V5
Automotive series
Reliability data
Tests of SMD NTC thermistors are based on AEC-Q200 Rev-D. The parts are mounted on
standardized PCB.
Test
Pre- and
post-stress
electrical test
High temperature
exposure
(storage)
Temperature
cycling
Standard
Test conditions
Resistance at: 25
°C
and 100
°C
∆R
25
/R
25
Remarks
(typical)
Biased humidity
Operational life
External visual
Physical
dimensions
Resistance to
solvents
Mechanical shock
Test temperature: 150
°C
Duration: 1000 h
Unpowered
JESD22,
Lower test temperature: 40
°C
method JA-104 Upper test temperature: 150
°C
Number of cycles: 1000
Transfer time: < 10 s
Dwell time: 15 min
Air Air
MIL-STD-202, Test temperature: 85
°C
method 103
Rel. humidity of air: 85%
Duration: 1000 h
Test voltage: V
NTC
= 0.3 V DC
MIL-STD-202, Test temperature: 150
°C
method 108
P
max
= 0.35 mW
Duration: 1000 h
MIL-STD-883E, Visual inspection
method 2009
JESD22,
Measured with calibers
method JB-100
MIL-STD-202,
method 108
MIL-STD-202,
method 215
MIL-STD-202,
method 213
MIL-STD-202,
method 204
Not applicable for SMD thermistors
(component has no marking, color
coding or coating)
Peak value: 1500
g
Half sine
Condition F
Acceleration: 5
g
Sweep time: 20 min
Frequency range: 10 ... 2000 Hz
3
×
12 cycles
Dip: 260
°C;
10 s
1 heat cycle
< 5%
< 5%
< 5%
< 5%
Within the
specified
values
< 5%
Vibration
< 5%
Resistance to
soldering heat
MIL-STD-202,
method 210
< 3%
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 3 of 19
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V5
Automotive series
Test
ESD
Standard
Test conditions
Solderability
Electrical
characterization
Flammability
AEC-Q200-002, Discharge capacitance: 150 pF
method -002
Discharge resistance: 2 kΩ
Charging voltage: 6 kV
Contact discharge
2 pulses in each polarity
J-STD-002
a) Dip: 235
°C;
5 s:
aging 4 h @ 155
°C
b) Dip: 215
°C;
5 s:
steam aging 8 h @ 92
°C
c) Dip: 260
°C;
7 s:
steam aging 8 h @ 92
°C
R(25
°C),
R(100
°C),
B(25/100)
∆R
25
/R
25
Remarks
(typical)
< 5%
95% of
termination
wetted
Within the
specified
values
Board flex
Terminal strength
Resistance drift
after soldering
Not applicable for SMD thermistors
(component is not coated or
encapsulated with plastic materials)
AEC-Q200-005, Max. bending: 2 mm
method -005
Duration @ max. bending: 60 s
AEC-Q200-006, Max. F: 17.7 N
method -006
Reflow soldering profile
Wave soldering profile
UL-94,
V-0 or V-1
< 5%
< 5%
< 1%
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 4 of 19
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V5
Automotive series
R/T characteristics
R/T No.
T (°C)
55.0
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
55.0
60.0
65.0
70.0
75.0
80.0
85.0
90.0
95.0
100.0
105.0
110.0
115.0
120.0
125.0
130.0
135.0
140.0
145.0
150.0
8500
8502
8507
B
25/100
= 3650 K
B
25/100
= 4000 K
B
25/100
= 4480 K
R
T
/R
25
α
(%/K) R
T
/R
25
α
(%/K) R
T
/R
25
α
(%/K)
63.917
45.889
33.344
24.504
18.201
13.657
10.347
7.9114
6.1019
4.7454
3.7198
2.938
2.3372
1.8722
1.5096
1.2249
1.0000
0.82111
0.67798
0.56279
0.46958
0.39374
0.33171
0.28073
0.23863
0.2037
0.17459
0.15022
0.12975
0.11247
0.097838
0.085396
0.074781
0.065691
0.057883
0.051153
0.045335
0.040289
0.0359
0.032071
0.028723
0.025786
6.8
6.5
6.3
6.1
5.8
5.6
5.5
5.3
5.1
4.9
4.8
4.6
4.5
4.4
4.2
4.1
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3.0
3.0
2.9
2.8
2.8
2.7
2.6
2.6
2.5
2.4
2.4
2.3
2.3
2.2
2.2
2.1
96.158
66.892
47.127
33.606
24.243
17.681
13.032
9.702
7.2923
5.5314
4.2325
3.2657
2.54
1.9907
1.5716
1.2494
1.0000
0.80552
0.65288
0.53229
0.43645
0.35981
0.29819
0.24837
0.20787
0.17479
0.14763
0.12523
0.10667
0.091227
0.078319
0.067488
0.058363
0.050647
0.044098
0.03852
0.033752
0.029663
0.026146
0.023111
0.020484
0.018203
7.4
7.1
6.9
6.6
6.4
6.2
6.0
5.8
5.6
5.4
5.3
5.1
4.9
4.8
4.7
4.5
4.4
4.3
4.1
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.2
3.1
3.0
2.9
2.9
2.8
2.7
2.7
2.6
2.6
2.5
2.4
2.4
2.3
142.71
96.913
66.637
46.366
32.629
23.213
16.686
12.115
8.8803
6.5692
4.9025
3.6896
2.7994
2.1406
1.6492
1.2798
1.0000
0.78663
0.62277
0.4961
0.39757
0.32044
0.2597
0.21161
0.17331
0.14265
0.11799
0.098035
0.081823
0.068589
0.057735
0.048796
0.041403
0.035263
0.030143
0.025858
0.022258
0.019223
0.016655
0.014476
0.012619
0.011033
7.9
7.6
7.4
7.1
6.9
6.7
6.5
6.3
6.1
5.9
5.8
5.6
5.4
5.3
5.1
5.0
4.9
4.7
4.6
4.5
4.4
4.3
4.1
4.0
3.9
3.8
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.2
3.1
3.0
3.0
2.9
2.8
2.8
2.7
2.7
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 5 of 19
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
