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CY7C164-15VC

产品描述16K X 4 STANDARD SRAM, 20 ns, PDIP22
产品类别存储   
文件大小170KB,共9页
制造商Cypress(赛普拉斯)
下载文档 详细参数 选型对比 全文预览

CY7C164-15VC概述

16K X 4 STANDARD SRAM, 20 ns, PDIP22

CY7C164-15VC规格参数

参数名称属性值
功能数量1
端子数量22
最大工作温度70 Cel
最小工作温度0.0 Cel
最大供电/工作电压5.5 V
最小供电/工作电压4.5 V
额定供电电压5 V
最大存取时间20 ns
加工封装描述0.300 INCH, PLASTIC, DIP-22
状态ACTIVE
工艺CMOS
包装形状RECTANGULAR
包装尺寸IN-LINE
端子形式THROUGH-HOLE
端子间距2.54 mm
端子涂层TIN LEAD
端子位置DUAL
包装材料PLASTIC/EPOXY
温度等级COMMERCIAL
内存宽度4
组织16K X 4
存储密度65536 deg
操作模式ASYNCHRONOUS
位数16384 words
位数16K
内存IC类型STANDARD SRAM
串行并行PARALLEL

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66
CY7C164
CY7C166
16K x 4 Static RAM
Features
High speed
— 15 ns
Output enable (OE) feature (CY7C166)
CMOS for optimum speed/power
Low active power
— 633 mW
Low standby power
— 110 mW
TTL-compatible inputs and outputs
Automatic power-down when deselected
three-state drivers. The CY7C166 has an active LOW Output
Enable (OE) feature. Both devices have an automatic power-
down feature, reducing the power consumption by 65% when
deselected.
Writing to the device is accomplished when the Chip Enable
(CE) and Write Enable (WE) inputs are both LOW (and the
Output Enable (OE) is LOW for the CY7C166). Data on the
four input/output pins (I/O
0
through I/O
3
) is written into the
memory location specified on the address pins (A
0
through
A
13
).
Reading the device is accomplished by taking Chip Enable
(CE) LOW (and OE LOW for CY7C166), while Write Enable
(WE) remains HIGH. Under these conditions the contents of
the memory location specified on the address pins will appear
on the four data I/O pins.
The I/O pins stay in a high-impedance state when Chip Enable
(CE) is HIGH (or Output Enable (OE) is HIGH for CY7C166).
A die coat is used to insure alpha immunity.
Functional Description
The CY7C164 and CY7C166 are high-performance CMOS
static RAMs organized as 16,384 by 4 bits. Easy memory ex-
pansion is provided by an active LOW Chip Enable (CE) and
Logic Block Diagram
Pin Configurations
DIP
Top View
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
CE
GND
1
2
3
4
5
6 7C164
7
8
9
10
11
22
21
20
19
18
17
16
15
14
13
12
V
CC
A
4
A
3
A
2
A
1
A
0
I/O
3
I/O
2
I/O
1
I/O
0
WE
C164–3
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
CE
NC
GND
SOJ
Top View
1
2
3
4
5
6 7C164
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
V
CC
A
4
A
3
A
2
A
1
A
0
NC
I/O
3
I/O
2
I/O
1
I/O
0
WE
C164–2
INPUT BUFFER
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
ROW DECODER
I/O
3
I/O
2
I/O
1
I/O
0
SENSE AMPS
256 x 64 x 4
ARRAY
DIP/SOJ
Top View
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
CE
OE
GND
1
24
2
23
3
22
4
21
5
20
6 7C166 19
18
7
17
8
9
16
10
15
11
14
12
13
V
CC
A
4
A
3
A
2
A
1
A
0
NC
I/O
3
I/O
2
I/O
1
I/O
0
WE
C166–1
COLUMN
DECODER
A
0
A
9
A
10
A
11
A
12
A
13
POWER
DOWN
CE
WE
(OE)
(7C166 ONLY)
C164–4
]
Selection Guide
7C164-15
7C166-15
Maximum Access Time (ns)
Maximum Operating Current (mA)
Maximum Standby Current (mA)
15
115
20
7C164-20
7C166-20
20
115
20
7C164-25
7C166-25
25
105
20
7C164-35
7C166-35
35
105
20
Cypress Semiconductor Corporation
Document #: 38-05025 Rev. **
3901 North First Street
San Jose
CA 95134 • 408-943-2600
Revised August 24, 2001

CY7C164-15VC相似产品对比

CY7C164-15VC CY7C164-20PC CY7C164-20VC CY7C164-25VC CY7C164-35PC CY7C166-15PC CY7C166-20PC CY7C166-20VC CY7C166-25PC CY7C166-35PC
描述 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22 16K X 4 STANDARD SRAM, 20 ns, PDIP22
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 22 22 22 22 22 22 22 22 22 22
最大工作温度 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel
最小工作温度 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel
最大供电/工作电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电/工作电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
额定供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
最大存取时间 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns
加工封装描述 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22 0.300 INCH, PLASTIC, DIP-22
状态 ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
工艺 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
包装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
包装尺寸 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子间距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子涂层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
包装材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
内存宽度 4 4 4 4 4 4 4 4 4 4
组织 16K X 4 16K X 4 16K X 4 16K X 4 16K X 4 16K X 4 16K X 4 16K X 4 16K X 4 16K X 4
存储密度 65536 deg 65536 deg 65536 deg 65536 deg 65536 deg 65536 deg 65536 deg 65536 deg 65536 deg 65536 deg
操作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
内存IC类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
串行并行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
位数 16K 16K 16K 16K 16K 16K 16K 16K 16K 16K

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