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SMDIG02330V100MS00

产品描述Film Capacitor, Polyphenylene Sulphide, 400V, 20% +Tol, 20% -Tol, 0.033uF, Surface Mount, 5040, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小171KB,共7页
制造商WIMA
官网地址https://www.wima.de/
标准
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SMDIG02330V100MS00概述

Film Capacitor, Polyphenylene Sulphide, 400V, 20% +Tol, 20% -Tol, 0.033uF, Surface Mount, 5040, CHIP, ROHS COMPLIANT

SMDIG02330V100MS00规格参数

参数名称属性值
是否Rohs认证符合
Objectid1773901485
包装说明, 5040
Reach Compliance Codeunknown
ECCN代码EAR99
YTEOL0
其他特性RATED AC VOLTAGE(V) : 200
电容0.033 µF
电容器类型FILM CAPACITOR
介电材料POLYPHENYLENE SULPHIDE
高度6 mm
JESD-609代码e3
长度12.7 mm
制造商序列号SMD-PPS
安装特点SURFACE MOUNT
负容差20%
端子数量2
最高工作温度100 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法BULK
正容差20%
额定(AC)电压(URac)200 V
额定(直流)电压(URdc)400 V
系列SMD-PPS
尺寸代码5040
表面贴装YES
端子面层Tin (Sn)
端子形状WRAPAROUND
宽度10.2 mm

文档预览

下载PDF文档
WIMA SMD-PPS
Metallized Polyphenylene-Sulphide (PPS) SMD Film Capacitors with
Box Encapsulation. Capacitances from 0.01
mF
to 2.2
mF.
Rated Voltages from 63 VDC to 1000 VDC. Size Codes from 1812 to 6054.
Special Features
˜
Size codes 1812, 2220, 2824,
4030,5040 and 6054 with PPS
and encapsulated
˜
Operating temperature up to 140° C
˜
Self-healing
˜
Suitable for lead-free soldering
˜
Low dissipation factor
˜
Low dielectric absorption
˜
Very constant capacitance value
versus temperature
˜
According to RoHS 2011/65/EU
D
Electrical Data
Capacitance range:
0.01
m
F to 2.2
m
F
Rated voltages:
63 VDC, 100 VDC, 250 VDC, 400 VDC,
630 VDC, 1000 VDC
Capacitance tolerances:
±20%, ±10% (±5% available subject
to special enquiry)
Operating temperature range:
–55) C to +140) C
Climatic test category:
55/140/56 in accordance with IEC
Insulation resistance
at +20+ C:
U
r
U
test
C
0.33
mF
1 x 10
4
(mean value: 3 x 10
4
M¸)
3 x 10
4
(mean value: 6 x 10
4
M¸)
63 VDC 50 V
100 VDC 100 V
250 VDC 100 V
Test voltage:
1.6 U
r
, 2 sec.
Voltage derating:
For DC and AC voltages a voltage
derating factor of 1% per K must be
applied from +100+ C and of 2% per K
from +125+ C.
Reliability:
Operational life
300 000 hours
Failure rate
2 fit (0.5 x U
r
and 40+ C)
Typical Applications
For general applications in high
temperature circuits e.g.
˜
By-pass
˜
Blocking
˜
Coupling and decoupling
˜
Timing
˜
Filtering
˜
Oscillating circuits
0.33
mF
< C
2.2
mF
3000 sec (M¸ x
mF)
(mean value: 6000 sec)
6000 sec (M¸ x
mF)
(mean value: 12 000 sec)
Measuring time: 1 min.
Dissipation factors
at +20) C: tan
d
at f
1 kHz
10 kHz
100 kHz
C
0.1
mF
15 x 10
-4
20 x 10
-4
50 x 10
-4
0.1
mF
< C
1.0
mF
20 x 10
-4
25 x 10
-4
C > 1.0
mF
20 x 10
-4
Construction
Dielectric:
Polyphenylene-sulphide (PPS) film
Capacitor electrodes:
Vacuum-deposited
Internal construction:
Maximum pulse rise time:
for pulses equal to the rated voltage
Capacitance
m
F
0.01
0.033
0.1
0.33
1.0
...
...
...
...
...
0.022
0.068
0.22
0.68
2.2
Pulse rise time V/
m
sec
max. operation/test
100 VDC 250 VDC 400 VDC
25/250
15/150
10/100
5/50
3/30
30/300
20/200
12/120
6/60
35/350
25/250
15/150
8/80
63 VDC
25/250
15/150
10/100
5/50
3/30
630 VDC 1000 VDC
40/400
28/280
45/450
32/320
Plastic film
Vacuum-deposited
electrode
Metal contact layer
(schoopage)
Terminating plate
Dip Solder Test/Processing
Resistance to soldering heat:
Test Tb in accordance with DIN IEC
60068-2-58/DIN EN 60384-20.
Soldering bath temperature max. 260+ C.
Soldering duration max. 5 sec.
Change in capacitance
D
C/C
5 %.
Soldering process:
Re-flow soldering (see temperature/time
graphs page 13).
Packing
Available taped and reeled in blister pack.
Detailed taping information and graphs
at the end of the catalogue.
For further details and graphs please
refer to Technical Information.
Encapsulation:
Solvent-resistant, flame-retardant plastic
case, UL 94 V-0
Terminations:
Tinned plates.
Marking:
Box colour: Black.
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