TSC2004 Nano-Power Touch Screen Controller with I2C Serial Interface
| 参数名称 | 属性值 |
| SAR sample rate(Max)(kSPS) | 100 |
| Touch panel | 4-Wire |
| SAR ADC resolution(Bits) | 12 |
| Rating | Catalog |
| Approx. price(US$) | 1.75 | 1ku |
| Supply voltage (I/O VDD)(Max) | 3.6 |
| Package Group | DSBGA|24,QFN|20 |
| Supply voltage (analog)(Min) | 1.2 |
| Control interface | I2C |
| Operating temperature range(C) | -40 to 85 |
| Supply voltage (I/O VDD)(Min) | 1.2 |
| Vref (int/ext) | Ext |
| Supply voltage (analog)(Max) | 3.6 |
| Input type | Single-Ended |
| TSC2004 | TSC2004IRTJTG4 | TSC2004IRTJRG4 | TSC2004IYZKT | TSC2004IYZKR | |
|---|---|---|---|---|---|
| 描述 | TSC2004 Nano-Power Touch Screen Controller with I2C Serial Interface | Nano-Power Touch Screen Controller with I2C Serial Interface 20-QFN -40 to 85 | Nano-Power Touch Screen Controller with I2C Serial Interface 20-QFN -40 to 85 | Nano-Power Touch Screen Controller with I2C Serial Interface 24-DSBGA -40 to 85 | Nano-Power Touch Screen Controller with I2C Serial Interface 24-DSBGA -40 to 85 |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | - | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | - | QFN | QFN | BGA | BGA |
| 包装说明 | - | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC24,.16SQ,20 | VFBGA, BGA24,5X5,20 | VFBGA, BGA24,5X5,20 |
| 针数 | - | 20 | 20 | 24 | 24 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| 商用集成电路类型 | - | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
| JESD-30 代码 | - | S-PQCC-N20 | S-PQCC-N20 | S-XBGA-B24 | S-XBGA-B24 |
| JESD-609代码 | - | e4 | e4 | e1 | e1 |
| 长度 | - | 4 mm | 4 mm | 2.795 mm | 2.795 mm |
| 湿度敏感等级 | - | 2 | 2 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 20 | 20 | 24 | 24 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | - | HVQCCN | HVQCCN | VFBGA | VFBGA |
| 封装等效代码 | - | LCC24,.16SQ,20 | LCC24,.16SQ,20 | BGA24,5X5,20 | BGA24,5X5,20 |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 1.2/3.6 V | 1.2/3.6 V | 1.2/3.6 V | 1.2/3.6 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 0.8 mm | 0.8 mm | 1 mm | 1 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | - | NO LEAD | NO LEAD | BALL | BALL |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | - | QUAD | QUAD | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 4 mm | 4 mm | 2.795 mm | 2.795 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
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