Thermal Interface
THERMAL INTERFACE MATERIAL PART NUMBER GUIDE
All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the
factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide
a good thermal link to the heat sink. The “S” series interface materials have adhesives on only one side, for pre-attachment to the heat
sink, and provide superior thermal performance. Specify these materials in applications where the heat sink will be fixed to the electronic
package by some mechanical means other than a tape. Please note that none of these materials are for use in applications requiring
electrical isolation from the electronic device. All options other than -T1 and -T4 are RoHS compliant.
Note: To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the
area of the pad in square inches. For example, a 2” x 2” piece of T4 has a resistance of 1.10 C-in^2/W
Ö
4 in^2=0.275 C/W
“T” SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES
Suffix
-T1
-T1E
-T3
-T4
-T4E
-T5
-T6
-T7
Manufacturer
Product
Chomerics, T405
Chomerics, T405R
Chomerics, T412
Chomerics, T410
Chomerics, T410R
Chomerics, T411
3M, 8810
Bergquist, BP 108
Thermal Impedance
C-in^2/W
0.47
0.47
0.25
1.10
1.10
1.00
0.88
1.28
Thickness,
Inches
0.006
0.006
0.009
0.007
0.007
0.011
0.010
0.008
Package Surface, Comments
Metal/ceramic; aluminum carrier
RoHS-compliant version of -T1
Metal/ceramic; very good
performance and conformity
Plastic
RoHS-compliant version of -T4
Plastic; conforms to out-of-flat packages
Metal/ceramic; very good
adhesion and conformity
Metal/ceramic; electrically insulating
“S” SERIES THERMAL INTERFACE PADS
Suffix
-S4
Manufacturer
Product
Berquist Softface
Thermal Impedance
C-in^2/W
0.06
Thickness,
Inches
0.005
Package Surface, Comments
All surfaces;
requires mechanical fasteners
ORDERING INFORMATION
Once you have chosen heat sink and thermal interface material that meets your thermal & mechanical requirements it is easy to
designate the part number. Simply add the interface material suffix referenced on the chart above to the base part number for the
heat sink. The base part number already includes information regarding its size and finish.
Example:
To order the 658 Series heat sink at .350” tall with the T5 thermal interface material, specify part number:
658-35AB - T5
From Catalog Page ??
From Table on Page ??
3
Integrated Circuit
Heat Sinks
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
624 SERIES
Standard
P/N
624-25AB
624-35AB
624-45AB
624-60AB
Omnidirectional Pin Fin Heat Sink for BGAs
Base Dimensions
in. Sq.
.827 (21)
.827 (21)
.827 (21)
.827 (21)
Fin Height
“A”
in. (mm)
.250 (6.4)
.350 (8.9)
.450 (11.4)
.600 (15.2)
Typical
Applications
21mm BGA
21mm BGA
21mm BGA
21mm BGA
Weight
lbs. (grams)
.009 (4.09)
.011 (4.99)
.015 (6.81)
.026 (11.80)
Material: Aluminum, Black Anodized
The 624 Series is an omnidirectional pin fin heat sink for both natural and
forced-convection applications.
Applications include network routers and switches, high-resolution printers,
digital cameras, consumer video games, digital video disks (DVD) and
global positioning systems (GPS).
PRODUCT FEATURES
•
Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60
inch.
•
Available with pressure sensitive adhesives for quick and easy mounting.
See Page 3
MECHANICAL DIMENSIONS
624 SERIES
624 THERMAL PERFORMANCE
Case-to-Ambient Thermal Resistance, C/W
30
25
20
15
10
5
0
200
300
400
500
600
624-25-T4
624-35-T4
624-45-T4
624-60-T4
Approach Velocity, LFM
Dimensions: in.
625 SERIES
Standard
P/N
Omnidirectional Pin Fin Heat Sink for BGAs
Base Dimensions
in. Sq.
Fin Height
“A”
in. (mm)
0.250 (6.4)
0.350 (8.9)
0.450 (11.4)
0.600 (15.2)
Typical
Applications
25 mm BGA
25 mm BGA
25 mm BGA
25 mm BGA
Weight
lbs. (grams)
.012 (5.45)
.014 (6.36)
.018 (8.17)
.030 (13.62)
625-25AB
.984 (25)
625-35AB
.984 (25)
625-45AB
.984 (25)
625-60AB
.984 (25)
Material: Aluminum, Black Anodized
The 625 Series is an omnidirectional pin fin heat sink for both natural and
forced-convection applications.
Applications include network routers and switches, high-resolution printers,
digital cameras, consumer video games, digital video disks (DVD) and
global positioning systems (GPS).
PRODUCT FEATURES
•
Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60
inch.
•
Available with pressure sensitive adhesives for quick and easy mounting.
See Page 3
MECHANICAL DIMENSIONS
625 SERIES
625 THERMAL PERFORMANCE
Case-to-Ambient Thermal Resistance, C/W
20
18
16
14
12
10
8
6
2
0
4
625-25-T4
625-25-T4
625-45-T4
625-60-T4
200
300
Approach Velocity, LFM
400
500
600
Dimensions: in.
4
Integrated Circuit
Heat Sinks
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
659 SERIES
Standard
P/N
659-65AB
Unidirectional Fin Heat Sink for BGAs
Base Dimensions
in. (mm)
1.45 (36.8) sq
Height
in. (mm)
0.650 (16.5)
Typical
Application
37mm BGA
Heat Sink
Finish
Black Anodized
Weight
lbs. (grams)
0.050 (22.68)
Notes:
1. Optional factory preapplied pressure-sensitive adhesive. See Page 3
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
655 SERIES
Standard
P/N
655-26AB
655-53AB
Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™
Base Dimensions
in. (mm)
1.600 (40.6) sq
1.600 (40.6) sq
Dimension “A”
in. (mm)
0.260 (6.6)
0.525 (13.3)
Dimension “B”
in. (mm)
0.125 (3.2)
0.145 (3.7)
Typical
Applications
40mm BGA
40mm BGA
Heat Sink
Finish
Black Anodized
Black Anodized
Weight
lbs. (grams)
0.038 (17.01)
0.050 (22.68)
Notes:
1. Optional factory preapplied pressure-sensitive adhesive. See Page 3
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
658 SERIES
Standard
P/N
658-25AB
658-35AB
658-45AB
658-60AB
Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™
Base Dimensions
in. (mm)
1.100 (27.9) sq
1.100 (27.9) sq
1.100 (27.9) sq
1.100 (27.9) sq
Dimension “A”
in. (mm)
0.250 (6.4)
0.350 (8.9)
0.450 (11.4)
0.600 (15.2)
Typical
Applications
27mm BGA
27mm BGA
27mm BGA
27mm BGA
Heat Sink
Finish
Black Anodized
Black Anodized
Black Anodized
Black Anodized
Weight
lbs. (grams)
0.013 (5.67)
0.015 (6.70)
0.019 (8.50)
0.031 (14.17)
Notes:
1. Optional factory preapplied pressure-sensitive adhesive. See Page 3
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
KEY:
658-25AB
+
658-35AB
658-45AB
658-60AB
5
Integrated Circuit
Heat Sinks
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
660 SERIES
Standard
P/N
660-29AB
Unidirectional Fin Heat Sink for BGAs
Base Dimensions
in. (mm)
1.530SQ. (38.9)SQ.
Height
in. (mm)
0.285 (7.2)
Typical
Application
37mm BGA
Heat Sink
Finish
Black Anodized
Weight
lbs. (grams)
0.031 (14.17)
Notes:
1. Optional factory preapplied pressure-sensitive adhesive. See Page 3
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
642 SERIES
Standard
P/N
Unidirectional Fin Heat Sink for BGAs
Base Dimensions
in. Sq.
Fin Height "A"
in. (mm)
.250 (6.4)
.350 (8.9)
.450 (11.4)
.600 (15.2)
Typical
Applications
35 mm BGA
35 mm BGA
35 mm BGA
35 mm BGA
Weight
lbs. (grams)
.022 (9.99)
.027 (12.26)
.031 (14.07)
.039 (17.71)
642-25AB
1.378 (35)
642-35AB
1.378 (35)
642-45AB
1.378 (35)
642-60AB
1.378 (35)
Material: Aluminum, Black Anodized
The 642 Series is an unidirectional pin fin heat sink for both natural and
forced-convection applications.
PRODUCT FEATURES
•
Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch.
•
Available with pressure sensitive adhesives for quick and easy mounting.
See Page 3
Applications include network routers and switches, high-resolution printers,
digital cameras, consumer video games, digital video disks (DVD) and global
positioning systems (GPS).
MECHANICAL DIMENSIONS
642 SERIES
Case-to-Ambient Thermal Resistance, C/W
14
12
10
8
6
4
2
0
200
642 THERMAL PERFORMANCE
642-25-T4
642-35-T4
642-45-T4
642-60-T4
300
Performance shown is with T4 thermal adhesive applied.
Approach Velocity, LFM
400
500
600
Dimensions: in. (mm)
6
Integrated Circuit
Heat Sinks
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
662 SERIES
Standard
P/N
662-15AG
662-15AB
Omnidirectional Pin Fin Heat Sink for Limited Height BGAs
Base Dimensions
in. (mm)
1.713 (43.5) sq
1.713 (43.5) sq
Height
in. (mm)
0.150 (3.8)
0.150 (3.8)
Typical
Applications
45mm BGA
45mm BGA
Heat Sink
Finish
Gold Iridite
Black Anodized
Weight
lbs. (grams)
0.019 (8.50)
0.019 (8.50)
Notes:
1. Optional factory preapplied pressure-sensitive adhesive. See Page 3
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
628 SERIES
Standard
P/N
628-20AB
628-25AB
628-35AB
628-40AB
628-65AB
Omnidirectional Pin Fin Heat Sink for BGAs
Base Dimensions
in. (mm)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
Dimensions “A”
in. (mm)
0.200 (5.1)
0.250 (6.4)
0.350 (8.9)
0.400 (10.2)
0.650 (16.5)
Typical
Applications
45mm BGA
45mm BGA
45mm BGA
45mm BGA
45mm BGA
Heat Sink
Finish
Black Anodized
Black Anodized
Black Anodized
Black Anodized
Black Anodized
Weight
lbs. (grams)
0.031 (14.17)
0.038 (17.01)
0.044 (19.84)
0.050 (22.68)
0.056 (25.51)
Notes:
1. Optional factory preapplied pressure-sensitive adhesive. See Page 3
NATURAL CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
KEY:
L
628-20AB
G
628-25AB
L
628-35AB
G
628-40AB
I
628-65AB
7
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