NTCC200E4, NTCC300E4
www.vishay.com
Vishay BCcomponents
Leadless NTC Thermistor Die Suitable for Wire Bonding
FEATURES
• Flat chip contacted top and bottom
(gold: NTCC300E4 series or silver: NTCC200E4
series)
• Green thermistor - does not use RoHS
exemptions
• Wide temperature range from -55 °C to +175 °C
• Highly resistant to thermal shocks
• Ideal for wire bonding (aluminum or gold
depending on metalization type)
• Resistance to leaching
• Delivered on blister tape
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
QUICK REFERENCE DATA
PARAMETER
Resistance value at 25 °C
Tolerance on
R
25
-value
B
25/85
-value
Tolerance on B
25/85
-value
Operating temperature range
Response time (63.2 %)
25 °C to 85 °C still air (for info)
Dissipation factor
in still air
(for info, non-mounted die)
Maximum power dissipation
Weight
VALUE
4.7K to 20K
± 1; ± 2; ± 3; ± 5
3435 to 3865
±1
-55 to +175
3
3
50
3
UNIT
%
K
%
°C
s
mW
mW
mg
APPLICATIONS
• High temperature sensing, control and compensation.
E.g. IGBT modules (inverters in EV and HEV vehicles)
• IC and semiconductor protecting
• DC/AC power inverters and HIC overheat protecting
DESIGN-IN SUPPORT
For complete curve computation, please visit:
www.vishay.com/thermistors/ntc-curve-list/
MARKING
The thermistors have no marking and have electrode
termination design without orientation.
Wire bonding:
• The gold electrode has been tested for gold wire bonding
with a wire diameter of max. 32 μm.
• The silver electrode has been tested for aluminum wire
bonding with a wire diameter of max. 300 μm.
Encapsulation:
• In order to preserve the characteristics of the bonded die
at long term an encapsulation is mandatory.
• The encapsulation is defined by the user. Silicon and
epoxy encapsulations have been tested. For
recommendations on compatible encapsulants contact
Vishay.
MOUNTING
The thermistors are primarily intended for wire bonding. The
parameters of the assembly process should be chosen in
accordance with the lead-wire material.
The mounting process should be in compliance with the
following guidelines and recommendations:
Die bonding:
• Gold electrode: silver epoxy gluing.
• Silver electrode: (vacuum) reflow soldering - silver epoxy
gluing - nano silver sintering.
Cleaning:
• Detergent spraying.
• Ultrasonic or formic acid vapor cleaning is not
recommended.
ELECTRICAL DATA AND ORDERING INFORMATION
R
25
()
4700
12 000
20 000
4700
12 000
20 000
R
25
-TOL.
(± %)
1, 2, 3, 5
1, 2, 3, 5
1, 2, 3, 5
1, 2, 3, 5
1, 2, 3, 5
1, 2, 3, 5
B
25/85
(K)
3435
3740
3865
3435
3740
3865
B
25/85
-TOL.
(± %)
1
1
1
1
1
1
DESCRIPTION
Bare die with top / bottom silver terminations
Bare die with top / bottom silver terminations
Bare die with top / bottom silver terminations
Bare die with top / bottom gold terminations
Bare die with top / bottom gold terminations
Bare die with top / bottom gold terminations
SAP MATERIAL AND
ORDERING NUMBER
(1)
NTCC200E4472*T
NTCC200E4123*T
NTCC200E4203*T
NTCC300E4472*T
NTCC300E4123*T
NTCC300E4203*T
Note
(1)
In order to define
R
-tolerance, replace * in SAP part number by F (± 1 %), G (± 2 %), H (± 3 %), or J (± 5 %)
25
Revision: 20-Mar-17
Document Number: 29153
1
For technical questions, contact:
nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
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Vishay
Disclaimer
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Revision: 08-Feb-17
1
Document Number: 91000
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