TSC2006 Nano-Power Touch Screen Controller with SPI Serial Interface
| TSC2006 | TSC2006IRTJR | TSC2006IRTJTG4 | TSC2006IRTJRG4 | TSC2006IRTJT | |
|---|---|---|---|---|---|
| 描述 | TSC2006 Nano-Power Touch Screen Controller with SPI Serial Interface | Nano-Power Touch Screen Controller with SPI Serial Interface 20-QFN -40 to 85 | Nano-Power Touch Screen Controller with SPI Serial Interface 20-QFN -40 to 85 | Touch Screen Controllers Nano-Pwr Touch Screen Cntrlr | Nano-Power Touch Screen Controller with SPI Serial Interface 20-QFN -40 to 85 |
| Brand Name | - | Texas Instruments | Texas Instruments | - | Texas Instruments |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | - | QFN | QFN | QFN | QFN |
| 包装说明 | - | HVQCCN, LCC20,.16SQ,20 | HVQCCN, LCC20,.16SQ,20 | HVQCCN, LCC20,.16SQ,20 | HVQCCN, LCC20,.16SQ,20 |
| 针数 | - | 20 | 20 | 20 | 20 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| Factory Lead Time | - | 1 week | 6 weeks | - | 1 week |
| 商用集成电路类型 | - | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
| JESD-30 代码 | - | S-PQCC-N20 | S-PQCC-N20 | S-PQCC-N20 | S-PQCC-N20 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 |
| 长度 | - | 4 mm | 4 mm | 4 mm | 4 mm |
| 湿度敏感等级 | - | 2 | 2 | 2 | 2 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 20 | 20 | 20 | 20 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | - | LCC20,.16SQ,20 | LCC20,.16SQ,20 | LCC20,.16SQ,20 | LCC20,.16SQ,20 |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 1.2/3.6 V | 1.2/3.6 V | 1.2/3.6 V | 1.2/3.6 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | - | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 4 mm | 4 mm | 4 mm | 4 mm |
嵌入式系统
嵌入式系统
FPGA/CPLD
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