EMIF02-AV01F3
Dual audio and video line IPAD™, EMI filter and ESD protection
Features
■
■
■
■
■
■
■
■
■
High-density capacitor
EMI low-pass filter and ESD protection
High-efficiency in EMI filtering
Lead-free package
400 µm pitch
Very small PCB footprint: 0.77 mm x 1.17 mm
Very thin package: 0.605 mm
High reliability offered by monolithic integration
Reduction of parasitic elements thanks to CSP
integration
Figure 1.
Pin configuration (bump side
view)
1
2
A
B
C
Flip Chip
5 bumps
Complies with the following standards
■
IEC 61000-4-2 level 4
on
external pin (A2, C2)
– 15 kV (air discharge)
– 8 kV (contact discharge)
IEC 61000-4-2 level 1 on internal pin (A1, C1)
– 2 kV (air discharge)
– 2 kV (contact discharge)
Figure 2.
Schematic
R
A1
■
Application
■
A2
Dual audio and video line interface protection
and filtering in mobile phones
C
Description
The EMIF02-AV01F3 is a highly integrated array
designed to suppress EMI / RFI noise and provide
impedance matching for mobile phones and
portable applications.
The EMIF02-AV01F3 is in Flip-Chip package to
offer space saving and high RF performance.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
B2
Gnd
2 kV
15 kV
2 kV
15 kV
C
C1
R
C2
TM:
IPAD is a trademark of STMicroelectronics.
April 2010
Doc ID 12835 Rev 4
1/7
www.st.com
7
Characteristics
EMIF02-AV01F3
1
Characteristics
Table 1.
Symbol
Absolute maximum ratings (T
amb
= 25 °C)
Parameter
Internal pins (A1, C1)
ESD discharge IEC 61000-4-2, air discharge
ESD discharge IEC 61000-4-2, contact discharge
External pins (A2, C2)
ESD discharge IEC 61000-4-2, air discharge
ESD discharge IEC 61000-4-2, contact discharge
Maximum junction temperature
Total Power Dissipation
Operating temperature range
Storage temperature range
Value
Unit
V
pp
2
2
kV
15
8
125
200
- 40 to + 85
- 55 to 150
°C
mW
°C
°C
T
j
P
TOT
T
op
T
stg
Figure 3.
Electrical characteristics (definitions)
I
Symbol
V
BR
=
I
RM
=
V
RM
=
C
line
=
Parameter
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Line capacitance
V
BR
V
RM
I
R
I
RM
I
RM
I
R
V
RM
V
BR
V
Table 2.
Symbol
V
BR
I
RM
R
I/O
C
line
Electrical characteristics (values, T
amb
= 25 °C)
Test conditions
I
R
= 1 mA
V
RM
= 3 V per line
12
V
line
= 0 V, V
osc
= 30 mV, F = 100 kHz
2.56
15
3.2
Min.
14
Typ.
Max.
18
0.5
18
3.84
Unit
V
µA
Ω
nF
2/7
Doc ID 12835 Rev 4
EMIF02-AV01F3
Characteristics
Figure 4.
db
Attenuation simulation with
1 kΩ input and 10 kΩ ouput
Figure 5.
Analog crosstalk
dB
0.00
0
-10
-20
-10.00
50Ω measurements
-20.00
-30.00
-30
-40
-50
-60
-70
-80
10
100
1k
10k
100k
1M
10M
100M
1G
Input: 1 k
Ω
Output: 10 k
Ω
AC simulation
50Ω simulations
-40.00
-50.00
-60.00
-70.00
-80.00
-90.00
-100.00
1.0M
3.0M
10.0M
30.0M
100.0M
300.0M
1.0G
3.0G
F (Hz)
F (Hz)
Xtalk 1/2
Figure 6.
Digital crosstalk
Figure 7.
ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
(V
IN
) and one output (V
OUT
)
INPUT :
10 V/Div
100 ns/Div
Vin = 1 V/Div
A1-A2 line
C1
50 µs/Div
C1-C2 line
C2
Vout = 5 mV/Div
OUTPUT :
10 V/Div
100 ns/Div
50 µs/Div
Figure 8.
ESD response to IEC 61000-4-2
Figure 9.
(-15 kV air discharge) on one input
(V
IN
) and one output (V
OUT
)
INPUT :
10 V/Div
100 ns/Div
Line capacitance versus applied
voltage
C
LINE
(nF)
3.5
3.0
2.5
2.0
F=100 kHz
V
OSC
=30 mV
RMS
T
j
=25 °C
OUTPUT :
10 V/Div
100 ns/Div
1.5
1.0
0.5
V
LINE
(V)
0.0
0
1
2
3
4
5
6
Doc ID 12835 Rev 4
3/7
Ordering information scheme
EMIF02-AV01F3
2
Ordering information scheme
Figure 10. Ordering information scheme
EMIF
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
2 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: Lead-free, pitch = 400 µm, bump = 255 µm
yy
-
xx zz
Fx
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Figure 11. Package dimensions
400 µm ± 40
400 µm ± 40
605 µm ± 55
255 µm ± 40
185 µm
770 µm ± 30 µm
185 µm
4/7
Doc ID 12835 Rev 4
1170 µm ± 30 µm
EMIF02-AV01F3
Ordering information
Figure 12. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Figure 13. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
Solder stencil opening:
220 µm recommended
x x z
y ww
Figure 14. Flip Chip tape and reel specification
Ø 1.5 ± 0.1
Dot identifying Pin A1 location
4.0 ± 0.1
1.75 ± 0.1
3.5 ±- 0.1
8.0 ± 0.3
1.27
ST
E
xxz
yww
ST
E
xxz
yww
ST
E
xxz
yww
0.87
4.0 ± 0.1
0.69 ± 0.05
Note:
Note: More information is available in the application note:
AN2348:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
4
Ordering information
Table 3.
Ordering information
Marking
HH
Package
Flip Chip
Weight
1.4 mg
Base qty
5000
Delivery mode
Tape and reel 7”
Order code
EIMF02-AV01F3
Doc ID 12835 Rev 4
5/7
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