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5962-9318708H4X

产品描述SRAM Module, 128KX32, 25ns, CMOS, CHIP66, HERMETIC SEALED, CERAMIC, HIP-66
产品类别存储    存储   
文件大小157KB,共9页
制造商White Microelectronics
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5962-9318708H4X概述

SRAM Module, 128KX32, 25ns, CMOS, CHIP66, HERMETIC SEALED, CERAMIC, HIP-66

5962-9318708H4X规格参数

参数名称属性值
包装说明HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknown
最长访问时间25 ns
其他特性USER CONFIGURABLE AS 512K X 8
备用内存宽度16
JESD-30 代码S-CHIP-P66
内存密度4194304 bit
内存集成电路类型SRAM MODULE
内存宽度32
功能数量1
端子数量66
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织128KX32
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状SQUARE
封装形式IN-LINE
并行/串行PARALLEL
认证状态Not Qualified
筛选级别MIL-STD-883
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子形式PIN/PEG
端子位置HEX
Base Number Matches1

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WS128K32-XXX
HI-RELIABILITY PRODUCT
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
s
Access Times of 15, 17, 20, 25, 35, 45, 55ns
s
MIL-STD-883 Compliant Devices Available
s
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic
HIP (Package 400)
• 68 lead, 40mm CQFP (G4T), 3.56mm (0.140")
(Package 502).
• 68 lead, 22.4mm CQFP (G2T), 4.57mm (0.180"),
(Package 509)
• 68 lead, 22.4mm Low Profile CQFP (G1U), 3.57mm
(0.140"), (Package 519)
s
Organized as 128Kx32; User Configurable as 256Kx16
or 512Kx8
s
Low Power Data Retention - only available in G2T
package type
s
Commercial, Industrial and Military Temperature
Ranges
s
5 Volt Power Supply
s
Low Power CMOS
s
TTL Compatible Inputs and Outputs
s
Built in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
s
Weight:
WS128K32-XG1UX - 5 grams typical
WS128K32-XG2TX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
s
All devices are upgradeable to 512Kx32
FIG. 1
PIN CONFIGURATION FOR WS128K32N-XH1X
PIN DESCRIPTION
34
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
33
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
WE
1
CS
1
WE
2
CS
2
WE
3
CS
3
WE
4
CS
4
TOP VIEW
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
23
56
I/O
0-31
Data Inputs/Outputs
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
OE
A
0-16
128K x 8
128K x 8
I/O
22
I/O
21
I/O
20
66
128K x 8
128K x 8
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
January 2001 Rev. 7
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

 
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