This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
Copyright FCI.
Form E-3727
Rev A
PDS: Rev :A
STATUS:Released
GS-01-001
Printed: Nov 29, 2012
NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
2 of 9
A
DATE
BTFW シリーズ（1.0mm 千鳥ﾋﾟ½ﾁボード to ボードコネクタ）
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
M.Koga
CLASSIFICATION
9/18/2012
UNRESTRICTED
3. 各部名称
3. Each part name
プラグコネクタ / Ｐ½½½ connector
リセプタクルコネクタ/Receptacle
connector
ハウジング
Housing
ハウジング
Housing
コンタクト
Contact
補強金具
Fixing Tab
コンタクト
Contact
補強金具
Fixing Tab
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
Copyright FCI.
Form E-3727
Rev A
PDS: Rev :A
STATUS:Released
GS-01-001
Printed: Nov 29, 2012
NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
3 of 9
A
DATE
BTFW シリーズ（1.0mm 千鳥ﾋﾟ½ﾁボード to ボードコネクタ）
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
M.Koga
CLASSIFICATION
9/18/2012
UNRESTRICTED
4. 実装方法
4. Mounting method
4.1 推奨基板パターン
4.1 Recommended PCB layout
弊社発行 適用½品図面を参照願います。
Refer to drawings
4.2 基板実装方法
4.2 Mounting method of the connector on the PCB
自動実装・表面実装対応のタイプは、自動実装機により基板へ装着し、リフローはんだ付けを
行ってください。
Automatic mounting and SMT type proceeds reflow soldering after mounting it on the PCB
by automatic mounting machine.
ディップタイプは、基板に挿入後フロー半田付けを行ってください。
Dipping type proceeds flow soldering after inserting into the PCB
1) Please take care hand soldering of rework to prevent penetrating flux on to the contacting portion.
2) Please take care hand soldering of rework, do not apply external force to the contact lead section at
the soldering iron point.
3) Please do not solder when connector is mated condition.
4) Please do not touch the contact portion by hand.
5) Please control warpage of PCB. Soldering may become poor, if PCB warpage is large.
6) Please do not give the external force beyond 0.5N to a connector before mounting.
Connector may be damaged.
7) Do not apply any forces affecting soldered joints when PC Board cut off multiple board and screw
cramp of board etc.
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
Copyright FCI.
Form E-3727
Rev A
PDS: Rev :A
STATUS:Released
GS-01-001
Printed: Nov 29, 2012
NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
4 of 9
A
DATE
BTFW シリーズ（1.0mm 千鳥ﾋﾟ½ﾁボード to ボードコネクタ）
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
M.Koga
CLASSIFICATION
9/18/2012
UNRESTRICTED
5. 取扱上の注意
5. Cautions for operation
5.1 嵌合許容量
5.1 Mating allowance
(1) X 方向許容量
：±0.5mm 以内
(1) X direction allowance ：±0.5mm max.
嵌合許容量：+0.5mm
max.
Mating allowance: +0.5mm max.
嵌合許容量：-0.5mm
max.
Mating allowance: -0.5mm max.
Center condition
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
Copyright FCI.
Form E-3727
Rev A
PDS: Rev :A
STATUS:Released
GS-01-001
Printed: Nov 29, 2012
NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
5 of 9
A
DATE
BTFW シリーズ（1.0mm 千鳥ﾋﾟ½ﾁボード to ボードコネクタ）
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
M.Koga
CLASSIFICATION
9/18/2012
UNRESTRICTED
(2) Y 方向許容量
：±0.4mm 以内
(2) Y direction allowance ：±0.4mm max.
嵌合許容量：+0.8mm
max.
Mating allowance: +0.8mm max.
嵌合許容量：-0.8mm
max.
Mating allowance: -0.8mm max.
Center condition
(3) Z 方向許容量
：±0.5mm 以内
(3) Z direction allowance ：±0.5mm max.
嵌合許容量：+0.5mm
max.
Mating allowance: +0.5mm max.
嵌合許容量：-0.5mm
max.
Mating allowance: -0.5mm max.
Center condition
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
主题：自备终端(BYOD)发展趋势;用员工自己的移动设备来控制对工作设施及设备的使用，会对信息安全产生怎样的影响;在不使公司有安全风险或不损害员工隐私的前提下，有哪些方式能安全地实现这样的设施及设备使用。 自备终端(Bring Your Own Device，简称BYOD)，即企业允许员工离职时保留自己的手机，这种做法正日益流行。如今智能手机功能也越来越多，我们不仅能用自己的手机访问电脑、网...[详细]
PCB设计
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
