Faster, smaller computers and mobile devices that put the
world at users’ fingertips and in their pockets. Advanced
LED lights that use less energy while making displays
brighter than ever. Next-generation batteries that power
the electric car revolution. What do all these advances
have in common? None of them would be possible
without effective technologies for managing heat.
Heat is an unavoidable byproduct of electronic device
operation, but it can degrade performance and even
damage components if allowed to build unchecked. To
help your designs keep their cool, we’ve developed a full
portfolio of thermal management materials with proven
ability to absorb and redirect heat away from critical parts.
Our solutions include thermally conductive tapes,
interface pads, epoxies, greases and more. All are based
on decades of pioneering research and experience in
thermal management technologies for consumer, medical,
industrial and military electronics. And no matter your
application, our experts are ready to help you solve
your toughest thermal management challenges, with
comprehensive support and time-tested knowledge.
Light weight, high efficiency
solutions for speeding assembly,
improving device reliability and
extending component life.
With their smart mix of properties including excellent thermal
and electrical performance, versatility and cost effectiveness,
3M
™
Thermal Management Materials can help you meet your
toughest design challenges.
Conductive Interface Tapes
•
3M Thermally
thin, highly conformable thermal
A full range of
™
3M thermal management materials are
designed to solve a wide range of heat-
related challenges, efficiently
and economically:
Engineered for:
Thermal
conductivity
To give you:
3M
•
Soft,
Thermally Conductive Interface Pads
conformable thermal interface pads
™
interface and heat spreading tapes with high
adhesion and excellent thermal conductivity.
They apply quickly and easily, and their
good dielectric strength make them
appropriate for a wide variety of
applications including bonding
heat sinks, heat spreaders
and other cooling
devices to IC packages,
power transistors and
other heat generating
components.
Effective transfer of
heat from components
to cooling devices
and systems
>
Conformability
The flexibility to
place materials
with precision and
channel heat even
in tight spaces
>
>
>
>
Dielectric
strength
>
>
>
>
>
>
>
>
Peace of mind that
your materials will
perform as intended
without electrical
interference or
breakdown in
insulating properties
3M
Conductive Epoxies
•
These
Thermally
liquid adhesives offer robust
low odor
™
with high thermal conductivity and
dielectric strength. They can be
die cut to fit individual applications,
making them ideal for use in LEDs,
automotive batteries, notebook
thermal modules and more. All pads
are UL listed and available in both
silicone and acrylic varieties.
Versatility
The ability to find the
right solution for your
specific application
3M Thermally Conductive
•
A range of high-performance
Greases
thermal
™
strength plus an ultra-thin bond line for low
thermal impedance even in tight micro-spaces.
They dispense easily for efficiency in
both high output, in-line automated
manufacturing and manual application
processes.
Efficiency
greases that are designed to provide
efficient and cost-effective transfer of
thermal energy from heat source to heat
sink. Based on proprietary 3M technology,
both standard and low viscosity products
are available to meet device needs for
processor chips, graphic chips, high power
LEDs and more.
Helps in effective
control of heat without
adding bulk to your
designs or complexity
to your manufacturing
processes
Cost
effectiveness
More performance
from less materials for
a longer-lasting budget
Let’s get started – together
Not sure which thermal management solution is right for your particular
application? Our team of experienced professionals will help you work
through the nuances of selecting materials that can keep your devices
cooler and performing at their full potential. For applications with a high
degree of complexity and individualized needs, we offer these materials
in custom shapes, sizes and quantities. For more information, refer to
our Production Selection Guides and Technical Data Sheets, available
on our website.
Visit
3M.com/Electronics
to learn more and get started today.
Regulatory:
For regulatory information about this product, contact your 3M representative.
Technical Information:
The technical information, recommendations and other statements contained in this document are based upon tests or experience
that 3M believes are reliable, but the accuracy or completeness of such information is not guaranteed.
Product Use:
Many factors beyond 3M’s control and uniquely within user’s control can affect the use and performance of a 3M product in a particular
application. Given the variety of factors that can affect the use and performance of a 3M product, user is solely responsible for evaluating the 3M product and
determining whether it is fit for a particular purpose and suitable for user’s method of application.
Warranty, Limited Remedy, and Disclaimer:
Unless an additional warranty is specifically stated on the applicable 3M product packaging or product literature,
3M warrants that each 3M product meets the applicable 3M product specification at the time 3M ships the product. 3M MAKES NO OTHER WARRANTIES
OR CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR
FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE
OR TRADE. If the 3M product does not conform to this warranty, then the sole and exclusive remedy is, at 3M’s option, replacement of the 3M product or
refund of the purchase price.
Limitation of Liability:
Except where prohibited by law, 3M will not be liable for any loss or damage arising from the 3M product, whether direct, indirect,
special, incidental or consequential, regardless of the legal theory asserted, including warranty, contract, negligence or strict liability.
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