AEC-Q200 Compliant Chip Multilayer Ceramic Capacitors for Infotainment
GRT21BR60J476ME13_ (0805, X5R:EIA, 47uF, DC6.3V)
_: packaging code
1.Scope
Reference Sheet
This product specification is applied to Chip Multilayer Ceramic Capacitors used for Car Multimedia, Car Interior, Car Comfort application and General Electronic
equipment. Please contact us when using this product for any other applications than described in the above.
Do not use these products in applications critical to passenger safety and car driving function (e.g. ABS, AIRBAG, etc.).
2.MURATA Part NO. System
(Ex.)
GRT
21
(1)L/W
Dimensions
B
(2)T
Dimensions
R6
(3)Temperature
Characteristics
0J
(4)Rated
Voltage
476
(5)Nominal
Capacitance
M
(6)Capacitance
Tolerance
E13
(7)Murata’s Control
Code
L
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
2.0±0.2
(1)-2 W
1.25±0.2
(2) T
1.25±0.2
e
0.2 to 0.7
(Unit:mm)
g
0.7 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-15 to 15 %
-55 to 85 °C
(25 °C)
DC 6.3 V
47 uF
±20 %
-55 to 85 °C
5.Package
mark
L
K
(8) Packaging
f180mm
Reel
EMBOSSED W8P4
f330mm
Reel
EMBOSSED W8P4
Packaging Unit
3000 pcs./Reel
10000 pcs./Reel
Product specifications in this catalog are as of Apr.5,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRT21BR60J476ME13-01
1
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
AEC-Q200 Test Method
1 Pre-and Post-Stress
Electrical Test
2 High Temperature
Exposure (Storage)
Appearance
Capacitance
Change
0.2 max.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-12.5%
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
D.F.
for 24+/-2 hours at room temperature. Perform the initial measurement.
-
Solder the capacitor on the test substrate(glass epoxy board).
Set the capacitor for 1000+/-12 hours at maximum operating
temperature +/-3℃.
Set for 24+/-2 hours at room temperature, then measure.
Insulation
Resistance
25℃
3 Temperature Cycling
Appearance
Capacitance
Change
More than 500MΩ or 25Ω
∙
F (Whichever is smaller)
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-15%
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 1000 cycles test according to the four heat treatments
in the following table.
Set for 24+/-2 hours at room temperature, then measure.
Step
Temp.
(C)
1
Min.Operating Temp.+0/-3
15+/-3
2
3
4
Room
Room
Temp. Max.Operating Temp. +3/-0 Temp.
1
15+/-3
1
D.F.
0.2 max.
Time
(min)
・
Initial measurement
Insulation
Resistance
25℃
4 Destructive
Physical Analysis
5 Biased Humidity
Appearance
Capacitance
Change
0.2 max.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-12.5%
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
D.F.
for 24+/-2 hours at room temperature. Perform the initial measurement.
・Measurement
after test
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
Solder the capacitor on the test substrate(glass epoxy board).
Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8kΩ resister)
at 85+/-3℃ and 80%RH to 85%RH humidity for 1000+/-12 hours.
The charge/discharge current is less than 50mA.
No defects or abnormalities
Per EIA-469
Within the specified initial value.
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
Insulation
Resistance
25℃
More than 100MΩ or 5Ω
∙
F (Whichever is smaller)
JEMCGS-05927
2
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
The measured and observed characteristics should satisfy the
specifications in the following table.
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Apply 100% of the rated voltage for 1000+/-12 hours at maximum operating
temperature +/-3℃.
The charge/discharge current is less than 50mA.
6 Operational Life
Appearance
No marking defects
Capacitance
Change
D.F.
Within +/-12.5%
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
0.2 max.
・Measurement
after test
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
Insulation
Resistance
25℃
7 External Visual
More than 100MΩ or 5Ω
∙
F (Whichever is smaller)
for 24+/-2 hours at room temperature. Perform the initial measurement.
No defects or abnormalities
Visual inspection
8 Physical Dimension
Within the specified dimensions
Using Measuring instrument of dimension.
9 Resistance to
Solvents
Appearance
No marking defects
Per MIL-STD-202 Method 215
Solvent 1 : 1 part (by volume) of isopropyl alcohol
Capacitance
Within the specified initial value.
3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
D.F.
Within the specified initial value.
Solvent 3 : 42 parts (by volume) of water
1
part (by volume) of propylene glycol monomethyl ether
Insulation
Resistance
25℃
10 Mechanical
Shock
Capacitance
Appearance
Within the specified initial value.
1 part (by volume) of monoethanolamine
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
Three shocks in each direction should be applied along 3 mutually
Within the specified initial value.
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
D.F.
Insulation
Resistance
25℃
11 Vibration
Appearance
Within the specified initial value.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
Within the specified initial value.
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
Capacitance
Within the specified initial value.
a total amplitude of 1.5mm, the frequency being varied uniformly
between the approximate limits of 10Hz and 2000Hz.
D.F.
Insulation
Resistance
25℃
12 Resistance to
Soldering Heat
Appearance
Capacitance
Change
D.F.
Insulation
Resistance
25℃
Within the specified initial value.
The frequency range, from 10Hz to 2000Hz and return to 10Hz,
should be traversed in approximately 20 minutes.
Within the specified initial value.
This motion should be applied for 12 cycles in each 3 mutually
perpendicular directions (total of 36 times).
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-15%
Within the specified initial value.
Within the specified initial value.
Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
solder solution at 260+/-5℃ for 10+/-1 seconds.
Set for 24+/-2 hours at room temperature, then measure.
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
JEMCGS-05927
3
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
The measured and observed characteristics shall satisfy the
specifications in the following table.
Appearance
No marking defects
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 300 cycles according to the two heat treatments listed
in the following table(Maximum transfer time is 20 seconds).
Set for 24+/-2 hours at room temperature, then measure.
Capacitance
Change
D.F.
Within the specified initial value.
Within +/-15%
Step
Temp.(℃）
Time
(min)
1
Min.Operating Temp.
+0/-3
13 Thermal Shock
2
Max.Operating Temp.
+3/-0
15+/-3
15+/-3
Insulation
Resistance
25℃
14 ESD
Appearance
Capacitance
D.F.
Insulation
Resistance
25℃
15 Solderability
Within the specified initial value.
・
Initial measurement
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
No marking defects
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
Per AEC-Q200-002
Voltage setting level : 2kV
95% of the terminations is to be soldered evenly and continuously.
(a) Preheat at 155℃ for 4 hours. After preheating,
immerse the capacitor in a solution of rosin ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃ or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5 seconds.
(b) should be placed into steam aging for 8 hours+/-15 minutes.
After preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5 seconds.
(c) should be placed into steam aging for 8 hours+/-15 minutes.
After
preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5 seconds at 260+/-5℃.
16 Electrical
Chatacteri-
zation
Appearance
Capacitance
D.F.
No defects or abnormalities
Shown in Rated value.
0.125 max.
Visual inspection.
The capacitance/D.F. should be measured at 25℃ at the frequency
and voltage shown in the table.
Char
Item.
Frequency
Voltage
C
≦10F
6.3V max.
1.0+/-0.1kHz
0.5+/-0.1Vrms
10V min.
1.0+/-0.1kHz
1.0+/-0.2Vrms
120+/-24Hz
0.5+/-0.1Vrms
10F < C
Insulation
Resistance
25℃
Insulation
Resistance
85℃(For R6)
105℃(For C8)
Dielectric
Strength
More than 1000MΩ or 50Ω ∙ F (Whichever is smaller)
The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at 25℃ and maximum operating temperature
within 1minute of charging.
More than 100MΩ or 5Ω ∙ F (Whichever is smaller)
The charge/discharge current is less than 50mA.
No failure
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 second to 5 seconds.
The charge/discharge current is less than 50mA.
JEMCGS-05927
4
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Appearance
Capacitance
No marking defects
Within the specified initial value.
Specifications.
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Then apply a force in the direction shown in Fig 2 for 60 seconds.
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
D.F.
Within the specified initial value.
such as heat shock.
Series
GRT03
GRT15
GRT18
GRT21
GRT31
GRT32
a
0.3
0.5
0.6
0.8
2.0
2.0
50 min.
17 Board Flex
Insulation
Resistance
25℃
Within the specified initial value.
b
0.9
1.5
2.2
3.0
4.4
4.4
Pressurization
speed
1.0mm/s
c
0.3
0.6
0.9
1.3
1.7
2.6
(in mm)
Land
b
20
f4.5
Capacitor
R4
Pressurize
a
100
40
c
c
45
45
Support
Capacitance meter
45
45
Fig.1
18 Terminal
Strength
Capacitance
Within the specified initial value.
Appearance
No marking defects
t : 1.6mm
(GRT03,15:0.8mm)
20 50
Fig.2
Flexure：2
(Chip thickness＞0.85mm rank
High Dielectric Type)
Flexure：1
(Chip thickness≦0.85mm rank
High Dielectric Type)
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig3.
Then apply 18N* force in parallel with the test jig for 60 seconds.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
D.F.
Within the specified initial value.
Series
GRT03
GRT15
GRT18
GRT21
GRT31
GRT32
a
0.3
0.4
1.0
1.2
2.2
2.2
*2N(GRT03,15)
b
0.9
1.5
3.0
4.0
5.0
5.0
c
0.3
0.5
1.2
1.65
2.0
2.9
Insulation
Resistance
25℃
Within the specified initial value.
（in
mm）
c
b
a
ﾗﾝﾄﾞ
b
f4.5
t : 1.6mm
(GRT03,15:0.8mm)
Solder resist
Baked electrode
or copper foil
c
a
19 Beam Load Test
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness = 0.5mm rank : 8N
Chip thickness = 0.3mm rank : 5N
Chip thickness < 0.3mm rank : 2.5N
< Chip L dimension : 3.2mm min. >
Chip thickness < 1.25mm rank : 15N
Chip
thickness
≧1.25mm
rank : 54.5N
Apply a force.
Fig.3
Place the capacitor in the beam load fixture as Fig 4.
Incompatible runtime models. Module APS specifies that '__code_model' must be 'banked', but module AF has the value 'near'
用Zstack编译时出现这个问题原，这个是什么原因造成的 请教 ......
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