REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
E
Removed vendor CAGE numbers 18324, 27014, and 34335. Added
devices 21 and 22. Updated document format, editorial changes
throughout.
Updated boilerplate. Removed vendor CAGE number 50364 from
drawing. - glg
96-06-13
M. A. Frye
F
01-01-11
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
F
15
F
16
F
17
REV
SHEET
PREPARED BY
James Jamison
CHECKED BY
Charles Reusing
F
1
F
2
F
3
F
4
F
5
F
6
F
7
F
8
F
9
F
10
F
11
F
12
F
13
F
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY All DEPARTMENTS
APPROVED BY
Michael. A. Frye
MICROCIRCUIT, MEMORY, BIPOLAR,
PROGRAMMABLE LOGIC ARRAY,
MONOLITHIC SILICON
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DRAWING APPROVAL DATE
86-06-20
REVISION LEVEL
SIZE
F
A
SHEET
CAGE CODE
67268
5962-85155
17
5962-E110-01
1 OF
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-85155
|
|
|
Drawing number
01
|
|
|
Device type
(see 1.2.1)
R
|
|
|
Case outline
(see 1.2.2)
X
|
|
|
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
Generic number
PAL16L8-20
PAL16R8-20
PAL16R6-20
PAL16R4-20
PAL16L8-30
PAL16R8-30
PAL16R6-30
PAL16R4-30
PAL16L8-15
PAL16R8-15
PAL16R6-15
PAL16R4-15
PAL16L8A-12
PAL16R8A-12
PAL16R6-12
PAL16R4-12
PAL16L8-10
PAL16R8-10
PAL16R6-10
PAL16R4-10
PAL16R8-7
PAL16R4-7
Circuit
16-input 8-output AND-OR invert gate array
16-input 8-output registered AND-OR gate array
16-input 6-output registered AND-OR gate array
16-input 4-output registered AND-OR gate array
16-input 8-output AND-OR invert gate array
16-input 8-output registered AND-OR gate array
16-input 6-output registered AND-OR gate array
16-input 4-output registered AND-OR gate array
16-input 8-output AND-OR invert gate array
16-input 8-output registered AND-OR gate array
16-input 6-output registered AND-OR gate array
16-input 4-output registered AND-OR gate array
16-input 8-output AND-OR invert gate array
16-input 8-output registered AND-OR gate array
16-input 6-output registered AND-OR gate array
16-input 4-output registered AND-OR gate array
16-input 8-output AND-OR invert gate array
16-input 8-output registered AND-OR gate array
16-input 6-output registered AND-OR gate array
16-input 4-output registered AND-OR gate array
16-input 8-output registered AND-OR gate array
16-input 4-output registered AND-OR gate array
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter
R
S
2
Descriptive designator
GDIP1-T20 or CDIP1-T20
CDFP5-F20 1/
CQCC1-N20
Terminals
20-lead
20-lead
20-terminal
Package style
dual-in-line package
flat package
square chip carrier package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1/ Inactive for new design. Acceptable only for use in equipment designed or redesigned on or before 29 November 1986.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
F
5962-85155
SHEET
2
1.3 Absolute maximum ratings.
Supply voltage range 2/.......................................................
Input voltage range 2/ 3/.....................................................
Storage temperature range .................................................
Lead temperature (soldering, 10 seconds) ..........................
Thermal resistance, junction-to-case (
4
JC
) 4/......................
Applied voltage to disabled output range 2/ 3/ ...................
Maximum power dissipation (P
D
): 5/
Device types 01-04.............................................................
Device types 05-08.............................................................
Device types 09-22.............................................................
Maximum junction temperature (T
J
) .....................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)...................................................
Minimum high level input voltage (V
IH
) .................................
Maximum low level input voltage (V
IL
) .................................
Maximum high level output current (I
OH
) ..............................
Maximum low level output current (I
OL
) ................................
Case operating temperature range (T
C
)................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
2/
3/
4/
5/
These ratings apply except for programming pins during a programming cycle.
To ensure high speed operation, input logic levels must be maintained within these conditions.
Heat sinking is recommended to reduce the junction temperature.
Must withstand the added P
D
due to short-circuit test; e.g., I
OS
.
4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.8 V dc
-2.0 mA dc
12.0 mA dc
-55
q
C to +125
q
C
-0.5 V dc to +7.0 V dc
-0.5 V dc to +5.5 V dc
-65
q
C to +150
q
C
+260
q
C
See MIL-STD-1835
-0.5 V dc to +5.5 V dc
1.1 W
0.6 W
1.2 W
+175
q
C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
F
5962-85155
SHEET
3
3. REQUIREMENTS
3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"
certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2. When required in groups A, B, or C (see 4.3.1c), the devices shall be programmed by the
manufacturer prior to test. A minimum of 50 percent of the total number of fuses shall be programmed) or to any altered item
drawing pattern which programs at least 25 percent of the total number of fuses programmed.
3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item
drawing.
3.2.4 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not
marking the "5962-" on the device.
3.6 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in
a wide variety of configurations, two processing options are provided for selection in the contract, using an altered item drawing.
3.6.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 3.2.3.1
and table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
3.6.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing shall be satisfied by the manufacturer prior to delivery.
3.7 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
Appendix A.
3.7.1 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7.2 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
F
5962-85155
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
4.5 V < V
CC
< 5.5
o
V
o
-55 C < T
C
< +125 C
unless otherwise specified
V
CC
= 4.5 V, I
I
= -18 mA
V
CC
= 4.5 V, V
IL
4.5 V,
V
IH
2.0 V, I
OH
= -2 mA
Group A
Subgroups
Device
type
Limits
Min
1, 2, 3
1, 2, 3
All
01,02,
04-20
03,21,
22
Low level output
voltage
High level input
voltage
Low level input
voltage
High level input current
V
OL
V
IH
V
IL
I
IH
V
CC
= 5.5 V,
V
I
= 2.4 V
V
CC
= 4.5 V, V
IL
4.5 V,
V
IH
2.0 V, I
OL
= 12 mA
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
Pins
CLK and OE
All
All
All
02,03,04,
06,07,08,
10,11,12,
14,15,16,
18,19,20
2
0.8
50
2.4
2.3
0.5
V
V
V
µA
Max
-1.5
V
V
Unit
Input clamp voltage
High Level output
voltage
V
IC
V
OH
All others
except I/O
All
I/O ports
All
01,03,
04,05,
07,08,
09,11,
12,13,
15,16,
17,19,
20,21,
22
1, 2, 3
1, 2, 3
1, 2, 3
All
All
01-16
17-22
-30
-30
25
100
Low level input current
Input current
Output current short
circuit
1/
See footnotes at end of table.
I
IL
I
I
I
OS
V
CC
= 5.5 V, V
IL
= 0.4 V
V
CC
= 5.5 V, V
I
= 5.5 V
V
CC
= 5.5 V, V
O
= 0.5 V
-0.25
1
-250
-130
mA
mA
mA
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
F
5962-85155
SHEET
5
无线连接
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
