PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
PGB Series 0603 ESD Suppressor
Product Overview
PulseGuard ESD Suppressors help protect sensitive electronic
equipment against electrostatic discharge (ESD). They supplement the
on-chip protection of integrated circuitry and are best suited for low-
voltage, high-speed applications where low capacitance is important.
Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394
and InfiniBand
SM
can benefit from this new technology.
PulseGuard suppressors use polymer composite materials to
suppress fast-rising ESD transients (as specified in IEC 61000-4-2
and MIL-STD-883C).
Features
• Ultra-low capacitance
• Low leakage current
• Fast response time
• Single line of protection
• Bi-directional
• Withstands multiple ESD strikes
• Standard EIA SOCM-1608 package
• Compatible with pick-and-place processes
• Available in 1,000 and 5,000 piece reels (EIA-RS481)
Reference Dimensions:
1.60 (.063")
0.076 (.003") MIN
1.04
(.041") REF
0.787 (.031")
Typical Applications
• Servers
• Laptop/Desktop Computers
• Network Hardware
• Computer Peripherals
• Digital Cameras
• External Storage
3.05 (1.20")
0.254 (.010") MIN
0.356 (.014")
Reflow
Solder
0.508 (.020")
Wave
Solder
0.762 (.030")
3.30 (1.30")
Ordering Information
CATALOG NUMBER
PGB0010603MR
PGB0010603NR
PIECES PER REEL
1,000
5,000
1.27 (.050")
1.27 (.050")
0.762 (.030")
0.762 (.030")
Equivalent Circuit
1
2
Design Consideration
Because of the fast rise-time of the ESD transient, placement of
PulseGuard suppressors is a key design consideration. To achieve
optimal ESD suppression, the devices should be placed on the circuit
board as close to the source of the ESD transient as possible. Install
PulseGuard suppressors directly behind the connector so that they are
the first board-level circuit component encountered by the ESD transient.
They are connected from signal/data line to ground.
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PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
PGB Series 0603 ESD Suppressor
Electrical Characteristics
ESD Capability:
IEC 61000-4-2 Direct Discharge ....................................................8kV
IEC 61000-4-2 Air Discharge .......................................................15kV
Trigger Voltage
1
...................................................................1,000V, typical
Clamping Voltage
1
..................................................................150V, typical
Rated Voltage ........................................................................24VDC, max
Capacitance
2
................................................................................0.055 pF
Response Time
1
...............................................................................< 1 ns
Leakage Current
3
..............................................................................< 1nA
ESD Pulse Withstand
4
...........................................1,000 pulses, minimum
Notes:
1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct
discharge method.
2. Capacitance measured at 1MHZ.
3. Leakage current measured at 6VDC.
4. Pulse Withstand- some shifting in characteristics may occur when tested
over multiple pulses at a very rapid rate.
Capacitance vs. Frequency
70
** Note: 1,000 fF = 1 pF
Capacitance (fF)
60
50
40
0.5
1.0
1.5
2.0
4
Frequency (GHz)
PULSEGUARD
®
SUPPRESSORS
Carrier Tape Specifications
Parts are delivered on 7” (178mm) reel, paper carrier tape
Environmental Specifications
Operating Temperature
:
-65°C to +125°C.
Moisture Resistance, steady state:
MIL-STD-833, method 1004.7,
85% RH, 85°C, 1000hrs.
Thermal Shock:
MIL-STD-202, Method 107G, -65°C to 125°C,
30 min cycle, 10 cycles.
Vibration
:
MIL-STD-202F, Method 201A, (10 to 55 to 10Hz,
1 min. cycle, 2grs each in X-Y-Z)
Chemical Resistance:
ASTM D-543, 4hrs @ 40°C, 3 solutions (H2O,
detergent solution, defluxer)
Solder leach resistance and terminal adhesion:
Per EIA-576 test
T
t
D
d
+
+
D
s
+
+
T
w
P
d
+
+
+
+
P
h
C
t
P
s
P
w
Physical Specifications
Materials:
Body: Glass Epoxy
Terminations: Copper/Nickel/Tin/Lead
Solderability:
MIL-STD-202, Method 208 (95% coverage)
DESCRIPTION
C
t
- Cover tape thickness
D
d
- Drive hole diameter
D
s
- Drive hole spacing
P
d
- Pocket depth
P
h
- Pocket height
P
s
- Pocket spacing
P
w
- Pocket width
T
t
- Carrier tape thickness
T
w
- Carrier tape width
MEASUREMENT (MM)
0.06
1.50
4.00
0.58
1.85
4.00
1.02
0.65
8.00
Soldering Parameters:
Wave Solder – 260°C, 10 seconds maximum.
Reflow Solder – 260°C, 30 seconds maximum.
Packaging Specifications
8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per
reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR.
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