TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-111
REVISION
HPC Solderless (Press Fit) Right Angle Receptacle
1 of 10
AUTHORIZED BY
DATE
H
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality and reliability requirements of the HPC Solderless
(Press Fit) Right Angle Receptacle.
2.0
SCOPE
This specification is applicable to the non-separable Connector to Board Interface of the HPC Solderless
(Press Fit) Right Angle Receptacle.
3.0
GENERAL
This document is composed of the following sections:
PARAGRAPH
TITLE
1.0
OBJECTIVE
2.0
SCOPE
3.0
GENERAL
4.0
APPLICABLE DOCUMENTS
5.0
REQUIREMENTS
5.1
Qualification
5.2
Material
5.3
Finish
5.4
Design and Construction
6.0
ELECTRICAL CHARACTERISTICS
7.0
MECHANICAL CHARACTERISTICS
8.0
ENVIRONMENTAL CONDITIONS
9.0
QUALITY ASSURANCE PROVISIONS
9.1
Equipment Calibration
9.2
Inspection Conditions
9.3
Sample Quantity and Description
9.4
Acceptance
9.5
Qualification Testing
9.6
Requalification Testing
TABLE 1 QUALIFICATION TESTING MATRIX
NOTE: HPC is a trade mark of FCI Electronics
3.1 Banned/Restricted Substances
All product where the part number ends in “LF” meet the European Union directives and other
country regulations as described in GS-22-008. The part numbers that do not end in “LF” meet all
regulations except for Pb in SnPb plating.
Copyright 2005 FCI
Form E-3334
Rev B 06/06/05
V05-0553
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-111
REVISION
HPC Solderless (Press Fit) Right Angle Receptacle
2 of 10
AUTHORIZED BY
DATE
H
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
3.2 Manufacturing Processability
All products covered by this specification will withstand exposure to 260°C peak temperature for 10-
30 seconds in a convection, infra-red or vapor phase reflow oven.
4.0
APPLICABLE DOCUMENTS
4.1
Specifications
4.1.1
4.2
Engineering drawing, 50642.
Military Standards
4.2.1
4.2.2
MIL-STD-202F: Test Methods for Electronic and Electrical Component Parts.
MIL-STD-1344A: Test Methods for Electrical Connectors (List other Standards for
Materials, Gold and Tin Lead Platings, etc.).
4.3
Federal Specifications
4.3.1
4.3.2
QQ-N-290 for nickel plating
QQ-N-533 for BeCu strip
4.4
Other Standards and Specifications
4.4.1
4.4.2
UL94-VO
Bellcore, TR-NWT-001217
4.5
FCI Specifications
4.5.1
BUS-12-090 -
4.6
FCI Lab Reports - Supporting Data
4.6.1
GS-29-111
Copyright 2005 FCI
Form E-3334
Rev B 06/06/05
V05-0553
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-111
REVISION
HPC Solderless (Press Fit) Right Angle Receptacle
3 of 10
AUTHORIZED BY
DATE
H
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
5.0
REQUIREMENTS
5.1
Qualification
Connectors furnished under this specification shall be capable of meeting the qualification test
requirements specified herein.
5.2
Material
The material for each component shall be as specified herein or equivalent.
Housings: Glass and Mineral filled LCP
Terminals: Beryllium Copper
Press Blocks: Glass filled PCT Color: White
5.3
Finish
The finish for applicable components shall be as specified herein or equivalent.
5.4
Design and Construction
Connectors shall be of the design, construction, and physical dimensions specified on the applicable
product drawing.
5.4.1
See drawing 50642 for configuration of specific samples tested ie: 50642-1320E.
6.0
ELECTRICAL CHARACTERISTICS
6.1
Contact Resistance, Low Level (LLCR) - The change in low level contact resistance shall not exceed
1.0 milliohm after environmental exposure when measured in accordance with MIL-STD-1344A,
Method 3002.1. The following details shall apply:
(a)
(b)
(c)
6.2
Method of connection - Attach current and voltage leads as shown in Figure 1.
Test Voltage - 20millivolts DC max open circuit.
Test Current - Not to exceed 100 milliamps.
Current Rating - The temperature rise above ambient shall not exceed 30o C at any point in the
system when all contacts are powered at 1.0 amperes or one contact is powered at 3.0 amperes.
The following details shall apply:
(a)
(b)
(c)
Ambient Conditions - Still air at 25o C.
Reference - EIA-364-70.
Test Board P/N 301581
Copyright 2005 FCI
Form E-3334
Rev B 06/06/05
V05-0553
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-111
REVISION
HPC Solderless (Press Fit) Right Angle Receptacle
4 of 10
AUTHORIZED BY
DATE
H
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
6.3
Capacitance - The specification requirement shall be satisfied when evaluated in accordance with
Test Specification BUS-03-114 and the following details.
a. Specification Requirements:
Row 1 =
Row 2 =
Row 3 =
Row 4 =
b.
1.0 pf
1.2 pf
1.3 pf
1.4 pf
Sample Test Conditions:
Frequency
Amplitude
1.0 mhz
1.0 volt
c.
Pin Out & Measurement Points
VIEW: RECEPTACLE SOLDER TAILS
Pin#
Row 4
Row 3
Row 2
Row 1
2
2
3
3
4
4
1
5
0
5
0
5
0
5
0
5
oooooooooMMooooooooMMooooooooMMooooooooMMoooo Long
oooooooooMMooooooooMMooooooooMMooooooooMMoooo
oooooooooMMooooooooMMooooooooMMooooooooMMoooo
oooooooooMMooooooooMMooooooooMMooooooooMMoooo Short
0
0
1
1
MM = Measurement Pair
o = Unused Signal Pin
7.0
MECHANICAL CHARACTERISTICS
7.1
Individual Pin Insertion/Retention Force - The force required to insert an individual compliant pin into
a plated thru hole in a printed circuit board at a rate of 0.2 inches/minute shall not exceed 6.0
pounds. The retention force in the axial direction opposite that of insertion shall not be less than 1.5
pounds.
Copyright 2005 FCI
Form E-3334
Rev B 06/06/05
V05-0553
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-111
REVISION
HPC Solderless (Press Fit) Right Angle Receptacle
5 of 10
AUTHORIZED BY
DATE
H
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
7.2
PCB Hole Deformation Radius - Cross-section parallel to board surface. Photograph and measure
the hole deformation (deformation on board material) radius at a point .010" from the surface, and
the center of the compliant pin section. Include 10 holes. The average (of 10 holes) hole
deformation radius shall be no greater than 0.0015" when measured from the drilled hole. The
absolute maximum deformation radius shall not exceed 0.002". Reference MIL-STD-2166.
PCB Hole Wall Damage - Cross-section perpendicular to the board surface, and thru the compliant
section wear track. Photograph and measure the copper thickness remaining between the compliant
section and the printed wiring board laminate. Include 10 holes. The minimum average (of 10 holes)
copper thickness remaining between the compliant pin and the printed wiring board laminate shall
not be less than 0.0003". In addition there shall be no copper cracks, separations between
conductive interfaces, or laminate-to-copper separations. Reference MIL-STD-2166.
7.3
8.0
ENVIRONMENTAL CONDITIONS
After exposure to the following environmental conditions in accordance with the specified test
procedure and/or details, the product shall show no physical damage and shall meet the electrical
requirements per paragraph 6.1 as specified in the Table 1 test sequences.
8.1
Thermal Shock - MIL-STD-202F, Method 107G.
(a)
(b)
(c)
(d)
8.2
Test Condition - A (100, 1-hour cycles)
Temperature Range - Between -65 and +105 o C.
Time at each temperature - 30 minutes.
Transfer time - 5 minutes, maximum.
Humidity/Temp Cycling - MIL-STD-202F, Method 106F.
(a)
(b)
(c)
Duration - 10 days (ten 24-hour cycles)
Omit step 7b.
Cyclic Temperature Variation - +25 to +65o C.
8.3
High Temperature Life - MIL-STD-202F, Method 108A.
(a)
(b)
Test Temperature - 105o C.
Test Duration - 1000 hours.
8.4
Vibration - MIL-STD-202F, Method 204D.
(a)
(b)
(c)
Condition - B
Vibration Amplitude - 0.06" DA or +/-15G.
Frequency Range - 10 to 2000 to 10 hertz.
Copyright 2005 FCI
Form E-3334
Rev B 06/06/05
V05-0553
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
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