905-29-2-15-2-B-0在线购买

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905-29-2-15-2-B-0概述

Heat Sinks CHIPSET H/S PIN FIN 29mm 14.6mm H B/A

901-910 SERIES CHIPSET HEAT SINKS

PIN FIN &

ELLIPTICAL

HEAT SINKS

Wakefield-Vette’s 901-910 Series Heat Sinks

for Chipset can match up to devices from

Intel, Broadcom, Xilinx. TI, Motorola and

many more! These heat sinks are designed

for air flow applications. Enclosed pages

have thermal performance data for natural

forced convection values.

4 Springs at

each corner

Wakefield-Vette heat sink assembles onto

chip set using the space that is between the

PCB and the substrate of the solder balls.

The solder balls provide a minimal gap of

.5mm to .7mm. Attachment feature is below

a .4mm thickness. The clipping system will

not interfere or damage chip. Contact area

is the edge of chip.

Thermal Cooling Solutions from SMART to FINISH

器件捷径: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ