电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1210Y223JARACTU

产品描述Multilayer Ceramic Capacitors MLCC - SMD/SMT 250volts 22000pF 5% X7R
产品类别无源元件   
文件大小2MB,共21页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1210Y223JARACTU在线购买

供应商 器件名称 价格 最低购买 库存  
C1210Y223JARACTU - - 点击查看 点击购买

C1210Y223JARACTU概述

Multilayer Ceramic Capacitors MLCC - SMD/SMT 250volts 22000pF 5% X7R

C1210Y223JARACTU规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
KEMET(基美)
产品种类
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHSDetails
电容
Capacitance
0.022 uF
电压额定值 DC
Voltage Rating DC
250 VDC
电介质
Dielectric
X7R
容差
Tolerance
5 %
外壳代码 - in
Case Code - in
1210
外壳代码 - mm
Case Code - mm
3225
最大工作温度
Maximum Operating Temperature
+ 125 C
最小工作温度
Minimum Operating Temperature
- 55 C
终端
Termination
Flexible (Soft)
产品
Product
Open Mode/Fail-Safe MLCC
系列
Packaging
Reel
封装 / 箱体
Package / Case
1210 (3225 metric)
端接类型
Termination Style
SMD/SMT
电容-nF
Capacitance - nF
22 nF
电容-pF
Capacitance - pF
22000 pF
工厂包装数量
Factory Pack Quantity
4000
单位重量
Unit Weight
0.000564 oz

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination
System (FF-CAP), X7R Dielectric, 6.3 – 250 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Floating Electrode with Flexible Termination
capacitor (FF-CAP) combines two existing KEMET
technologies– Floating Electrode and Flexible Termination.
The floating electrode component utilizes a cascading
internal electrode design configured to form multiple
capacitors in series within a single monolithic structure.
This unique configuration results in enhanced voltage and
ESD performance over standard capacitor designs while
allowing for a fail-open condition if mechanically damaged
(cracked). The flexible termination component utilizes a
conductive silver epoxy between the base metal and nickel
barrier layers of KEMET’s standard termination system
in order to establish pliability while maintaining terminal
strength, solderability and electrical performance. Both
technologies address the primary failure mode of MLCCs–
flex cracks, which are typically the result of excessive
tensile and shear stresses produced during board flexure
and thermal cycling.
Although neither technology can eliminate the potential for
mechanical damage that may propagate during extreme
environmental and/or handling conditions, the combination
of these two technologies provide the ultimate level of
protection against a low IR or short circuit condition.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
The FF-CAP complements KEMET’s Open Mode, Floating
Electrode (FE-CAP), Flexible Termination (FT-CAP) and KEMET
Power Solutions (KPS) product lines by providing an ultimate
fail-safe design optimized for low to mid range capacitance
values. These devices exhibit a predictable change in
capacitance with respect to time and voltage and boast a
minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from
−55°C to +125°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Ordering Information
C
Ceramic
0805
Y
104
Capacitance
Code (pF)
Two significant
digits + number
of zeros
K
5
R
A
C
TU
Case Size Specification/
(L" x W")
Series
0603
0805
1206
1210
1812
Y = Floating
Electrode
with
Flexible
Termination
Failure Rate/
Capacitance Rated Voltage
Packaging/
Termination Finish
1
Dielectric
Design
Tolerance
(VDC)
Grade (C-Spec)
J = ±5%
K = ±10%
M = ±20%
9 = 6.3
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
R = X7R
A = N/A
C = 100% Matte Sn
L = SnPb (5% Pb
minimum)
See
"Packaging
C-Spec
Ordering
Options
Table" below
Additional termination finish options may be available. Contact KEMET for details.
1
SnPb termination finish option is not available on automotive grade product.
1
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 11/29/2017
1
atmel zigbee协议栈移植(zigduino开发板)
刚接触zigbee,用的板子是zigduino开发板,MCU型号是Atmel公司的Atmega128RFA1,想移植zigbee协议栈上去,但不知道从何下手。 看了开发板的用户手册,支持atmel的bitCloud SDK,看了相关资料, ......
sumi123 无线连接
市面上现在热销的P10_16X32LED点阵原理图,独家放送!
市面上现在热销的P10_16X32LED点阵原理图,独家放送!由于厂家保密不给原理图和源程序,为了方便自己和大家手工制作,熬夜绘制的详细原理图,麻烦大虾编个显示汉字的程序给我, 不胜感激! ......
ylyfxzsxyl 单片机
功率因素与视在功率与无用功功率区别
无论是LED、萤光灯还是白炽灯具,我们都要了解其中的一个重要参数——功率因素(PFC),下我们来了解下什么是功率因素。1、功率因素功率因数表征着灯具输出有功功率的能力。功率是能量的传输率 ......
czf0408 LED专区
分享几篇deyisupport中不错的内容(有福利哦!)
一大波汽车抬头显示正在逼近 在驾车过程中调节空调温度或切换电台频道是常有的事,然而有时却因为需要时刻掌握方向盘而手忙脚乱,虽然我们中的很多人对这种情况都早已司空见惯,然而,驾驶员注 ......
eric_wang TI技术论坛
新手求wifi开发的步骤
我是新手刚刚开始实习,要学着用SPI协议,开发wifi。 其实代码是别人已经写好的,可惜我没学过任何有关嵌入式开发的东西(之前都是学桌面应用程序开发的) 在WM系统下的,AKU是6.1的。 希望前 ......
carmack 嵌入式系统
C6000 DSP代码在线编译问题
当前ARM处理器性能日益增强,在很多应用中系统中会有ARM+DSP的方案。本文提出一种新思路,通过ARM来在线编译DSP的代码,在线下载DSP的程序,并启动DSP运行。这种方法可以带来以下好处: ......
Jacktang DSP 与 ARM 处理器

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2928  1179  1983  2253  2741  55  25  24  31  45 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved