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conga-TCG-HSP-B

产品描述Heat Sinks Standard heatspreader for COM Express module conga-TCG. All standoffs are 2.7mm bore hole.
产品类别热管理产品   
文件大小941KB,共2页
制造商congatec
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conga-TCG-HSP-B概述

Heat Sinks Standard heatspreader for COM Express module conga-TCG. All standoffs are 2.7mm bore hole.

conga-TCG-HSP-B规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
congatec
产品种类
Product Category
Heat Sinks
RoHSDetails
工厂包装数量
Factory Pack Quantity
1

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ERROR PROTECTED RAM
conga-TCG
-
AMD Embedded G-Series SOC APU
-
Power saving „Steppe Eagle“ processors
-
ECC protected memory up to 8 GByte
-
High performance integrated graphics
-
Extended longevity, min. 10 years
Formfactor
CPU
COM Express
®
Compact | (95 x 95 mm) | Type 6 Connector Layout
AMD Embedded G-Series SOC
AMD Embedded GX-420CA
AMD Embedded GX-415GA
AMD Embedded GX-217GA
AMD Embedded GX-209HA*
AMD Embedded GX-210HA
AMD Embedded GX-424CC
AMD Embedded GX-411GA*
AMD Embedded GX-412HC
AMD Embedded GX-212JC
AMD Embedded GX-222GC
*Industrial Temperature Version
2.0 GHz
1.5 GHz
1.65 GHz
1.0 GHz
1.0 GHz
2.4 GHz
1.1 GHz
1.2 GHz | 1.6 GHz (Boost)
1.2 GHz | 1.4 GHz (Boost)
2.2 GHz | 2.4 GHz (Boost)
Quad Core
Quad Core
Dual Core
Dual Core
Dual Core
Quad Core
Quad Core
Quad Core
Dual Core
Dual Core
L2 cache 2MB shared
L2 cache 2MB shared
L2 cache 1MB shared
L2 cache 1MB shared
L2 cache 1MB shared
L2 cache 2MB shared
L2 cache 2MB shared
L2 cache 2MB shared
L2 cache 1MB shared
L2 cache 1MB shared
25W TDP
15W TDP
15W TDP
9W TDP
9W TDP
25W TDP
15W TDP
7W TDP
6W TDP
15W TDP
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
Up to 8 GByte DDR3L-1600 with ECC protection
Integrated in SOC (single-chip)
Gigabit Ethernet
4x PCI Express
2.0 lanes | 2x SATA
®
3Gb/s | 2x USB 3.0 | 8x USB 2.0 | LPC bus | I²C bus (fast mode, 400 kHz, multi-master) | SD | SPI | SM-Bus
High Definition Audio Interface
Integraded AMD Radeon
HD 8000E Graphics supports DirectX 11.1 | OpenGL 4.2 and OpenCL
1.2; up to two simultaneous displays | Unified
Video Decoder 4.2 (H.264, MPEG-2, VC-1, MPEG4 and WMV) | Video Compresion Engine 2.0 (Video conferencing, wireless display, H.264, SVC).
Security Asset Management Unit 2.1 (DRM offloaded from CPU, HDCP2) | VGA
18/24-bit Single/Dual Channel LVDS Interface | Resolutions up to 1920X1200@60Hz | VESA standard or JEIDA data mapping | Automatic Panel
Detection via EDID/EPI
One DisplayPort 1.2 / HDMI 1.4a
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Backlight
AMI Aptio
®
UEFI 2.x firmware | 8 MByte serial SPI firmware flash
The conga-TCG can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and
e-commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 with battery support
Microsoft
®
Windows 10 | Microsoft
®
Windows 10 IoT Enterprise | Microsoft
®
Windows 8 | Microsoft
®
Windows 7 | Linux | Microsoft
®
Windows
®
7/8
Embedded Standard | Microsoft
®
Windows
®
7 Embedded
Compact
Commercial : Operating: 0 to +60°C | Storage: -20 to +80°C
Industrial :
Operating: -40 to +85°C | Storage: -45 to +85°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
95 x 95 mm (3.74” x 3.74”)
LVDS
Digital Display Interface
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Temperature
Humidity
Size
www.congatec.com

conga-TCG-HSP-B相似产品对比

conga-TCG-HSP-B conga-TCG-CSP-B conga-TCG/CSP-T conga-TCG/HSP-T conga-TCG/GX-217GA conga-TCG/i-209HA-2GECC conga-TCG/GX-210HA
描述 Heat Sinks Standard heatspreader for COM Express module conga-TCG. All standoffs are 2.7mm bore hole. Heat Sinks Standard passive cooling solution for COM Express module conga-TCG with 20mm fins. All standoffs are 2.7mm bore hole. Heat Sinks Standard passive cooling solution for COM Express module conga-TCG with 20mm fins. All standoffs are M2.5mm thread. Heat Sinks Standard heatspreader for COM Express module conga-TCG. All standoffs are M2.5 thread. Computer-On-Modules - COM COM Express Type 6 Compact Module based on AMD Embedded GX-217GA SOC with AMD Radeon HD 8280E Graphics (Dual-core, 15W TDP, CPU freq. 1.65GHz, GPU freq. 450MHz) with onboard memory 2GB ECC DDR3L-1600. Computer-On-Modules - COM COM Express Type 6 Compact Module iTemp based on AMD Embedded GX-209HA SOC with AMD Radeon HD 8180E Graphics (Dual-core, 9W TDP Ext Temp, CPU freq. 1.0GHz, GPU freq. 225MHz) with on-board memory 2GB ECC DDR3L-1066. Computer-On-Modules - COM COM Express Type 6 Compact Module based on AMD Embedded GX-210HA SOC with AMD Radeon HD 8210E Graphics (Dual-core, 9W TDP, CPU freq. 1.0GHz, GPU freq. 300MHz) with onboard memory 2GB ECC DDR3L-1333.
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value
制造商
Manufacturer
congatec congatec congatec congatec congatec congatec congatec
产品种类
Product Category
Heat Sinks Heat Sinks Heat Sinks Heat Sinks Computer-On-Modules - COM Computer-On-Modules - COM Computer-On-Modules - COM
RoHS Details Details Details Details Details Details Details
工厂包装数量
Factory Pack Quantity
1 1 1 1 1 1 1
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