1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C
2. Irms: DC current for an approximately
ΔT
of 40°C without core loss. Derating is necessary for
AC currents. Pad layout, trace thickness and width, airflow, and proximity of other heat generating
components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 155°C under worst case conditions verified in the end application.
3. Peak current for approximately 15% rolloff @+20°C
4. Peak current for approximately 30% rolloff @+20°C
5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at
operating frequency necessary to generate additional core loss which contributes to the 40°C
temperature rise. De-rating of the Irms is required to prevent excessive temperature rise. The 100%
V-μs rating is equivalent to a ripple current I
p-p
of 20% of Isat (30% rolloff option).
6. Part number definition: HC8-XXX-R
HC8 = Product code and size
XXX = Inductance value in uH. R = Decimal point. If no R is present then last character
equals number of zeros
-R suffix indicates RoHS compliant
Dimensions–mm
TOP VIEW
FRONT VIEW
C
L
FRONT VIEW
TABLE
PN
4.0
Max
A
mm
2.1
2.1
2.1
2.1
2.7
SIDE VIEW
2.70
±
0.55
(2x)
RECOMMENDED PAD LAYOUT
3.5 typ
2plcs
3.0 typ
2plcs
2
1
SCHEMATIC
10.9
Max
HC8-XXX
wwll yy R
10.4
Max
10.4
Max
R15
R39
R75
1R
1R9
thru
470
3.95
2 plcs
ref
A ref
4.0 typ
Part marking: HC8= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals
number of zeros. wwlyly=date code, R=revision level
Tolerances are ±0.2 millimeters unless stated otherwise
All soldering surfaces to be coplanar within 0.1 millimeters
Do not route traces or vias underneath the inductor
Packaging information–mm
Supplied in tape and reel packaging, 800 parts per reel
1.5 dia
+0.1/-0.0
2.0
4.0
1.5 dia
min
A
1.75
Ao=10.4 m
m
Bo=11.2 mm
Ko=4.3 mm
11.5
11.2
Bo
HC8-XXX
wwlly y R
24.0
+/-0.3
Ko
SECTION A-A
Ao
16.0
A
User direction of feed
2
www.eaton.com/elx
HC8
High current power inductors
Inductance characteristics
Technical Data
4120
Effective October 2015
OCL vs Isat
100
90
80
70
% of OCL
60
50
40
30
02
10
0
0
10
20
30
40
50
60
70
80
90
100 110 120 130 140 150 160 170 180 190 200
% of Isat
Core loss
Irms DERATING WITH CORE LOSS
% Applied Volt-u Seconds
10
84
30
50
70
90
110
130
150
170
190
% of Irms specified from
zero ripple application
86
88
90
92
94
96
98
100
100kHz
200kHz
300kHz
400kHz
500kHz
www.eaton.com/elx
3
Technical Data
4120
Effective October 2015
HC8
High current power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
1. What does diagnostics test?generally?cover?
?
A. ASIC
B. Memory
C. Component
D. Data Path
E. All of the above
2. If ASIC, component A, transmits data to ASIC, compo ......
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