NOTICE OF REVISION (NOR)
(See MIL-STD-480 for instructions)
This revision described below has been authorized for the document listed.
DATE (YYMMDD)
Form Approved
OMB No. 0704-0188
92-02-13
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1. ORIGINATOR NAME AND ADDRESS
Defense Electronics Supply Center
Dayton, Ohio 45444-5277
2. CAGE CODE
67268
4. CAGE CODE
67268
6. TITLE OF DOCUMENT
MICROCIRCUIT, DIGITAL, CMOS, 256K X 1 SRAM (LOW POWER), MONOLITHIC SILICON
7. REVISION LETTER
(Current)
8. ECP NO.
A
(New)
B
3. NOR NO.
5962-R144-92
5. DOCUMENT NO.
5962-88544
9. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES
10. DESCRIPTION OF REVISION
Sheet 1:
Revisions ltr column; add B
Revisions description column; add "Changes in accordance with NOR 5962-R144-92".
Revisions date column; add "92-02-13".
Sheet 15: Paragraph 4.2: Change the method number for screening from "5008" to "5004".
11. THIS SECTION FOR GOVERNMENT USE ONLY
a. CHECK ONE
A
X
B
EXISTING DOCUMENT SUPPLEMENTED
BY THIS NOR MAY BE USED IN
MANUFACTURE.
b. ACTIVITY AUTHORIZED TO APPROVE
CHANGE FOR GOVERNMENT
DESC-ECS
A B
REVISED DOCUMENT MUST BE
RECEIVED BEFORE MANUFACTURER
MAY INCORPORATE THIS CHANGE.
A B
CUSTODIAN OF MASTER DOCUMENT
SHALL MAKE ABOVE REVISION AND
FURNISH REVISED DOCUMENT TO:
SIGNATURE AND TITLE
Michael Frye
BRANCH CHIEF
REVISION COMPLETED (Signature)
Jeff Bowling
DATE (YYMMDD)
92-02-13
DATE (YYMMDD)
92-02-13
12. ACTIVITY ACCOMPLISHING
REVISION
DESC-ECS
DD Form 1695, JUL 88
Previous editions are obsolete.
REVISIONS
LTR
A
DESCRIPTION
Added case outline letter Y. Added CAGE numbers 6Y440 and 75569
to devices 01 through 04. Editorial changes throughout.
DATE
(YR-MO-DA)
91-11-05
APPROVED
M. A. Frye
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
A
15
A
16
A
17
REV
SHEET
PREPARED BY
Charles Reusing
A
1
A
2
A
3
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
PMIC N/A
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
STANDARDIZED
MILITARY
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles Reusing
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
1 AUGUST 1988
SIZE
CAGE CODE
REVISION LEVEL
A
MICROCIRCUITS, DIGITAL, CMOS, 256K X 1 SRAM
(LOW POWER), MONOLITHIC SILICON
AMSC N/A
A
SHEET
67268
1
OF
5962-88544
17
DESC FORM 193
JUL 91
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E1466
1. SCOPE
1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883,
"Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-88544
01
L
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish per
MIL-M-38510
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
04
Generic number
(See 6.6)
(See 6.6)
(See 6.6)
(See 6.6)
Circuit function
256K X 1 low power CMOS SRAM
256K X 1 low power CMOS SRAM
256K X 1 low power CMOS SRAM
256K X 1 low power CMOS SRAM
Access time
35 ns
45 ns
55 ns
70 ns
1.2.2 Case outline(s). The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:
Outline letter
L
X
Y
1.3 Absolute maximum ratings.
Voltage on any input relative to V
SS
Voltage applied to Q - - - - - - - - - - - - - - - - - - - - - - - - -
Storage temperature range - - - - - - - - - - - - - - - - - - - -
Maximum power dissipation (P
D
) - - - - - - - - - - - - - - - -
Lead temperature (soldering, 10 seconds) - - - - - - - - -
Thermal resistance, junction-to-case (
JC
):
Cases L, X, and Y - - - - - - - - - - - - - - - - - - - - - - - - - -
Junction temperature (T
J
) - - - - - - - - - - - - - - - - - - - - - -
-0.5 V dc to +7.0
- -
dc
- - - - - - - - - - - -
V
--
-0.5 V dc to +6.0 V dc
-65
C to +150
C
1.0 W
+260
C
See MIL-M-38510, appendix C
+150
C 1/
Case outline
D-9 (24-lead, 1.280" x .310" x .200"), dual-in-line package
C-11 (28-terminal, .560" x .358" x .120"), rectangular chip carrier package
F-12 (28-lead, .740" x .420" x .130"), flat package
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) - - - - - - - - - - - - - - - - - - - -
Supply voltage range (V
SS
) - - - - - - - - - - - - - - - - - - - -
Input high voltage (V
IH
) - - - - - - - - - - - - - - - - - - - - - - -
Input low voltage (V
IL
) - - - - - - - - - - - - - - - - - - - - - - - -
Case operating temperature range (T
C
) - - - - - - - - - - - -
4.5 V dc to 5.5 V dc
0 V dc
2.2 V dc to +6.0 V dc
-0.5 V dc to +0.8 V dc 2/
-55
C to +125
C
1/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in
screening conditions in accordance with method 5004 of MIL-STD-883.
2/ V
IL
minimum = -3.0 V dc for pulse width less than 20 ns.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DESC FORM 193A
JUL 91
A
REVISION LEVEL
A
5962-88544
SHEET
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standard, and bulletin. Unless otherwise specified, the following specification, standard, and
bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the
solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATION
MILITARY
MIL-M-38510 - Microcircuits, General Specification for.
STANDARD
MILITARY
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
BULLETIN
MILITARY
MIL-BUL-103 - List of Standardized Military Drawings (SMD's).
(Copies of the specification, standard, and bulletin required by manufacturers in connection with specific acquisition functions
should be obtained from the contracting activity or as directed by the contracting activity.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing shall take precedence.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the
use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-M-38510 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection provided
that each coated microcircuit inspectionlot (see MIL-M-38510, Inspection lot - class B paragraph) shall be subjected to and pass the
internal m oisture content test (method 1018 of MIL-STD-883), the frequency of the internal water vapor testing may not be
decreased unless approved by the preapring activity.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DESC FORM 193A
JUL 91
A
REVISION LEVEL
A
5962-88544
SHEET
3
TABLE IA. Electrical performance characteristics.
Test
Symbol
I
CC1
I
CC2
I
CC3
I
CC4
I
ILK
I
OLK
V
DR
V
OH
V
OL
C
IN
C
OUT
Operating supply current
1/
Standby power supply
current TTL 1/
Standby power supply
current CMOS 1/
Data retention current
1/
Input leakage current,
any input
Off-state output leakage
current
Data retention voltage
Output high voltage
Output low voltage
Input capacitance
Output capacitance
Conditions
-55
C
T
C
+125
C
Group A
Device
V
CC
= 4.5 V to 5.5 V
subgroups
types
V
SS
= 0 V
unless otherwise specified
t
AVAV
= t
AVAV
(minimum),
1,2,3
All
V
CC
= 5.5 V, CE = V
IL
,
all other inputs at V
IL
CE
V
IH
, all other inputs
1,2,3
All
V
IL
or
V
IH
, V
CC
= 5.5 V
f = 0 MHz
CE
(V
CC
-0.2 V), f = 0 MHz,
1,2,3
All
V
CC
= 5.5 V, all other inputs
0.2 V or
(V
CC
-0.2 V)
V
CC
= 2.0 V
1,2,3
All
V
CC
= 5.5 V,
1,2,3
All
V
IN
= 0 V to 5.5 V
V
CC
= 5.5 V,
1,2,3
All
V
IN
= 0 V to 5.5 V
V
IN
0.2 V or
(V
CC
-0.2 V),
1,2,3
All
CE
(V
CC
-0.2 V)
I
OUT
= -4.0 mA, V
CC
= 4.5 V,
1,2,3
All
V
IL
= 0.8 V, V
IH
= 2.2 V
I
OUT
= 8.0 mA, V
CC
= 4.5 V,
1,2,3
All
V
IL
= 0.8 V, V
IH
= 2.2 V
V
IN
= 0 V, f = 1.0 MHz,
4
All
T
C
= +25
C, see 4.3.1c
V
O
= 0 V, f = 1.0 MHz,
4
All
T
C
= +25
C, see 4.3.1c
Limits
Min
Max
100
25
3
900
±10
±10
2.0
2.4
0.4
10.0
12.0
Unit
mA
mA
mA
µA
µA
µA
V
V
V
pF
pF
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DESC FORM 193A
JUL 91
A
REVISION LEVEL
5962-88544
SHEET
4
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