REVISIONS
LTR
A
B
C
D
DESCRIPTION
Changes to V
OLS
and V
OHS
tests for device type 02.
Table I; Changed I
CC1
max limit from 250 mA to 310 mA. -sld
Table I; Changed the SRAM supply current (I
CC1
) max limit from 310
mA to 360 mA. -sld
Added case outline 9. Table I; changed the V
OL
test condition I
OL
from 12.0 mA to 8.0 mA . Added note to paragraph 1.2.2 and table I
regarding the 4 transistor design. -sld
Added case outline Y. Updated drawing to reflect current
requirements of MIL-PRF-38534. -sld
Added case outline B. Added note to paragraph 1.2.4. -sld
DATE (YR-MO-DA)
97-09-16
98-06-26
99-08-23
00-09-20
APPROVED
K. A. Cottongim
K. A. Cottongim
Raymond Monnin
Raymond Monnin
E
F
03-03-14
03-11-10
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
F
15
F
16
F
17
F
18
REV
SHEET
PREPARED BY
Gary Zahn
CHECKED BY
Michael C. Jones
F
19
F
20
F
21
F
1
F
22
F
2
F
23
F
3
F
24
F
4
F
25
F
5
F
26
F
6
F
27
F
7
F
28
F
8
F
9
F
10
F
11
F
12
F
13
F
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DEFENSE SUPPLY CENTER COLUMBUS
P. O. BOX 3990
COLUMBUS, OHIO 43216-5000
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY, DUAL, DIGITAL,
SINGLE 128K x 16 BIT STATIC RANDOM ACCESS
MEMORY, WITH SEPARATE DATA BUS AND SINGLE, 128K
x 16-BIT FLASH ERASABLE/PROGRAMMABLE READ ONLY
MEMORY WITH SEPARATE DATA BUS
DRAWING APPROVAL DATE
97-01-27
AMSC N/A
REVISION LEVEL
F
SIZE
A
SHEET
CAGE CODE
67268
1 OF
28
5962-96900
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E014-04
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
-
96900
RHA
designator
(see 1.2.1)
/
01
Device
type
(see 1.2.2)
H
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type 1/
01
02
Generic number
WSF128K16-72Q
WSF128K16-37Q
Circuit function
Single 128K x 16-bit SRAM and
single 128K x 16-bit Flash EPROM
each with separate data buses
Single 128K x 16-bit SRAM and
single 128K x 16-bit Flash EPROM
each with separate data buses
Access time
70 ns (SRAM)
120 ns (EPROM)
35 ns (SRAM)
70 ns (EPROM)
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
G
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
1/
Due to the nature of the 4 transistor design of the die in these device types, topologically pure testing is important,
particularly for high reliability applications. The device manufacturer should be consulted concerning their testing
methods and algorithms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
F
5962-96900
SHEET
2
DSCC FORM 2234
APR 97
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
D
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
B
M
X
Y
9 1/
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
66
66
68
Package style
Ceramic, single cavity, quad flatpack
Ceramic, dual cavity, quad flatpack
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, with standoffs
Co-fired ceramic, single cavity, ultra low
profile, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage range (V
CC
)........................................................
Input voltage range ...................................................................
Power dissipation (P
D
)...............................................................
Storage temperature range .......................................................
Lead temperature (soldering, 10 seconds)................................
Thermal resistance junction-to-case (θ
JC
):
Case outline M .......................................................................
Case outline X........................................................................
Case outline Y........................................................................
Case outline B and 9..............................................................
Data retention (Flash)................................................................
Endurance (Flash).....................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)........................................................
Input low voltage range (V
IL
)......................................................
Input high voltage range (V
IH
)....................................................
Output voltage, high minimum (V
OH
) .........................................
Output voltage, low maximum (V
OL
) ..........................................
Case operating temperature range (T
C
) ....................................
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.2 V dc to V
CC
+ 0.3 V dc
+2.4 V dc
+0.4 V dc
-55°C to +125°C
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
1.4 W maximum
-65°C to +150°C
+300°C
12.8°C/W
8.7°C/W
10.63°C/W
4.57°C/W
10 years minimum
10,000 cycles minimum
1/
2/
Due to the short leads of the case outline 9, caution should be taken if the system application is to be used where
extreme thermal transitions can occur.
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
F
5962-96900
SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, 6, 7, 8 and 9.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
F
5962-96900
SHEET
4
DSCC FORM 2234
APR 97
3.2.5 Block diagram(s). The block diagram(s) shall be as specified on figure 10.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 11.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available
upon request.
3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept
under document control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
F
5962-96900
SHEET
5
DSCC FORM 2234
APR 97
PCB设计
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