8-megabit 1.8-volt Only Flash Memory
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | TSOP1 |
| 包装说明 | 12 X 20 MM, PLASTIC, MO-142DD, TSOP1-48 |
| 针数 | 48 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最长访问时间 | 90 ns |
| 备用内存宽度 | 8 |
| 启动块 | TOP |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e0 |
| 长度 | 18.4 mm |
| 内存密度 | 8388608 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 编程电压 | 1.8 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 1.95 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 类型 | NOR TYPE |
| 宽度 | 12 mm |
| AT49SV802AT-90TI | AT49SV802A | AT49SV802AT | AT49SV802A-90CI | AT49SV802A-90TI | AT49SV802A-90CU | AT49SV802A-90TU | AT49SV802AT-90CI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 8-megabit 1.8-volt Only Flash Memory | 8-megabit 1.8-volt Only Flash Memory | 8-megabit 1.8-volt Only Flash Memory | 8-megabit 1.8-volt Only Flash Memory | 8-megabit 1.8-volt Only Flash Memory | 8-megabit 1.8-volt Only Flash Memory | 8-megabit 1.8-volt Only Flash Memory | 8-megabit 1.8-volt Only Flash Memory |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | Atmel (Microchip) | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | TSOP1 | - | - | BGA | TSOP1 | BGA | TSOP1 | BGA |
| 包装说明 | 12 X 20 MM, PLASTIC, MO-142DD, TSOP1-48 | - | - | 6 X 8 MM, 1 MM HEIGHT, 0.80 MM PITCH, PLASTIC, CBGA-48 | 12 X 20 MM, PLASTIC, MO-142DD, TSOP1-48 | VFBGA, | TSOP1, | 6 X 8 MM, 1 MM HEIGHT, 0.80 MM PITCH, PLASTIC, CBGA-48 |
| 针数 | 48 | - | - | 48 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | compli | - | - | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 90 ns | - | - | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns |
| 备用内存宽度 | 8 | - | - | 8 | 8 | 8 | 8 | 8 |
| 启动块 | TOP | - | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | TOP |
| JESD-30 代码 | R-PDSO-G48 | - | - | R-PBGA-B48 | R-PDSO-G48 | R-PBGA-B48 | R-PDSO-G48 | R-PBGA-B48 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e1 | e3 | e0 |
| 长度 | 18.4 mm | - | - | 8 mm | 18.4 mm | 8 mm | 18.4 mm | 8 mm |
| 内存密度 | 8388608 bi | - | - | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi |
| 内存集成电路类型 | FLASH | - | - | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | - | - | 16 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | - | - | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | - | - | 48 | 48 | 48 | 48 | 48 |
| 字数 | 524288 words | - | - | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | - | - | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 105 °C | - | - | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 512KX16 | - | - | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | - | - | VFBGA | TSOP1 | VFBGA | TSOP1 | VFBGA |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | - | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | - | - | 240 | 240 | 260 | 260 | 240 |
| 编程电压 | 1.8 V | - | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | - | - | 1 mm | 1.2 mm | 1 mm | 1.2 mm | 1 mm |
| 最大供电电压 (Vsup) | 1.95 V | - | - | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
| 最小供电电压 (Vsup) | 1.65 V | - | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | - | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | - | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | - | - | TIN LEAD | TIN LEAD | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | TIN LEAD |
| 端子形式 | GULL WING | - | - | BALL | GULL WING | BALL | GULL WING | BALL |
| 端子节距 | 0.5 mm | - | - | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm |
| 端子位置 | DUAL | - | - | BOTTOM | DUAL | BOTTOM | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | - | - | 30 | 30 | 40 | 40 | 30 |
| 类型 | NOR TYPE | - | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 12 mm | - | - | 6 mm | 12 mm | 6 mm | 12 mm | 6 mm |
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