REVISIONS
LTR
A
B
DESCRIPTION
Added device type 05. Added case outlines M, N, 4, 5, 6, 7, and 8.
Added vendor cage code 88379.
Figure 1; For case outlines 5, 6, 7 and 8 changed dimension D3 min
and max from 1.030 and 1.040 inches to 1.020 and 1.060 inches.
Changed dimension A min from .156 inches to .135 inches. Changed
dimension L min from .145 inches to .132 inches. -sld
Added case outline 9. Figure 1; changed case outline M to be either
a single or dual cavity package. Figure 1; changed the dimension A2
max limit from .015 inches to .025 inches for case outline M. Added
thermal resistance ratings for all case outlines to paragraph 1.3 .
Added vendor cage 88379 for case outline M, device types 01
through 05. Table I; changed I
OL
from 12.0 mA to 8.0 mA for the V
OL
test. -sld
Added vendor cage code 0EU86 for device types 01 through 05, case
outline N. Drawing updated to reflect current requirements. -sld
Added case outline A. -sld
Added case outline B. Added note to paragraph 1.2.4. -sld
DATE (YR-MO-DA)
96-08-30
98-06-25
APPROVED
K. A. Cottongim
K.A. Cottongim
C
00-06-20
Raymond Monnin
D
E
F
03-01-13
03-02-21
03-11-10
Raymond Monnin
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
F
35
F
15
F
16
F
17
F
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
F
19
F
20
F
21
F
1
F
22
F
2
F
23
F
3
F
24
F
4
F
25
F
5
F
26
F
6
F
27
F
7
F
28
F
8
F
29
F
9
F
30
F
10
F
31
F
11
F
32
F
12
F
33
F
13
F
34
F
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
Kendall A. Cottongim
DRAWING APPROVAL DATE
94-12-16
MICROCIRCUIT, HYBRID, DIGITAL, FLASH
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY, 128K x 32-BIT
SIZE
A
SHEET
CAGE CODE
REVISION LEVEL
F
67268
1 OF
35
5962-94716
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E013-04
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
Generic number
F128K32-150
F128K32-120
F128K32-090
F128K32-070
F128K32-060
Circuit function
EPROM, FLASH, 128K x 32-bit
EPROM, FLASH, 128K x 32-bit
EPROM, FLASH, 128K x 32-bit
EPROM, FLASH, 128K x 32-bit
EPROM ,FLASH, 128K x 32-bit
Access time
150 ns
120 ns
90 ns
70 ns
60 ns
94716
01
Device
type
(see 1.2.2)
/
H
Device
class
designator
(see 1.2.3)
A
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
G
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
E
D
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
F
5962-94716
SHEET
2
DSCC FORM 2234
APR 97
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
A
B
M 1/
N
S
T
U
V
W
X
Y
Z
4
5
6
7
8
9 1/
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
68
68
66
66
66
66
66
66
66
66
66
66
66
66
66
68
Package style
Co-fired ceramic, single cavity, quad flat pack
Co-fired ceramic, single cavity, quad flat pack
Co-fired ceramic, single/dual cavity, quad flatpack, lead formed
Co-fired ceramic, single cavity, quad flatpack, lead formed
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cacvity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Ceramic, single cavity, quad flat pack
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
1.075", hex-in-line, single cavity, with standoffs
Co-fired ceramic, single cavity, ultra low profile, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage range (V
CC
) 3/...................................................
Signal voltage range (any pin except A9 ) 3/............................
Power dissipation (P
D
)...............................................................
Thermal resistance, junction-to-case (θ
JC
):
Case outline M .......................................................................
Case outline A and N .............................................................
Case outline 4 ........................................................................
Case outlines B and 9............................................................
Case outlines 5, 6, 7, and 8 ...................................................
Case outlines S, T, U, V, W, X, Y, and Z ...............................
Storage temperature range .......................................................
Lead temperature (soldering, 10 seconds)................................
Data retention ............................................................................
Endurance (write/erase cycles) .................................................
A9 voltage for sector protect (V
ID
) 4/ ........................................
1/
2/
3/
-2.0 V dc to +7.0 V dc
-2.0 V dc to +7.0 V dc
1.1 W
11.3°C/W
9°C/W
4.07°C/W
4.57°C/W
13.13°C/W
10.63°C/W
-65°C to +150°C
+300°C
10 years minimum
10,000 cycles minimum
-2.0 V dc to +14.0 V dc
Due to the short leads of case outlines M (single cavity) and case outline 9, caution should be taken if the system
application is to be used where extreme thermal transitions can occur. Case outline A can be used if longer leads are
necessary.
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Minimum DC voltage on input or I/O pins is -0.5 V dc. During voltage transitions, input may overshoot V
to -2.0 V dc for
SS
periods of up to 20 ns. Maximum DC voltage on output and I/O pins is V
may overshoot to V
4/
CC
CC
+ 0.5 V dc. During voltage transitions, outputs
to -2.0 V dc for
+ 2.0 V dc for periods of up to 20 ns.
SS
Minimum DC input voltage on A9 pin is -0.5 V dc. During voltage transitions, A9 may overshoot V
periods of up to 20 ns. Maximum DC input voltage on A9 is +13.5 V dc which may overshoot to +14.0 V dc for periods of
up to 20 ns.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
F
5962-94716
SHEET
3
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)........................................................
Input low voltage range (V
IL
)......................................................
Input high voltage range (V
IH
)....................................................
Case operating temperature range (T
C
) ....................................
A9 voltage for sector protect (V
ID
) .............................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to V
CC
+ 0.3 V dc
-55°C to +125°C
+11.5 V dc to +12.5 V dc
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
F
5962-94716
SHEET
4
DSCC FORM 2234
APR 97
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, and 6 .
3.2.5 Block diagram. The block diagram shall be as specified on figure 7.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available
upon request.
3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept
under document control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
F
5962-94716
SHEET
5
DSCC FORM 2234
APR 97
NXP MCU
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