PULSE-GUARD ESD Suppressors
1.04
(0.041") REF
®
1.66 +/- 0.06
(0.066" +/- 0.003”)
Surface Mount Polymeric Electrostatic Discharge Suppressors
0.36 (0.014")
0.15 +/- 0.08
(0.006" +/- 0.003”)
PGB2 0201 Series
0.43 +/- 0.18
(0.017" +/- 0.007”)
0.84 +/- 0.05
(0.033" +/- 0.002”)
RoHS
Reflow Solder
0.51 (0.020")
3.05
(0.120")
1.27 (0.050")
Wave Solder
0.76 (0.030")
3.30
(0.130")
1.27 (0.050")
0.76 (0.030")
Description
PULSE-GUARD
®
ESD Suppressors help protect sensitive
electronic equipment against electrostatic discharge (ESD).
They use polymer composite materials to suppress fast-
rising ESD transients (as specified in IEC 61000-4-2), while
adding virtually no capacitance to the circuit.
They supplement the on-chip protection of integrated
circuitry and are best suited for low-voltage, high-speed
applications where low capacitance is important to ensure
minimal interference of data signal integrity.
The new and ultra-small surface mount PGB2 0201 series
offers a RoHS Compliant, Halogen Free, and 100% Lead
Free circuit protection alternative.
0.76 (0.030")
Equivalent Circuits
Equivalent Circuit
1
2
Features
• Lead-free, Halogen-free
and RoHS compliant
• Ultra-low capacitance
• Low leakage current
• Fast response time
• One line of protection
Applications
• HDTV Hardware
• Laptop/Desktop
Computer
• Network Hardware
• HDMI/USB 3.0
• Computer Peripherals
• Digital Camera
• External Storage
• Set-Top Box
• Bi-directional
• Withstands multiple
ESD strikes
• Compatible with
pick-and-place processes
Product Characteristics
Part Number
PGB2010201KR
Lines Protected
1
Component Package
0201
Electrical Characteristics
Specification
ESD Capability:
IEC 61000-4-2 Direct Discharge (typical)
IEC 61000-4-2 Air Discharge (typical)
Trigger Voltage (typical)
Clamping Voltage (typical)
Rated Voltage (maximum)
Capacitance (typical)
Response Time
Leakage Current (typical)
ESD Pulse Withstand
PGB2010201
8kV
10kV - 15kV
400V
55V
12VDC, max
0.07 pF typical
,
<1nS
<1nA
1000 pulses min
Measured at 250 MHz
Measured per IEC 61000-4-2
8kV Direct Discharge Method
Measured at 12 VDC
Some shifting in characteristics may occur when tested over
multiple pulses at a very rapid rate
Notes
The ESD capability measured by direct and air discharge method
is subject to testing equipment and conditions. Numerous factors
could affect the reliability and reproducibility of the direct and air
discharge test results.
Measured per IEC 61000-4-2
8kV Direct Discharge Method
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/16/15
PULSE-GUARD
®
ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Typical ESD Response Curve
500
(8 kV IEC 61000-4-2 Direct Discharge)
Dimensions
Dimensions: mm (inch)
500
Device Dimensions
0.63 +/- .03
(0.025” +/- .001”)
1.00
500
500
Voltage (V)
Voltage (V
300
0.25
500
(0.010")
400
200
0.310 +/- 0.08
(0.012" +/- 0.003")
0.99 +/- 0.05
(0.039" +/- 0.002")
300
0.30 +/- .03
(0.012” +/- .001”)
500
400
Capacitance (pF)
Capacitance (pF)
400
0.15 +/- 0.08
(0.006" +/- 0.003")
400
1.00
0.10
200
1.00
Voltage (V)
Voltage (V
300
100
100
0.21
(0.0084”)
0.18 +/- 0.10
(0.007” +/- 0.004”)
75
0
25
50
Time (ns)
Voltage (V
300
200
0
0.51 +/- 0.05
(0.020" +/- 0.002")
-25
0
25
50
75
Time (ns)
100
125
150
175
200
300
0
-25
100
200
100
125
150
175
Voltage (V)
0.10
0.01
100
Capacitance (pF)
70
60
50
40
400
0.24 +/- 0.09
300
(0.009" +/- 0.004")
400
0.32 Max
(0.013” Max)
0.10
200
100
0.01
100
70
100
0
reflow
(500 V Direct Discharge)
Typical TLP Response Curve
soldering only
0
-25
150
200
200
1.55
0
(0.061")
0
150
175
150
0.280
(0.011”)
(0.010”)
0
0.250
25
reflow soldering only
25
50
0.38
75
Time
(0.015")
(ns)
100
125
-25
50
Time (ns)
0.810
75
100
(0.032”)
125
150
175
200
Voltage (V
Voltage (V)
.58
(0.023")
0.56
(0.022")
200
100
100
150
200
Voltage (V
50
150
200
0.35
(0.014”)
150
100
0
50
Part Numbering System
Voltage (V)
1.00 +/- 0.05
(0.039" +/- 0.002")
0
15
30
Time (ns)
45
60
75
100
0
150
Voltage (V)
100
50
-15
-15
50
0
15
30
Time (ns)
45
60
75
0.50 +/- 0.05
(0.020" +/- 0.002")
0
50
2
0
-15
0
15
30
Time (ns)
45
60
75
LEAD-FREE
HALOGEN-FREE
PULSE-GUARD
®
0
ESD SUPPRESSORS
50
-15
0
2
100
15
QUANTITY &
PACKAGING CODE:
30
45
= 10,000 pieces
75
60
KR
DEVICE SIZE CODE:
0201 = 0201 (0603)
Time (ns)
Insertion Loss
Insertion Loss (dB)
(dB)
Insertion Loss (dB)
Insertion Loss (dB)
0.23
Typical
(0.009")
0
Insertion Loss
-6
-2
-15
2
Nom.
-4
0
15
30
Time (ns)
45
60
75
-2
-4
-6
0.30 +/- 0.08
(0.012" +/- 0.003")
PENDING
Typical Device Capacitance
0
To Be Determined
-2
-8
0.10
2
-15
0
15
30
Time (ns)
45
60
75
Capacitance (pF)
Capacitance (pF)
0
0.27 +/- 0.09
(0.011" +/- 0.004")
LINES PROTECTED:
0
= 1 line
01
0
Capacitance (pF)
Capacitance (pF)
Voltage (V
PGB2 01 0201 KR
Capacitance (fF)
Capacitance (fF)
60
50
-25
Reflow
25
Solder
0
50
75
100
Time (ns)
Recommended for
125
150
175
0
100
-25
Recommended Soldering Pad Layout
0
25
50
75
Time (ns)
100
125
Recommended
150
for
175
0.01
1
40
1.00
1.00
0.10
0.10
0.01
100
1
2
0
Insertion Loss (dB)
Capaciatnce (pF)
-2
-8
10
-4
-10
-6
-12
10
100
1000
Frequency (MHz)
10000
100000
Insertion Loss (dB)
-6
-12
-6
-12
10
-2
-8
-10
-12
0
100
To Be Determined
1000
Frequency (MHz)
Capacitance (pF)
Capacitance (pF)
0.20 +/- 0.09
-4
-10
(0.008" +/- 0.004")
-2
-8
0.01
100
1.00
0
-4
-10
2
PENDING
10000
100000
0
1.00
0.10
-4
-6
100
PENDING
To Be Determined
10000
100000
100
0.1
-8
1000
Frequency (MHz)
10000
100000
10
0.1
-8
1000
Frequency (MHz)
0.10
0.01
100
1
-10
Capacitance (pF)
Capacitance (pF)
Capacitance (pF)
Capacitance (pF)
-10
0.01
-12
10
100
1000
Frequency (MHz)
10000
100000
-12
10
250.00
0.1
0.1
PENDING
Frequency (MHz)
100
PENDING
0.1
100
Capacitance (pF)
citance (pF)
To Be Determined
2500.00
10000
1000
Frequency (MHz)
100000
0.01
1.00
100
0
0.10
1.00
0
0.1
To Be Determined
Frequency (MHz)
0.01
100
1000
Frequency (MHz)
10000
0.01
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/16/15
1000
10000
0.01
0.10
100
F)
F)
PULSE-GUARD
®
ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Physical Specifications
Materials
Device Weight
Solderability
Soldering
Parameters
Body: Epoxy / Glass Substrate
Terminations: Cu/Ni/Sn
0.349 mg
MIL-STD-202, Method 208
Environmental Specifications
Operating Temperature
Biased Humidity:
Biased Heat:
Thermal Shock
-65°C to +125°C
40°C, 95% RH, 1000 hours
85°C, 1000 hours
MIL
-STD-202, Method 107
,
-65°C to 125°C, 30 min. cycle,
10 cycles
MIL
-STD-202, Method 201
Wave solder - 260°C, 10 seconds maximum
Reflow solder - 260°C, 30 seconds maximum
Vibration
Design Consideration
Because of the fast rise-time of the ESD transient,
proper placement of PULSE-GUARD
®
suppressors are
a key design consideration to achieving optimal ESD
suppression.
The devices should be placed on the circuit board as close
to the source of the ESD transient as possible. Install
PULSE-GUARD
®
suppressors (connected from signal/data
line to ground) directly behind the connector so that they
are the first board-level circuit component encountered by
the ESD transient.
Soldering Parameters
Chemical Resistance
Solder Leach Resistance and
Terminal Adhesion
MIL
-STD-202, Method 215
IPC/EIA J-STD-002
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
200°C
T
P
T
L
T
S(max)
Temperature
Ramp-up
t
P
t
L
Ramp-do
Ramp-down
Preheat
60 – 180 seconds
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260°C
10 – 30 seconds
6°C/second max
8 minutes max
T
S(min)
t
S
time to peak temperature
25
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Notes:
- PGB2 Series recommended for reflow soldering only
- Recommended profile based on IPC/JEDED J-STD-020C
- For recommended soldering pad layout dimensions,
please refer to Dimensions section of this data sheet
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/16/15
PULSE-GUARD
®
ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Packaging
Part Number
PGB2010201
Quantity &
Packaging Code
KR
Quantity
10000
Packaging Option
Tape & Reel (7” reel)
Packaging Specification
Carrier Tape: 8mm, paper
Reel: 7” (178mm) reel
Tape and Reel Specifications
4.000±0.100
Ø1.550±0.030
0.420±0.020
2.000±0.050
1.750±0.050
3.500±0.050
8.000
Bo
Description
A
0
- Pocket Width
B
0
- Pocket Height
K
0
- Pocket Depth
0201 Series
(mm)
0.360±0.020
0.680±0.020
0.300±0.020
Ko
Ao
2.000±0.050
Typical ESD Pulse Test Setup
FARADAY CAGE
COMPUTER
AGILENT INFINIIUM
1.5 GHz 8 GS/s
30dB PASTERNAK ATTENUATOR
PE7025-30
TEKTRONIX LOW CAP PROBE
6158 (20x TIP)
QUADTECH 1865
RESISTANCE METER
RESISTANCE
TEST FIXTURE
ESD TEST FIXTURE
TEST BOARD W/ DUT
ESD PULSE GENERATOR
Notes:
- QuadQuadTech 1865 High Resistance Meter: Measures insulation resistance values
- KeyTek MiniZap ESD simulator with IEC tip: Simulates 8kV, direct discharge ESD event per IEC 61000-4-2
- Faraday cage: Shields the acquisition equipment from the electromagnetic fields generated by the simulator
- Agilent 2.25 GHz 54846A Oscilloscope: Records the voltage waveform from the device under test
- Tektronix 6158 probe with 30dB attenuator: Transmits the waveform from the device to the oscilloscope
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/16/15
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