19-3275; Rev 3; 10/07
USB On-the-Go Transceivers and Charge Pumps
General Description
The MAX3301E/MAX3302E fully integrated USB On-the-
Go (OTG) transceivers and charge pumps allow mobile
devices such as PDAs, cellular phones, and digital
cameras to interface directly with USB peripherals and
each other without the need of a host PC. Use the
MAX3301E/MAX3302E with an embedded USB host to
directly connect to peripherals such as printers or
external hard drives.
The MAX3301E/MAX3302E integrate a USB OTG trans-
ceiver, a V
BUS
charge pump, a linear regulator, and an
I
2
C-compatible, 2-wire serial interface. An internal level
shifter allows the MAX3301E/MAX3302E to interface
with +1.65V to +3.6V logic supply voltages. The
MAX3301E/MAX3302E’s OTG-compliant charge pump
operates with +3V to +4.5V input supply voltages, and
supplies an OTG-compatible output on V
BUS
while
sourcing more than 8mA of output current.
The MAX3301E/MAX3302E enable USB OTG communi-
cation from highly integrated digital devices that cannot
supply or tolerate the +5V V
BUS
levels that USB OTG
requires. The device supports USB OTG session-request
protocol (SRP) and host-negotiation protocol (HNP).
The MAX3301E/MAX3302E provide built-in ±15kV elec-
trostatic-discharge (ESD) protection for the V
BUS
, ID_IN,
D+, and D- terminals. The MAX3301E/MAX3302E are
available in 25-bump chip-scale (UCSP™), 25-bump
WLP package, 28-pin TQFN, and 32-pin TQFN pack-
ages and operate over the extended -40°C to +85°C
temperature range.
Features
o
USB 2.0-Compliant Full-/Low-Speed OTG
Transceivers
o
Ideal for USB On-the-Go, Embedded Host, or
Peripheral Devices
o
±15kV ESD Protection on ID_IN, V
BUS
, D+, and D-
Terminals
o
Charge Pump for V
BUS
Signaling and Operation
Down to 3V
o
Internal V
BUS
and ID Comparators
o
Internal Switchable Pullup and Pulldown
Resistors for Host/Peripheral Functionality
o
I
2
C Bus Interface with Command and Status
Registers
o
Linear Regulator Powers Internal Circuitry and
D+/D- Pullup Resistors
o
Support SRP and HNP
MAX3301E/MAX3302E
Ordering Information
PART
MAX3301EEBA-T
MAX3301EETJ
MAX3302EEBA-T*
MAX3302EETI
MAX3302EEWA+T
PACKAGE
SIZE
(mm)
2.5 x 2.5
5x5
2.5 x 2.5
4x4
2.54 x 2.54
PIN-
PACKAGE
25 UCSP
‡
32 TQFN-EP**
25 UCSP
‡
28 TQFN-EP**
25 WLP
PKG
CODE
B25-1
T3255-4
B25-1
T2844-1
W252A2-1
Selector Guide
I
2
C ADDRESSES FOR
PART
POWER-UP STATE
†
SPECIAL-FUNCTION
REGISTER 2
MAX3301E
Shutdown (sdwn = 1,
bit 0 of special-
function register 2)
Operating (sdwn = 1,
bit 0 of special-
function register 2)
16h, 17h
MAX3302E
†
The
10h, 11h, and 16h, 17h
Note:
All devices specified over the -40°C to +85°C operating
range.
‡
UCSP bumps are in a 5 x 5 array. The UCSP package size is
2.5mm x 2.5mm x 0.62mm. Requires solder temperature profile
described in the Absolute Maximum Ratings section. UCSP reli-
ability is integrally linked to the user’s assembly methods, circuit
board material and environment. See the UCSP Applications
Information section of this data sheet for more information.
*Future
product—contact factory for availability.
**EP
= Exposed paddle.
T = Tape and reel.
+Denotes
a lead-free package.
MAX3301E powers up in its lowest power state and the
MAX3302E powers up in the operational, VP/VM USB mode.
Applications
Mobile Phones
PDAs
Digital Cameras
MP3 Players
Pin Configurations appear at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
USB On-the-Go Transceivers and Charge Pumps
MAX3301E/MAX3302E
ABSOLUTE MAXIMUM RATINGS
All voltages are referenced to GND.
V
CC
, V
L
.....................................................................-0.3V to +6V
TRM (regulator off or supplied by V
BUS
) ..-0.3V to (V
BUS
+ 0.3V)
TRM (regulator supplied by V
CC
)...............-0.3V to (V
CC
+ 0.3V)
D+, D- (transmitter tri-stated) ...................................-0.3V to +6V
D+, D- (transmitter functional)....................-0.3V to (V
CC
+ 0.3V)
V
BUS
.........................................................................-0.3V to +6V
ID_IN, SCL, SDA.......................................................-0.3V to +6V
INT,
SPD,
RESET,
ADD,
OE/INT,
RCV, VP,
VM, SUS, DAT_VP, SE0_VM ......................-0.3V to (V
L
+ 0.3V)
C+.............................................................-0.3V to (V
BUS
+ 0.3V)
C-................................................................-0.3V to (V
CC
+ 0.3V)
Short-Circuit Duration, V
BUS
to GND .........................Continuous
Continuous Power Dissipation (T
A
= +70°C)
25-Bump WLP (derate 12.2mW/°C above +70°C).......976mW
25-Bump UCSP (derate 12.2mW/°C above +70°C) ....976mW
32-Pin TQFN (5mm x 5mm x 0.8mm) (derate 21.3mW/°C
above +70°C).........................................................1702mW
28-Pin TQFN (4mm x 4mm x 0.8mm) (derate 20.8mW/°C
above +70°C).........................................................1666mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Reflow Temperature (Note 1)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C
Note 1:
The UCSP package is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the
device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is
required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +3V to +4.5V, V
L
= +1.65V to +3.6V, C
FLYING
= 100nF, C
VBUS
= 1µF, ESR
CVBUS
= 0.1Ω (max), T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at V
CC
= +3.7V, V
L
= +2.5V, T
A
= +25°C.) (Note 2)
PARAMETER
Supply Voltage
TRM Output Voltage
Logic Supply Voltage
V
L
Supply Current
V
CC
Operating Supply Current
V
CC
Supply Current During Full-
Speed Idle
V
CC
Shutdown Supply Current
V
CC
Interrupt Shutdown Supply
Current
V
CC
Suspend Supply Current
LOGIC I/O
RCV, DAT_VP, SE0_VM,
INT,
OE/INT,
VP, VM Output High
Voltage
RCV, DAT_VP, SE0_VM,
INT,
OE/INT,
VP, VM Output Low
Voltage
OE/INT,
SPD, SUS,
RESET,
DAT_VP, SE0_VM Input High
Voltage
V
OH
I
OUT
= 1mA (sourcing)
V
L
- 0.4
V
I
CC(SHDN)
I
CC(ISHDN)
ID_IN unconnected or high
USB suspend mode, ID_IN unconnected or high
SYMBOL
V
CC
V
TRM
V
L
I
VL
I
CC
I
2
C interface in steady state
USB normal mode, C
L
= 50pF, device
switching at full speed
V
VBUS_DRV
= 1, I
VBUS
= 0
V
VBUS_DRV
= 0, D+ = high, D- = low
1.4
0.5
3.5
20
170
CONDITIONS
MIN
3.0
3.0
1.65
TYP
MAX
4.5
3.6
3.60
5
10
2
0.8
10
30
500
UNITS
V
V
V
µA
mA
mA
µA
µA
µA
V
OL
I
OUT
= 1mA (sinking)
0.4
V
V
IH
2/3 x V
L
V
2
_______________________________________________________________________________________
USB On-the-Go Transceivers and Charge Pumps
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +3V to +4.5V, V
L
= +1.65V to +3.6V, C
FLYING
= 100nF, C
VBUS
= 1µF, ESR
CVBUS
= 0.1Ω (max), T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at V
CC
= +3.7V, V
L
= +2.5V, T
A
= +25°C.) (Note 2)
PARAMETER
OE/INT,
SPD, SUS,
RESET
DAT_VP, SE0_VM Input Low
Voltage
ADD Input High Voltage
ADD Input Low Voltage
Input Leakage Current
TRANSCEIVER SPECIFICATIONS
Differential Receiver Input
Sensitivity
Differential Receiver Common-
Mode Voltage
Single-Ended Receiver Input Low
Voltage
Single-Ended Receiver Input
High Voltage
Single-Ended Receiver Hysteresis
Single-Ended Output Low Voltage
Single-Ended Output High Voltage
Off-State Leakage Current
Driver Output Impedance
ESD PROTECTION (V
BUS
, ID_IN, D+, D-)
Human Body Model
IEC 61000-4-2 Air-Gap Discharge
IEC 61000-4-2 Contact Discharge
THERMAL SHUTDOWN
Thermal Shutdown Low-to-High
Thermal Shutdown High-to-Low
CHARGE-PUMP SPECIFICATIONS (vbus_drv = 1)
V
BUS
Output Voltage
V
BUS
Output Current
V
BUS
Output Ripple
V
BUS
I
VBUS
I
VBUS
= 8mA, C
VBUS
= 10µF
3V < V
CC
< 4.5V, C
VBUS
= 10µF, I
VBUS
= 8mA
4.80
8
100
5.25
V
mA
mV
+160
+150
o
o
MAX3301E/MAX3302E
SYMBOL
V
IL
CONDITIONS
MIN
TYP
MAX
0.4
UNITS
V
V
IHA
V
ILA
2/3 x V
L
1/3 x V
L
±1
V
V
µA
|V
D+
- V
D-
|
0.2
0.8
2.5
0.8
2.0
0.2
V
V
V
V
V
0.3
V
V
µA
Ω
3.6
±1
13
13
±15
±10
±6
V
ILD
V
IHD
D+, D-
D+, D-
V
OLD
V
OHD
D+, D-, R
L
= 1.5kΩ from D+ or D- to 3.6V
D+, D-, R
L
= 15kΩ from D+ or D- to GND
D+, D-
D+, D-, not
including R
EXT
Low steady-state drive
High steady-state drive
2
2
2.8
kV
kV
kV
C
C
_______________________________________________________________________________________
3
USB On-the-Go Transceivers and Charge Pumps
MAX3301E/MAX3302E
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +3V to +4.5V, V
L
= +1.65V to +3.6V, C
FLYING
= 100nF, C
VBUS
= 1µF, ESR
CVBUS
= 0.1Ω (max), T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at V
CC
= +3.7V, V
L
= +2.5V, T
A
= +25°C.) (Note 2)
PARAMETER
Switching Frequency
V
BUS
Leakage Voltage
V
BUS
Rise Time
V
BUS
Pulldown Resistance
V
BUS
Pullup Resistance
V
BUS
Input Impedance
COMPARATOR SPECIFICATIONS
V
BUS
Valid Comparator Threshold
V
BUS
Valid Comparator Hysteresis
Session-Valid Comparator
Threshold
Session-End Comparator
Threshold
dp_hi Comparator Threshold
dm_hi Comparator Threshold
cr_int Pulse Width
cr_int Comparator Threshold
ID_IN SPECIFICATIONS
ID_IN Input Voltage for Car Kit
ID_IN Input Voltage for A Device
ID_IN Input Voltage for B Device
ID_IN Input Impedance
ID_IN Input Leakage Current
ID_IN Pulldown Resistance
D+ Pulldown Resistor
D- Pulldown Resistor
D+ Pullup Resistor
D- Pullup Resistor
Z
ID_IN
ID_IN = V
CC
id_pulldown = 1
dp_pulldown = 1
dm_pulldown = 1
dp_pullup = 1
dm_pullup = 1
14.25
14.25
1.425
1.425
0.9 x
V
CC
70
-1
150
15
15
1.5
1.5
100
130
+1
300
15.75
15.75
1.575
1.575
0.2 x
V
CC
0.8 x
V
CC
0.1 x
V
CC
V
V
V
kΩ
µA
Ω
kΩ
kΩ
kΩ
kΩ
0.4
V
TH-VBUS
V
HYS-VBUS
V
TH-
SESS_VLD
SYMBOL
f
SW
CONDITIONS
V
VBUS_DRV
= 0
C
VBUS
= 10µF, I
VBUS
= 8mA, measured
from 0 to +4.4V
V
VBUS_DISCHRG
= 1, V
VBUS_DRV
= 0,
V
VBUS_CHRG
= 0
V
VBUS_CHRG
= 1, V
VBUS_DRV
= 0,
V
VBUS_DISCHRG
= 0
MIN
TYP
390
MAX
0.2
100
UNITS
kHz
V
ms
kΩ
Ω
kΩ
3.8
650
40
5
930
70
6.5
1250
100
Z
INVBUS
V
VBUS_DISCHRG
= 0, V
VBUS_DRV
= 0,
V
VBUS_CHRG
= 0
4.4
4.6
50
4.8
V
mV
0.8
0.2
0.8
0.8
1.4
0.5
1.3
1.3
750
0.5
2.0
0.8
2.0
2.0
0.6
V
V
V
V
ns
V
V
TH-
SESS_END
TERMINATING RESISTOR SPECIFICATIONS (D+, D-)
4
_______________________________________________________________________________________
USB On-the-Go Transceivers and Charge Pumps
MAX3301E/MAX3302E
TIMING CHARACTERISTICS
(V
CC
= +3V to +4.5V, V
L
= +1.65V to +3.6V, C
FLYING
= 100nF, C
VBUS
= 1µF, ESR
CVBUS
= 0.1Ω (max), T
A
= T
MIN
to T
MAX
, unless
otherwise noted. Typical values are at V
CC
= +3.7V, V
L
= +2.5V, T
A
= +25°C.) (Note 2)
PARAMETER
D+, D- Rise Time
D+, D- Fall Time
Rise-/Fall-Time Matching
Output-Signal Crossover Voltage
D+, D- Rise Time
D+, D- Fall Time
Rise-/Fall-Time Matching
Output-Signal Crossover Voltage
Driver Propagation Delay
(DAT_VP, SE0_VM to D+, D-)
Driver Disable Delay
Driver Enable Delay
V
CRS_L
t
PLH
t
PHL
t
PDZ
t
PZD
TRANSMITTER TIMING (FULL-SPEED MODE)
Low-to-high, Figures 2 and 6
High-to-low, Figures 2 and 6
Figures 1 and 8
Figures 2 and 8
25
25
25
25
ns
ns
ns
V
CRS_F
t
R
t
F
SYMBOL
t
R
t
F
CONDITIONS
Figures 2 and 5
Figures 2 and 5
Figures 2 and 5 (Note 3)
Figures 2, 6, and 7 (Note 3)
Figures 2 and 5
Figures 2 and 5
Figures 2 and 5
Figures 2, 6, and 7
MIN
4
4
90
1.3
75
75
80
1.3
TYP
MAX
20
20
110
2.0
300
300
125
2.0
UNITS
ns
ns
%
V
ns
ns
%
V
TRANSMITTER CHARACTERISTICS (FULL-SPEED MODE)
TRANSMITTER CHARACTERISTICS (LOW-SPEED MODE)
TRANSMITTER TIMING (LOW-SPEED MODE) (Low-speed delay timing is dominated by the slow rise and fall times.)
SPEED-INDEPENDENT TIMING CHARACTERISTICS
Receiver Disable Delay
Receiver Enable Delay
D+ Pullup Assertion Time
RCV Rise Time
RCV Fall Time
Differential-Receiver Propagation
Delay
Single-Ended-Receiver
Propagation Delay
Interrupt Propagation Delay
V
BUS_CHRG
Propagation Delay
Time to Exit Shutdown
Shutdown Delay
Dominated by the V
BUS
rise time
0.2
1
10
t
R
t
F
t
PHL
, t
PLH
t
PHL
, t
PLH
t
PVZ
t
PZV
Figure 4
Figure 4
During HNP
Figures 3 and 5, C
L
= 15pF
Figures 3 and 5, C
L
= 15pF
Figures 3 and 10, |D+ - D-| to DAT_VP
Figures 3 and 9, |D+ - D-| to RCV
Figures 3 and 9, D+, D- to DAT_VP,
SE0_VM
4
4
30
30
30
100
30
30
3
ns
ns
µs
ns
ns
ns
ns
µs
µs
µs
µs
_______________________________________________________________________________________
5
NXP MCU
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