REVISIONS
LTR
A
B
DESCRIPTION
Change in accordance with NOR 5962-R076-96.
Add device type 03. Update boilerplate. Editorial changes throughout.- tvn
DATE (YR-MO-DA)
96-04-11
98-09-18
APPROVED
Monica L. Poelking
Monica L. Poelking
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
B
15
B
16
REV
SHEET
PREPARED BY
Jeffery Tunstall
CHECKED BY
Thomas M. Hess
APPROVED BY
Monica L. Poelking
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
B
11
B
12
B
13
B
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
DRAWING APPROVAL DATE
92-02-12
REVISION LEVEL
MICROCIRCUIT, DIGITAL, CMOS, IMAGE RESAMPLING
SEQUENCER, MONOLITHIC SILICON
SIZE
CAGE CODE
B
A
SHEET
67268
1
OF
16
5962-89715
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A Approved for public release; distribution is unlimited.
.
5962-E493-98
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89715
01
X
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
TMC2301
TMC2301
LF2301
Circuit function
CMOS image resampling sequencer
CMOS image resampling sequencer
CMOS image resampling sequencer
Frequency
15 MHz
18 MHz
18 MHz
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
CMGA3-P68
CQCC2-J68
Terminals
68
68
Package style
Pin grid array package
Square chip carrier with
unformed-lead package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
1/
-0.5 V dc to +7 V dc
-0.5 V to V
DD
+ 0.5 V
-0.5 V to V
DD
+ 0.5 V
-6.0 mA to +9.0 mA
1s
-60
C to +130
C
+175
C
-65
C to +150
C
+300
C
0.50 W
See MIL-PRF-38535
2/
2/
Supply voltage range ................................................................................
DC voltage applied to outputs ...................................................................
Output applied voltage ..............................................................................
Output forced current ................................................................................
Short circuit duration (single output in high state
to ground) ..............................................................................................
Case operating temperature (T
C
) ..............................................................
Junction temperature (T
J
) .........................................................................
Storage temperature range ......................................................................
Lead temperature (soldering, 10 seconds) ...............................................
Maximum power dissipation (P
D
) ..............................................................
Thermal resistance, junction-to-case (
JC
) ................................................
__________
1/
2/
Absolute maximum ratings are limiting values applied individually while all other parameters are within specified operating
conditions. Functional operation under any of these conditions is not implied.
Applied voltage must be current limited to specified range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89715
SHEET
B
2
1.4 Recommended operating conditions.
Supply voltage (V
DD
) ................................................................................. +4.5 V dc to +5.5 V dc
Input high voltage (V
IH
) ............................................................................. 2.0 V dc minimum
Input low voltage (V
IL
) ............................................................................... 0.8 V maximum
Output high current (I
OH
) ........................................................................... -4.0 mA maximum
Output low current (I
OL
) ............................................................................. 6.0 mA maximum
Case operating temperature range (T
C
) .................................................... -55
C to +125
C
Clock pulse width low (t
PWL
):
Device type 01 ....................................................................................... 25 ns minimum
Device types 02 and 03 ......................................................................... 22 ns minimum
Clock pulse width high (t
PWH
):
Device type 01 ....................................................................................... 33 ns minimum
Device types 02 and 03 ......................................................................... 28 ns minimum
Input setup time (t
S
):
Device type 01 ....................................................................................... 20 ns minimum
Device types 02 and 03 ......................................................................... 18 ns minimum
Input hold time (t
H
) .................................................................................... 2 ns minimum
Input hold time, INTER .............................................................................. 10 ns minimum
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed
in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in
the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-973 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings (SMD's).
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Configuration Management.
Interface Standard For Microcircuit Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89715
SHEET
B
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Block diagram. The block diagram shall be as specified on figure 2.
3.2.4. Image resampling geometry showing image rotation and expansion. Image resampling geometry showing image
rotation and expansion shall be as specified on figure 3.
3.2.5 Waveforms and test circuit. The waveforms and test circuit are as specified on figure 4.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of
MIL-PRF-38535,
appendix A
and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in
MIL-PRF-38535, appendix A
shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89715
SHEET
B
4
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
(2) T
A
= +125
C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of
MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
b.
c.
Tests shall be as specified in table II herein.
Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
Subgroup 4 (C
IN
and C
OUT
measurements) shall be measured only for the initial test and after process or design
changes which may affect input capacitance. A minimum sample size of five devices with zero rejects shall be
required.
Subgroups 7 and 8 tests shall consist of verifying the function of the device. These tests form a part of the vendor's
test tape and shall be maintained and available for review from the approved sources of supply.
d.
4.3.2 Groups C and D inspections.
a.
b.
End-point electrical parameters shall be as specified in table II herein.
Steady-state life test conditions, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1005 of MIL-STD-883.
T
A
= +125
C, minimum.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
(2)
(3)
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89715
SHEET
B
5
DSP 与 ARM 处理器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
