电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

2038-35-SM-RPLF

产品描述Gas Discharge Tubes - GDTs / Gas Plasma Arrestors MINI TRIGARD SYMMETRICAL SMT
产品类别分立半导体    二极管   
文件大小228KB,共3页
制造商Bourns
官网地址http://www.bourns.com
标准
下载文档 详细参数 全文预览

2038-35-SM-RPLF在线购买

供应商 器件名称 价格 最低购买 库存  
2038-35-SM-RPLF - - 点击查看 点击购买

2038-35-SM-RPLF概述

Gas Discharge Tubes - GDTs / Gas Plasma Arrestors MINI TRIGARD SYMMETRICAL SMT

2038-35-SM-RPLF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明O-LELF-R2
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time5 weeks
其他特性UL RECOGNIZED
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码O-LELF-R2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
认证状态Not Qualified
表面贴装YES
技术AVALANCHE
端子面层Tin (Sn)
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

文档预览

下载PDF文档
*R
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
n
Balanced Mini-TRIGARD™
(5 mm diameter, 7.5 mm length)
n
Ideal for board level protection of
broadband circuits
n
Symmetrical breakdown voltage (L-L, L-G)
n
Leadless, surface mount for economical
assembly
M
PL
IA
NT
n
High surge current rating, low insertion loss
n
Stable breakdown throughout life
n
RoHS compliant* versions available
Bourns offers a symmetrical surface mount (SM) 3-electrode GDT surge protection device. The industry-leading quality and features of the
Bourns
®
miniature-TRIGARD
TM
series GDT continue in the 2038 symmetrical version. The 2038 series is ideal for board level protection of
high bandwidth applications such as xDSL, cable broadband and high speed Ethernet, due to its symmetrical turn on characteristics as well as
high energy-handling capability, long and stable life performance and low capacitance of less than 1 pF. The 2038 series breakdown
voltages are nearly equal line to line as well as line to ground. Bourns
®
Gas Discharge Tubes (GDT) are designed to prevent damage from
transient disturbances by acting as a “crowbar” in creating a virtual short-to-ground circuit during conduction. When an electrical surge
exceeds the defined breakdown voltage level of the GDT, the gas becomes ionized and rapid conduction takes place. When the surge passes
and the system voltage returns to normal levels, the GDT returns to its high-impedance (off) state.
*R
oH
S
CO
2038 Series Miniature Symmetrical 3-Electrode Surface Mount Gas Discharge Tube
Characteristics
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Test Methods per ITU-T K.12, IEEE C62.31 and IEC 61643-311 GDT standards.
Characteristic
DC Sparkover ± 25 % @ 100 V/s
L1/L2 to Gnd
(1)
Typical Impulse Sparkover
(2)
L1/L2 to Gnd
100V/μs
1000V/μs
Characteristic
DC Sparkover ± 25 % @ 100 V/s
L1/L2 to Gnd
(1)
Typical Impulse Sparkover
(2)
L1/L2 to Gnd
100V/μs
1000V/μs
(2)
LE
AD
F
RE
E
2038-15-SM
2038-20-SM
2038-23-SM
Model No.
230 V
2038-30-SM
2038-35-SM
150 V
200 V
300 V
350 V
350 V
500 V
2038-42-SM
425 V
575 V
2038-47-SM
2038-60-SM
Model No.
600 V
850 V
1100 V
450 V
600 V
500 V
650 V
2038-80-SM
600 V
750 V
2038-110-SM
420 V
675 V
850 V
470 V
750 V
950 V
800 V
1150 V
1400 V
1100 V
1500 V
1700 V
Impulse Sparkover voltage is defined as typical values of distribution.
Impulse Transverse Delay ............................... 100 V/µs............................................................< 50 ns
Insulation Resistance (IR) ............................... 100 V ................................................................> 10
9
Ω
Glow Voltage ................................................... 10 mA................................................................~ 70 V
Arc Voltage ...................................................... 1 A .....................................................................~ 10 V
Glow-Arc Transition Current .......................................................................................................< 0.5 A
Capacitance..................................................... 1 MHz ...............................................................< 1 pF
DC Holdover Voltage
(3)
................................... 135 V (80 V for Model 2038-15) .......................< 150 ms
Impulse Discharge Current .............................. 10000 A, 8/20 µs
(4)
...........................................1 operation min.
5000 A, 8/20 µs .................................................> 10 operations
200 A, 10/1000 µs .............................................> 300 operations
200 A, 10/700 µs ..............................................> 500 operations
10 A, 10/1000 µs ..............................................> 1500 operations
Alternating Discharge Current ......................... 10 Arms, 1 s
(4)
..................................................1 operation min.
5 Arms, 1 s ........................................................> 10 operations
Operating Temperature............................................................................................................... -40 to +90 °C
Climatic Category (IEC 60068-1)................................................................................................ 40/90/21
Notes:
• 2038-35 UL Recognized
, file E153537, 2038-110 CSA Approved
, file LR93265 (UL 1449).
• The rated discharge current for Mini-TRIGARD™ GDTs is the total current equally divided between each line to ground.
• Surface Mount (SM) parts may show a temporary increase in DCBD after the solder reflow process. Most devices will recover within 24 hours
time. It should be noted that there is no quality defect nor change in protection levels during the temporary change in DCBD.
• Sparkover limits after life ±30 %. IR >108
Ω.
• Operating characteristics per RUS PE-80 and Telcordia GR 1361 available on request.
• At delivery AQL 0.65 Level II, DIN ISO 2859.
• Bourns recommends reflowing surface mount devices per IPC/JEDEC J-STD-020 rev D.
(1)
Line to Line DC Sparkover tolerance typically less than +30 % at 100 V/s.
(3)
Network applied.
(4)
DC Sparkover may exceed ±30 % but will continue to protect without venting.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
STM32F105RCT6串口1ISP连不上
目前在用STM32F105RCT6 ,在调试串口1的ISP。 一次也没连上。 描述一下状况:0)系统电源波形稳定 1)外围电路除串口1全部去掉,外部晶振去掉,外部加一个复位芯片 2)FLASH ......
ldrxxx stm32/stm8
ramdisk.img在android中的使用
ramdisk.img在android中的使用 ramdisk.img在android中的使用 ramdisk中包含一些对于启动android的很重要的文件,比如内核启动完后加载的第一个进程init,一些重要的配置文件等,总之它控制着 ......
Wince.Android Linux开发
12864显示无法换行???
我只能显示第一行和第三行.没办法显示到第二和四.地址我写对了.是什么原因啊?...
小学阶段 单片机
TCL培训教程(全)
32949...
gauson FPGA/CPLD
有人试过用PC的USB给TP4056供电吗
TP4056的充电电流设置成800mA,输入电压5V,而PC的USB输出是+5V和500mA,如果通过PC的USB口给TP4056模块供电,会烧坏PC USB口吗?还是TP4056的充电电流会根据输入电流的降低而降低啊,哪位 ......
HXHNTTXLLAabc 电源技术
【T叔藏书阁】敷铜相关专辑 14册
敷铜相关专辑:AD全面的敷铜规则.pdf 敷铜相关专辑:PCB敷铜的作用.pdf 敷铜相关专辑:PCB板如何正确的敷铜.pdf 敷铜相关专辑:PCB设计与PCBA加工-精品资料 216_ 30.0M.pdf 敷铜相关专辑:P ......
高进 下载中心专版

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1709  2412  1564  188  2194  57  12  10  41  52 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved