High-Density High-Performance Silicon-Gate(PARALLEL INTERFACE)
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP40,.6 |
| 针数 | 40 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 其他特性 | OPERATES AT 3V MIN SUPPLY |
| 最大时钟频率 | 1 MHz |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-CDIP-T40 |
| JESD-609代码 | e0 |
| 长度 | 52.275 mm |
| I/O 线路数量 | 24 |
| 端口数量 | 3 |
| 端子数量 | 40 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.84 mm |
| 最大压摆率 | 3 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE |
| MC146823S | MC146823 | MC146823L | MC146823P | MC146823Z | |
|---|---|---|---|---|---|
| 描述 | High-Density High-Performance Silicon-Gate(PARALLEL INTERFACE) | High-Density High-Performance Silicon-Gate(PARALLEL INTERFACE) | High-Density High-Performance Silicon-Gate(PARALLEL INTERFACE) | High-Density High-Performance Silicon-Gate(PARALLEL INTERFACE) | High-Density High-Performance Silicon-Gate(PARALLEL INTERFACE) |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Motorola ( NXP ) | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 零件包装代码 | DIP | - | DIP | - | QFN |
| 包装说明 | DIP, DIP40,.6 | - | DIP, DIP40,.6 | DIP, | QCCN, LCC40,.5SQ,40 |
| 针数 | 40 | - | 40 | - | 40 |
| Reach Compliance Code | unknow | - | unknow | unknow | unknow |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 其他特性 | OPERATES AT 3V MIN SUPPLY | - | OPERATES AT 3V MIN SUPPLY | OPERATES AT 3V MIN SUPPLY | OPERATES AT 3V MIN SUPPLY |
| 最大时钟频率 | 1 MHz | - | 1 MHz | 1 MHz | 1 MHz |
| 外部数据总线宽度 | 8 | - | 8 | 8 | 8 |
| JESD-30 代码 | R-CDIP-T40 | - | R-CDIP-T40 | R-PDIP-T40 | S-CQCC-N40 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 长度 | 52.275 mm | - | 50.8 mm | 52.07 mm | 12.19 mm |
| I/O 线路数量 | 24 | - | 24 | 24 | 24 |
| 端口数量 | 3 | - | 3 | 3 | 3 |
| 端子数量 | 40 | - | 40 | 40 | 40 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | - | DIP | DIP | QCCN |
| 封装等效代码 | DIP40,.6 | - | DIP40,.6 | - | LCC40,.5SQ,40 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.84 mm | - | 4.32 mm | 5.08 mm | 2.08 mm |
| 最大压摆率 | 3 mA | - | 3 mA | 3 mA | 3 mA |
| 最大供电电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | NO | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.02 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | - | 15.24 mm | 15.24 mm | 12.19 mm |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE | - | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
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