REVISIONS
LTR
A
B
C
D
E
F
DESCRIPTION
Added four device types and updated format. Added two vendors
CAGE 1FN41 and 34649.
Changes in accordance with NOR 5962-R212-92.
Changes in accordance with NOR 5962-R301-92.
Changes in accordance with NOR 5962-R227-94.
Updated format to include QML vendor paragraphs. ksr
Boilerplate update, part of 5 year review. ksr
DATE (YR-MO-DA)
91-03-27
92-05-15
92-09-05
94-07-05
00-07-24
06-05-31
APPROVED
M. A. Frye
M. A. Frye
M. A. Frye
M. A. Frye
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN CHANGED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Raymond Monnin
APPROVED BY
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
Michael A Frye
F
1
F
2
F
3
F
4
F
5
F
6
F
7
F
8
F
9
F
10
F
11
F
12
F
13
F
14
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS 64K X 16 UV EPROM,
MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
DRAWING APPROVAL DATE
26 MAY89
REVISION LEVEL
F
67268
1 OF
14
5962-86805
DSCC FORM 2233
APR 97
5962-E451-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-86805
⏐
⏐
⏐
⏐
Drawing number
01
⏐
⏐
⏐
⏐
Device type
(see 1.2.1)
Q
⏐
⏐
⏐
⏐
Case outline
(see 1.2.2)
A
⏐
⏐
⏐
⏐
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
Generic number 1/
Circuit function
64K x 16-bit UVEPROM
64K x 16-bit UVEPROM
64K x 16-bit UVEPROM
64K x 16-bit UVEPROM
64K x 16-bit UVEPROM
64K x 16-bit UVEPROM
64K x 16-bit UVEPROM
64K x 16-bit UVEPROM
Access time
300 ns
250 ns
200 ns
170 ns
150 ns
120 ns
90 ns
70 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Q
X
1.2.3
Descriptive designator
GDIP1-T40 or CDIP2-T40
CQCC1-N44
Terminals
40
44
Package style
dual-in-line package 2/
square chip carrier package 2/
Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Storage temperature range ----------------------------------------------------
All input or output voltage with respect to ground -----------------------
Voltage on pin A
9
with respect to ground -----------------------------------
Power dissipation (P
D
) 3/ ------------------------------------------------------
Lead temperature (soldering, 10 seconds)---------------------------------
Thermal resistance, junction-to-case (θ
JC
) ---------------------------------
Junction temperature (T
J
) 4/ ---------------------------------------------------
Data retention----------------------------------------------------------------------
Endurance --------------------------------------------------------------------------
1.4 Recommended operating conditions.
Case operating temperature range (T
C
) ------------------------------------
Supply voltage range (V
CC
) ----------------------------------------------------
-55°C to +125°C
+4.5 V dc to +5.5 V dc
-65°C to +150°C
-0.6 V dc to V
CC
+0.5 V dc
-0.6 V dc to +13.5 V dc
330 mW
+300°C
See MIL-STD-1835
+150°C
10 years, minimum
50 cycles byte, minimum
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in QML-38535 and MIL-HDBK-103.
2/ Lid shall be transparent to permit ultraviolet light erasure.
3/ Must withstand the added P
D
due to short-circuit test; e.g., I
OS
.
4/ Maximum junction temperature may be increased to +175°C during burn-in and steady-state life.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86805
SHEET
F
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-
38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table(s).
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2. When required in groups A, B, or C inspection (see 4.3), the devices shall be programmed by
the manufacturer prior to test in a checkerboard or similar pattern (a minimum of 50 percent of the total number of bits
programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed.
3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86805
SHEET
F
3
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10 Processing EPROMs. All testing requirements and quality assurance provisions herein shall be satisfied by the
manufacturer prior to delivery.
3.10.1 Erasure of EPROMs. When specified, devices shall be erased in accordance with the procedure and characteristics
specified in 4.4 herein.
3.10.2 Programmability of EPROMs. When specified, devices shall be programmed to the specified pattern using the
procedures and characteristics specified in 4.5 herein.
3.10.3 Verification of erasure and/or programmability of EPROMs. When specified, devices shall be verified as either
programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup
7) to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a device
failure, and shall be removed from the lot.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test (method 1015 of MIL-STD-883).
(1) Test condition D or E. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86805
SHEET
F
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C < T
C
< +125°C
V
SS
= 0 V;
4.5 V < V
CC
< 5.5 V
unless otherwise specified
V
IN
= 0 V to 5.5 V
V
OUT
= 0 V to 5.5 V
V
CC
= V
PP
= 5.5 V
CE
=
OE
= V
IL
0
0-15
= 0 mA
f = 1/t
AVQV
(maximum)
Standby current
(TTL inputs)
Standby current
(CMOS inputs)
I
CC2
V
CC
= 5.5 V
CE
= V
IH
I
CC3
V
CC
= 5.5 V
CE
= V
CC
±0.3
V
07-08
V
PP
supply current
(read)
Input low voltage
(TTL)
Input high voltage
(TTL)
Output low voltage
Output high voltage
I
PP
V
IL
2/
V
IH
2/
V
PP
= 5.5 V
1, 2, 3
All
10
100
mA
µA
V
V
1, 2, 3
1, 2, 3
Group A
subgroups
Device
types
Min
Limits
Max
Unit
Input leakage current
Output leakage
current
Operating current
I
LI
I
LO
1/
I
CC1
1, 2, 3
1, 2, 3
All
All
-5
-10
+5
+10
µA
µA
1, 2, 3
01-06,
07
08
01-06
07-08
01-06
60
mA
90
1
20
120
µA
mA
1, 2, 3
1, 2, 3
All
All
-0.1
3/
2.0
0.8
V
CC
+0.5
3/
0.45
V
OL
V
OH
I
OS
3/
C
IN
4/ 5/
I
OL
= 2.1 mA
V
IL
= 0.8 V, V
IH
= 2.0 V
I
OH
= -400
µA
V
IH
= 2.0 V, V
IL
= 0.8 V
V
O
= 0 V
V
IN
= 0 V, T
C
= +25°C
f = 1 MHz
See 4.3.1c
V
OUT
= 0 V, T
C
= +25°C
f = 1 MHz
See 4.3.1c
See 4.3.1e
1, 2, 3
1, 2, 3
All
All
2.4
V
V
Output short-circuit
Input capacitance
1, 2, 3
4
All
All
-200
+200
25
mA
pF
Output capacitance
C
OUT
4/ 5/
4
All
25
pF
Functional tests
See footnotes at end of table.
7, 8
All
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86805
SHEET
F
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
