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5962-8971103JA

产品描述Correlator, 1-Bit, CMOS, CDIP24,
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小121KB,共15页
制造商Raytheon Company
官网地址https://www.raytheon.com/
下载文档 详细参数 选型对比 全文预览

5962-8971103JA概述

Correlator, 1-Bit, CMOS, CDIP24,

5962-8971103JA规格参数

参数名称属性值
Reach Compliance Codeunknown
边界扫描NO
最大时钟频率35 MHz
外部数据总线宽度1
JESD-30 代码R-CDIP-T24
JESD-609代码e0
低功率模式NO
端子数量24
最高工作温度125 °C
最低工作温度-55 °C
输出数据总线宽度1
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
认证状态Not Qualified
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子位置DUAL
uPs/uCs/外围集成电路类型DSP PERIPHERAL, CORRELATOR
Base Number Matches1

5962-8971103JA相似产品对比

5962-8971103JA 5962-8971104LA 5962-8971104JA 5962-8971104JX 5962-89711013X 5962-8971101JX 5962-8971103LX 5962-8971103LA 5962-8971103JX 5962-8971104LX
描述 Correlator, 1-Bit, CMOS, CDIP24, Correlator, 1-Bit, CMOS, CDIP24, Correlator, 1-Bit, CMOS, CDIP24, Correlator, 1-Bit, CMOS, CDIP24, CERAMIC, DIP-24 Correlator, 1-Bit, CMOS, CQCC28, CERAMIC, LCC-28 Correlator, 1-Bit, CMOS, CDIP24, CERAMIC, DIP-24 Correlator, 1-Bit, CMOS, CDIP24, CERAMIC, DIP-24 Correlator, 1-Bit, CMOS, CDIP24, Correlator, 1-Bit, CMOS, CDIP24, CERAMIC, DIP-24 Correlator, 1-Bit, CMOS, CDIP24, CERAMIC, DIP-24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
边界扫描 NO NO NO NO NO NO NO NO NO NO
最大时钟频率 35 MHz 50 MHz 50 MHz 50 MHz 25 MHz 25 MHz 35 MHz 35 MHz 35 MHz 50 MHz
外部数据总线宽度 1 1 1 1 1 1 1 1 1 1
JESD-30 代码 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 S-CQCC-N28 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24
低功率模式 NO NO NO NO NO NO NO NO NO NO
端子数量 24 24 24 24 28 24 24 24 24 24
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
输出数据总线宽度 1 1 1 1 1 1 1 1 1 1
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DIP DIP DIP DIP QCCN DIP DIP DIP DIP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO YES NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子位置 DUAL DUAL DUAL DUAL QUAD DUAL DUAL DUAL DUAL DUAL
uPs/uCs/外围集成电路类型 DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR DSP PERIPHERAL, CORRELATOR
Base Number Matches 1 1 1 1 1 1 1 1 1 -
包装说明 - - - CERAMIC, DIP-24 CERAMIC, LCC-28 CERAMIC, DIP-24 CERAMIC, DIP-24 - CERAMIC, DIP-24 CERAMIC, DIP-24
筛选级别 - - - MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 - MIL-STD-883 MIL-STD-883

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