Switching Voltage Regulators Dual SPST, Low Charge Injection Analog Switch
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -15 V |
| 正常位置 | NO |
| 信道数量 | 1 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 标称断态隔离度 | 54 dB |
| 通态电阻匹配规范 | 8 Ω |
| 最大通态电阻 (Ron) | 40 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5,+-15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 200 ns |
| 最长接通时间 | 400 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| IH5048MJE | IH5051C-D | IH5048CPE | IH5049C-D | IH5051CPE- | IH5048CWE-T | IH5051CWE-T | IH5048CJE | IH5048C-D | IH5051CPE | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Switching Voltage Regulators Dual SPST, Low Charge Injection Analog Switch | Analog Switch ICs Low Charge Injection Dual SPDT Analog Switch | Multiplexer Switch ICs Dual SPST, Low Charge Injection Analog Switch | Analog Switch ICs | Multiplexer Switch ICs Low Charge Injection Dual SPST Normally Open Analog Switch | Analog Switch ICs Low Charge Injection Dual SPDT Analog Switch | Multiplexer Switch ICs Low Charge Injection Dual SPST Normally Open Analog Switch | Multiplexer Switch ICs Low Charge Injection Dual SPST Normally Open Analog Switch | Analog Switch ICs Low Charge Injection Dual SPDT Analog Switch | |
| 是否无铅 | 含铅 | - | 含铅 | - | - | 含铅 | 含铅 | 含铅 | - | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | - | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
| 零件包装代码 | DIP | - | DIP | - | - | SOIC | SOIC | DIP | - | DIP |
| 包装说明 | CERDIP-16 | - | PLASTIC, DIP-16 | - | - | SO-16 | SO-16 | CERDIP-16 | - | DIP, DIP16,.3 |
| 针数 | 16 | - | 16 | - | - | 16 | 16 | 16 | - | 16 |
| Reach Compliance Code | not_compliant | - | not_compliant | - | - | not_compliant | not_compliant | not_compliant | - | not_compliant |
| 模拟集成电路 - 其他类型 | SPST | - | SPST | - | - | SPST | SPDT | SPST | - | SPDT |
| JESD-30 代码 | R-GDIP-T16 | - | R-PDIP-T16 | - | - | R-PDSO-G16 | R-PDSO-G16 | R-GDIP-T16 | - | R-PDIP-T16 |
| JESD-609代码 | e0 | - | e0 | - | - | e0 | e0 | e0 | - | e0 |
| 湿度敏感等级 | 1 | - | 1 | - | - | 1 | 1 | 1 | - | 1 |
| 标称负供电电压 (Vsup) | -15 V | - | -15 V | - | - | -15 V | -15 V | -15 V | - | -15 V |
| 信道数量 | 1 | - | 1 | - | - | 1 | 1 | 1 | - | 1 |
| 功能数量 | 2 | - | 2 | - | - | 2 | 2 | 2 | - | 2 |
| 端子数量 | 16 | - | 16 | - | - | 16 | 16 | 16 | - | 16 |
| 标称断态隔离度 | 54 dB | - | 50 dB | - | - | 50 dB | 50 dB | 50 dB | - | 50 dB |
| 通态电阻匹配规范 | 8 Ω | - | 8 Ω | - | - | 8 Ω | 8 Ω | 8 Ω | - | 8 Ω |
| 最大通态电阻 (Ron) | 40 Ω | - | 45 Ω | - | - | 45 Ω | 45 Ω | 45 Ω | - | 45 Ω |
| 最高工作温度 | 125 °C | - | 70 °C | - | - | 70 °C | 70 °C | 70 °C | - | 70 °C |
| 输出 | SEPARATE OUTPUT | - | SEPARATE OUTPUT | - | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | - | - | SOP | SOP | DIP | - | DIP |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | - | - | SOP16,.4 | SOP16,.4 | DIP16,.3 | - | DIP16,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | - | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | - | 240 | - | - | 245 | 240 | 240 | - | 240 |
| 电源 | 5,+-15 V | - | 5,+-15 V | - | - | 5,+-15 V | 5,+-15 V | 5,+-15 V | - | 5,+-15 V |
| 认证状态 | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 5.08 mm | - | 4.572 mm | - | - | 2.65 mm | 2.65 mm | 5.08 mm | - | 4.572 mm |
| 标称供电电压 (Vsup) | 15 V | - | 15 V | - | - | 15 V | 15 V | 15 V | - | 15 V |
| 表面贴装 | NO | - | NO | - | - | YES | YES | NO | - | NO |
| 最长断开时间 | 200 ns | - | 300 ns | - | - | 300 ns | 300 ns | 300 ns | - | 300 ns |
| 最长接通时间 | 400 ns | - | 600 ns | - | - | 600 ns | 600 ns | 600 ns | - | 600 ns |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | CMOS | - | - | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | MILITARY | - | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | - | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn85Pb15) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | - | - | GULL WING | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | - | - | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | - | - | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | - | - | NOT SPECIFIED | NOT SPECIFIED | 20 | - | 20 |
| 宽度 | 7.62 mm | - | 7.62 mm | - | - | 7.5 mm | 7.5 mm | 7.62 mm | - | 7.62 mm |
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