Microprocessor, 16-Bit, 8MHz, CMOS, CDIP64, CERAMIC, DIP-64
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 64 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 地址总线宽度 | 23 |
| 位大小 | 16 |
| 边界扫描 | NO |
| 最大时钟频率 | 8 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| JESD-30 代码 | R-CDIP-T64 |
| JESD-609代码 | e4 |
| 低功率模式 | NO |
| 端子数量 | 64 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 速度 | 8 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
| Base Number Matches | 1 |
| 5962-8946201MYC | 5962-8946201MYA | 5962-8946201MUC | 5962-8946201MXA | 5962-8946201MZC | |
|---|---|---|---|---|---|
| 描述 | Microprocessor, 16-Bit, 8MHz, CMOS, CDIP64, CERAMIC, DIP-64 | Microprocessor, 16-Bit, 8MHz, CMOS, CDIP64, CERAMIC, DIP-64 | Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, LCC-68 |
| 零件包装代码 | DIP | DIP | PGA | LCC | QFP |
| 包装说明 | DIP, | DIP, | PGA, | QCCN, | QFP, |
| 针数 | 64 | 64 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 地址总线宽度 | 23 | 23 | 23 | 23 | 23 |
| 位大小 | 16 | 16 | 16 | 16 | 16 |
| 边界扫描 | NO | NO | NO | NO | NO |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-CDIP-T64 | R-CDIP-T64 | S-CPGA-P68 | S-CQCC-N68 | S-XQFP-G68 |
| JESD-609代码 | e4 | e0 | e4 | e0 | e4 |
| 低功率模式 | NO | NO | NO | NO | NO |
| 端子数量 | 64 | 64 | 68 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装代码 | DIP | DIP | PGA | QCCN | QFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | GRID ARRAY | CHIP CARRIER | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | GOLD | TIN LEAD | GOLD | TIN LEAD | GOLD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG | NO LEAD | GULL WING |
| 端子位置 | DUAL | DUAL | PERPENDICULAR | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
