Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric,
10 – 50 VDC (Commercial & Automotive Grade)
Overview
KEMET Power Solutions High Temperature (KPS HT)
stacked capacitors utilize a proprietary lead-frame
technology to vertically stack one or two multilayer
ceramic chip capacitors into a single compact surface
mount package. The attached lead-frame mechanically
isolates the capacitor(s) from the printed circuit board,
thereby offering advanced mechanical and thermal stress
performance. Isolation also addresses concerns for
audible, microphonic noise that may occur when a bias
voltage is applied. A two-chip stack offers up to double
the capacitance in the same or smaller design footprint
when compared to traditional surface mount MLCC
devices. Providing up to 10 mm of board flex capability,
KPS Series capacitors are environmentally friendly and
in compliance with RoHS legislation. Combined with X8L
dielectric, these devices are capable of reliable operation up
to 150°C and are well suited for high temperature filtering,
bypass and decoupling applications.
X8L exhibits a predictable change in capacitance with
respect to time and voltage, and boasts a minimal change in
capacitance with reference to ambient temperature up to 125°C.
Beyond 125°C, X8L displays a wider variation in capacitance.
Capacitance change is limited to ±15% from −55°C to +125°C and
+15, −40% from 125°C to 150°C.
In addition to Commercial grade, Automotive grade devices
are available and meet the demanding Automotive Electronics
Council's AEC-Q200 qualification requirements.
Benefits
•
•
•
•
•
•
•
•
•
•
−55°C to +150°C operating temperature range
Reliable and robust termination system
EIA 1210 and 2220 case sizes
DC voltage ratings of 10 V, 16 V, 25 V, and 50 V
Capacitance offerings ranging from 0.47 μF up to 47 μF
Available capacitance tolerances of ±10% and ±20%
Higher capacitance in the same footprint
Potential board space savings
Advanced protection against thermal and mechanical stress
Provides up to 10 mm of board flex capability
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Ordering Information
C
2220
C
476
Capacitance
Code (pF)
Two significant
digits +
number of
zeros.
M
8
N
Dielectric
N = X8L
2
FailureRate/
Design
1 = KPS Single
Chip Stack
2 = KPS Double
Chip Stack
C
Leadframe Finish
2
C = 100% Matte Sn
7186
Packaging/Grade
(C-Spec)
See “Packaging
C-Spec Ordering
Options Table”
below
Case Size
Specification/
Ceramic
(L"x W")
Series
1210
2220
C = Standard
Rated
Capacitance
Voltage
Tolerance
1
(VDC)
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance.
Single chip stacks ("1" in the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances.
2
Additional leadframe finish options may be available. Contact KEMET for details.
1
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 1/9/2017
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type
1
Commercial Grade
7" Reel (Embossed Plastic Tape)/Unmarked
13" Reel (Embossed Plastic Tape)/Unmarked
7186
7289
AUTO
AUTO7289
Packaging/Grade
Ordering Code (C-Spec)
2
Automotive Grade
7" Reel (Embossed Plastic Tape)/Unmarked
13" Reel (Embossed Plastic Tape)/Unmarked
1
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".
2
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
Benefits cont'd
•
•
•
•
Reduces audible, microphonic noise
Extremely low ESR and ESL
Lead (Pb)-free, RoHS and REACH compliant
Capable of Pb-free reflow profiles
• Non-polar device, minimizing installation concerns
• Tantalum and electrolytic alternative
• Commercial and Automotive (AEC-Q200) grades available
Applications
Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction
(piezoelectric/mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits
without (integrated) current limitation and any application that is subject to extreme environments such as high temperature,
high levels of board flexure and/or temperature cycling. Markets include industrial, aerospace, automotive, and telecom.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 1/9/2017
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,
“AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive
grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review
by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers
and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are
limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
KEMET assigned
1
AUTO
1
Customer Notification due to:
Process/Product change
Yes (with approval and sign off)
Yes (without approval)
Obsolescence*
Yes
Yes
Days prior to
implementation
180 days Minimum
90 days Minimum
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly
understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
KEMET Automotive
C-Spec
KEMET assigned
1
AUTO
1
PPAP (Product Part Approval Process) Level
1
●
○
2
●
3
●
○
4
●
5
●
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
●
Part Number specific PPAP available
○
Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 1/9/2017
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
TOP VIEW
Single or Double Chip Stack
Double Chip Stack
PROFILE VIEW
Single Chip Stack
L
L
W
H
H
LW
LW
Chip
Stack
Single
EIA
Size Code
1210
2220
1210
2220
Metric Size
Code
3225
5650
3225
5650
L
Length
3.50 (0.138)
±0.30 (0.012)
6.00 (0.236)
±0.50 (0.020)
3.50 (0.138)
±0.30 (0.012)
6.00 (0.236)
±0.50 (0.020)
W
Width
2.60 (0.102)
±0.30 (0.012)
5.00 (0.197)
±0.50 (0.020)
2.60 (0.102)
±0.30 (0.012)
5.00 (0.197)
±0.50 (0.020)
H
Height
3.35 (0.132)
±0.10 (0.004)
3.50 (0.138)
±0.30 (0.012)
6.15 (0.242)
±0.15 (0.006)
5.00 (0.197)
±0.50 (0.020)
LW
Lead Width
0.80 (0.032)
±0.15 (0.006)
1.60 (0.063)
±0.30 (0.012)
0.80 (0.031)
±0.15 (0.006)
1.60 (0.063)
±0.30 (0.012)
Mounting
Technique
Solder Reflow
Only
Double
Electrical Parameters/Characteristics
Item
Operating Temperature Range
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
1
Parameters/Characteristics
−55°C to +150°C
±15% (−55ºC to 125ºC), +15, −40% (125ºC to 150ºC)
3.0%
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50 mA)
3.5% ( ≤ 16V) and 2.5% ( ≥ 25V)
500 megohm microfarads or 10 GΩ
(Rated voltage applied for 120±5 seconds at 25°C)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
2
Dielectric Withstanding Voltage (DWV)
3
Dissipation Factor (DF) Maximum Limit at 25°C
4
Insulation Resistance (IR) Minimum Limit at 25°C
Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3
Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤ 10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance > 10µF
4
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
1
2
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 1/9/2017
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
X8L
Rated DC
Voltage
≥ 25
≤ 16
Capacitance
Value
All
Dissipation Factor
(Maximum %)
3.0
5.0
Capacitance
Shift
±20%
Insulation
Resistance
10% of Initial
Limit
Table 1 – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
Cap
Code
Case Size/
Series
Voltage Code
Rated Voltage (VDC)
Capacitance
Tolerance
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Rated Voltage (VDC)
Voltage Code
8
10
4
16
C1210C
3
25
5
50
1
100
A
250
4
16
3
25
C1812C
5
50
1
100
A
250
8
10
4
16
C2220C
3
25
5
50
1
100
A
250
Capacitance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
0.47 µF
1.0 µF
2.2 µF
3.3 µF
4.7 µF
10 µF
15 µF
22 µF
1.0 µF
2.2 µF
3.3 µF
4.7 µF
10 µF
22 µF
33 µF
47 µF
474
105
225
335
475
106
156
226
105
225
335
475
106
226
336
476
Single Chip Stack
FV
FV
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
Double Chip Stack
FW
FW
GR
GR
GR
JR
JR
JR
JR
JR
1
100
A
250
10
8
JR
JR
JR
JR
JR
JR
Capacitance
Cap
Code
10
8
16
4
25
3
50
5
100
1
250
A
4
16
3
25
5
50
16
4
25
3
50
5
100
1
250
A
Case Size/
Series
C1210C
C1812C
C2220C
These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts.
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
FV
FW
GR
JP
JR
Case
Size
1210
1210
1812
2220
2220
Thickness ±
Range (mm)
3.35 ± 0.10
6.15 ± 0.15
5.00 ± 0.50
3.50 ± 0.30
5.00 ± 0.50
Paper Quantity
7" Reel
0
0
0
0
0
Plastic Quantity
7" Reel
600
300
400
300
200
13" Reel
0
0
0
0
0
13" Reel
2,000
1,000
1,700
1,300
800
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 1/9/2017
5
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