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TDH35P25R0J

产品描述Thick Film Resistors - SMD 35watt 25ohm 5%
产品类别无源元件   
文件大小312KB,共2页
制造商Ohmite
官网地址https://www.ohmite.com
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TDH35P25R0J概述

Thick Film Resistors - SMD 35watt 25ohm 5%

TDH35P25R0J规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
Ohmite
产品种类
Product Category
Thick Film Resistors - SMD
RoHSNo -; RoHS Version Available
电阻
Resistance
25 Ohms
功率额定值
Power Rating
35 W
容差
Tolerance
5 %
温度系数
Temperature Coefficient
50 PPM / C
电压额定值
Voltage Rating
350 V
工作温度范围
Operating Temperature Range
- 55 C to + 150 C
类型
Type
High Power Resistor
FeaturesSMD - TO-220 package configurationration
高度
Height
4.5 mm
长度
Length
10.1 mm
封装 / 箱体
Package / Case
DPak-2
端接类型
Termination Style
SMD/SMT
宽度
Width
8.6 mm
最大工作温度
Maximum Operating Temperature
+ 150 C
最小工作温度
Minimum Operating Temperature
- 55 C
工厂包装数量
Factory Pack Quantity
10

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tDh series
35 Watt DPAK Package
Thick Film Power Surface Mount
Ohmite’s TDH resistor is an economi-
cal solution to intermediate power
application design requirements.
TDH’s reliable thick film on alumina
substrate construction can be easily
heat sinked for higher power perfor-
mance. TDH resistors are ideal for
pulse-loading, pre-charge, bleeder,
and snubber applications.
characteristics
Terminal
Copper
Terminal Plating
Lead Free Solder (97% Tin, 3% Silver)
Resistance Range
0.05Ω to 10KΩ other values on request
Tolerance
±1% to ±10% (0.5% on request)
Max. Operating Voltage
350V
Insulation Resistance
10GΩ min.
Power Rating
Depends upon case temperature. See der-
ating curve.
DPAK style power package for surface
mounting applications; 35W power rating
at 25°C case temperature.
Working Temperature
-55°C to +175°C
Range
Solder Process
The TDH35P cannot exceed 220°C (260°C
for the TDH35H) for more than 10 seconds
during soldering process.
Derating
100% @ 25°C to 0% @ 150°C curve refer-
enced to case temperature
Dielectric Strength
1,800VAC
Operating Temperature
-55°C to +150°C
Range
Temperature Coefficient
10Ω and above, ±50ppm/°C, referenced to
25°C, ∆R taken at +105°C. Between 1 and
10Ω, ±(100ppm+0.002Ω)/°C, referenced to
25°C, ∆R taken at +105°C. For under 10Ω:
0R6 - 9R9: 100PPM
0R4 - 0R59: 150PPM
0R2 - 0R39: 250PPM
0R1 - 0R19: 500PPM
0R05 - 0R09: 1000PPM
Inductance
less than 20 nanohenries
Flatness
less than 0.1mm tolerance
Soldering note:
During surface mount soldering the soldering
temperature profile must not cause the metal tab of this device to
exceed 220°C (260°C for the TDH35H)!
Test Condition
Load Life
MIL–R–39009, 2,000 hours
Moisture
MIL–Std–202, Method 106
Resistance
Short Time
2 times rated power with
Overload
applied voltage not to exceed
1.5 times maximum continu-
ous operating voltage for 5
seconds
Thermal Shock
MIL–Std–202, Method 107,
Cond. F
Terminal
MIL–Std–202, Method 211,
Strength
Cond. A (Pull Test) 2.4N
Vibration, High
MIL-Std-202, Method 204,
Frequency
Cond. D
Result
∆R ±(1.0%
+0.01Ω)
∆R =(0.5%
+0.01Ω) max.
∆R ±(0.3%
+0.01Ω) max.
F e at u r e s
• 35 Watt power rating at 25°C
• SMD - DPAK package configu-
ration
• Heat resistance to cooling
plate: Rth <4.28°C/W
• A molded case for environ-
mental protection.
• Resistor element is electrically
insulated from the metal sink
tab.
∆R =(0.3%
+0.01Ω) max.
∆R =(0.2%
+0.01Ω) max.
ΔR =(0.2%
+0.01Ω) max.
Derating
100
80
60
40
20
0
0
25
50
75
100
125
150
Bottom of base plate Temperature,
°C
175
35
28
21
14
7
0
Rated Power, W
Percent Rated Power
Derating (thermal resistance): 0.23W/°C (4.28°C/W). The
case temperature is to be used for purposes of establishing
the applied power limit. The case temperature measurement
must be made with a thermocouple contacting the center of
the component mounted on the designed heat sink. Thermal
grease should be applied propperly.
(continued)
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
37

 
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