5962-8606305XA概述

UVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28

5962-8606305XA规格参数

参数名称	属性值
是否Rohs认证	不符合
包装说明	CERAMIC, DIP-28
Reach Compliance Code	unknown
最长访问时间	150 ns
I/O 类型	COMMON
JESD-30 代码	R-GDIP-T28
JESD-609代码	e0
长度	37.215 mm
内存密度	262144 bit
内存集成电路类型	UVPROM
内存宽度	8
功能数量	1
端子数量	28
字数	32768 words
字数代码	32000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	32KX8
输出特性	3-STATE
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装等效代码	DIP28,.6
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
编程电压	12.5 V
认证状态	Not Qualified
筛选级别	MIL-STD-883
座面最大高度	5.72 mm
最大待机电流	0.0003 A
最大压摆率	0.05 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子面层	Tin/Lead (Sn/Pb) - hot dipped
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	15.24 mm
Base Number Matches	1

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5962-8606305XA相似产品对比

	5962-8606305XA	5962-8606301XA	5962-8606306XA	5962-8606306YX	5962-8606305UX	5962-8606306XX	5962-8606306UA	5962-8606305UA
描述	UVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28	UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28	UVPROM, 32KX8, 120ns, CMOS, CQCC32, WINDOWED, CERAMIC, LLCC-32	UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, THIN, CERDIP-28	UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, THIN, CERDIP-28	UVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28
包装说明	CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERDIP-28	CERAMIC, DIP-28	WINDOWED, CERAMIC, LLCC-32	0.300 INCH, WINDOWED, THIN, CERDIP-28	0.600 INCH, WINDOWED, CERDIP-28	0.300 INCH, WINDOWED, THIN, CERDIP-28	CERAMIC, DIP-28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	150 ns	200 ns	120 ns	120 ns	150 ns	120 ns	120 ns	150 ns
JESD-30 代码	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
长度	37.215 mm	37.215 mm	37.215 mm	13.97 mm	37.085 mm	37.215 mm	37.085 mm	37.085 mm
内存密度	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
内存集成电路类型	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端子数量	28	28	28	32	28	28	28	28
字数	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
字数代码	32000	32000	32000	32000	32000	32000	32000	32000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
封装代码	DIP	WDIP	DIP	WQCCN	WDIP	WDIP	WDIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE, WINDOW	IN-LINE	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.72 mm	5.72 mm	5.72 mm	3.3 mm	5.08 mm	5.72 mm	5.08 mm	5.08 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	YES	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
宽度	15.24 mm	15.24 mm	15.24 mm	11.43 mm	7.62 mm	15.24 mm	7.62 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1	1	1
JESD-609代码	e0	e0	e0	-	-	-	e0	e0
输出特性	3-STATE	3-STATE	3-STATE	-	-	-	3-STATE	3-STATE
端子面层	Tin/Lead (Sn/Pb) - hot dipped	TIN LEAD	Tin/Lead (Sn/Pb) - hot dipped	-	-	-	TIN LEAD	Tin/Lead (Sn/Pb) - hot dipped
厂商名称	-	-	Waferscale Integration Inc	Waferscale Integration Inc	Waferscale Integration Inc	Waferscale Integration Inc	Waferscale Integration Inc	Waferscale Integration Inc

5962-8606305XA

5962-8606305XA概述

5962-8606305XA规格参数

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5962-8606305XA相似产品对比

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