REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Add six new device types for vendor CAGE number 65786. Add
vendor CAGE number 1FN41 as a source of supply for devices 01KX,
02KX, 03KX, and 04KX. Change to vendor similar part number for
vendor CAGE number 1FN41. Change to margin test method A for
vendor CAGE number 66579. Remove 4.5.1, 4.5.2, 4.5.3, figures 5
and 6, and table III from drawing. Change to parameters t
CS
and t
DF
in
table I. Change to figures 2 and 3. Editorial changes throughout.
5 year review and update. Changed input capacitance from 6 pF to
10 pF. ksr
93-01-21
M. A. Frye
B
06-06-06
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
B
11
B
12
Kenneth Rice
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE FOR USE BY
All DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Charles Reusing
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-06-21
REVISION LEVEL
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS, 8K X 8 UV
EPROM, MONOLITHIC SILICON
SIZE
CAGE CODE
B
A
SHEET
67268
1 OF
12
5962-87515
5962-E483-06
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-87515
|
|
|
Drawing number
01
|
|
|
Device type
(see 1.2.1)
J
|
|
|
Case outline
(see 1.2.2)
A
|
|
|
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
Generic number 1/
Circuit function
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
Access time
45 ns
55 ns
70 ns
90 ns
45 ns
55 ns
35 ns
35 ns
45 ns
55 ns
25 ns
25 ns
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter
J
K
L
3
Descriptive designator
GDIP1-T24 OR CDIP2-T24
GDFP2-F24 OR CDFP3-F24
GDIP3-T24 OR CDIP4-T24
CQCC1-N28
Terminals
24
24
24
28
Package style
Dual-in-line 2/
Flat pack
2/
Dual-in-line 2/
Square leadless chip carrier
2/
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Storage temperature ...........................................................-65°C to +150°C
Voltages on any pin with respect to ground .........................-0.5 V dc to +7.0 V dc
V
PP
with respect to ground...................................................-0.5 V dc to +14.0 V dc
Maximum power dissipation (P
D
) 3/ .....................................1 W
Lead temperature (soldering, 10 seconds) ..........................+300°C
Thermal resistance, junction-to-case (Θ
JC
)..........................MIL-STD-1835
Junction temperature (T
J
) 4/ ................................................+150°C
1.4 Recommended operating conditions. 1/
Case operating temperature (T
C
).........................................-55°C to +125°C
Supply voltage (V
CC
)............................................................+4.5 V dc to +5.5 V dc
1/ Generic numbers are listed on the Standardized Microcircuit Drawing Bulletin at the end of this document and will also be
listed in MIL-HDBK-103.
2/ Lid shall be transparent to permit ultraviolet light erasure.
3/ Must withstand the added P
D
due to short circuit test, e.g., I
OS
.
4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
B
5962-87515
SHEET
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"
certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.3.1 Unprogrammed or erased devices. The truth table for unprogrammed devices for contracts involving no altered item
drawing shall be as specified on figure 2. When required in groups A, B, or C inspection (see 4.3), the devices shall be
programmed by the manufacturer prior to test in a checkerboard pattern or equivalent (a minimum of 50 percent of the total
number of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total numbers of bits
programmed.
3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item
drawing.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
B
5962-87515
SHEET
3
TABLE I. Electrical performance characteristics.
Test
│
│
Symbol
│
│
│
│
│
│I
LI
│
│
│I
LO
│
│
│I
CC1
│
│
│
│
│I
CC2
│
│
│
│I
CC3
│
│
│
│V
IL
│
│
│V
IH
│
│
│V
OL
│
│
│
│
│
│V
OH
│
│
│
│
│
│I
OS
│
│
│
│C
IN
│
│
│C
OUT
│
│
│
Conditions
│
-55°C
≤
T
C
≤+125°C
│
V
SS
= 0 V 4.5 V
≤
V
CC
≤
5.5 V
│
unless otherwise specified
│
│
│V
IN
= 5.5 V and GND
│
│
│V
OUT
= 5.5 V and GND
│
│
│CS
= V
IL
, V
CC
= 5.5 V
│D0
to D7 = 0 mA
│f
= max
│
│
│CS
= 2.0 V, V
CC
= 5.5 V
│
│
│
│V
CC
= 5.5 V, CS = V
CC
-0.3 V
│
│
│
│V
CC
= 4.5 V and 5.5 V
│
│
│V
CC
= 4.5 V and 5.5 V
│
│
│
│V
CC
= 4.5 V,
│I
OL
= 16 mA
│
│V
IH
= 2.0 V,
│
│V
IL
= 0.8 V
│
│I
OL
= 6 mA
│
│
│
│
│V
CC
= 4.5 V,
│I
OH
= -4 mA
│
│V
IH
= 2.0 V,
│
│V
IL
= 0.8 V
│
│I
OH
= -2 mA
│
│
│
│V
O
= GND
│
│
│
│
│f
= 1.0 MHz
│V
IN
= 0 V
│T
C
= +25°C
│
│See
4.3.1e
│V
OUT
= 0 V
│V
CC
= 5.5 V
│
│
│
│
│Group
A
│subgroups
│
│
│
│
│
1,2,3
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│
│
│
1,2,3
│
│
│
│
│
1,2,3
│
│
│
│
│
4
│
│
│
│
│Device
│types
│
│
│
│
│
All
│
│
│
All
│
│
01-10
│
│
11-12
│
│
│
01-07
│
│
12
│
│
01-07
│
│
12
│
│
│
All
│
│
│
All
│
│
│
01-10
│
│
│
11,12
│
│
│
01-10
│
│
│
11,12
│
│
│
All
│
│
│
│
│
All
│
│
│
│
│
Limits
│
│
│
│
Min
│
Max
│
│
│
│
│
│
±10
│
│
│
│
│
│
±10
│
│
│
│
120
│
│
│
│
140
│
│
│
│
│
│
40
│
│
│
│
50
│
│
│
│
40
│
│
│
│
50
│
│
│
│
│
│
0.8
│
│
│
│
│
2.0
│
│
│
│
│
│
│0.45
│
│
│
│
│
│
0.4
│
│
│
│
│
│
│
2.4
│
│
│
│
│
│
│
│
│
│
│-100
│
│
│
│
│
│
│
│
10
│
│
│
│
12
│
│
│
│
│
│
│
Unit
│
│
│
│
│
µA
│
│
│
µA
│
│
│
│
mA
│
│
│
│
mA
│
│
│
│
mA
│
│
│
│
V
│
│
│
V
│
│
│
V
│
│
│
│
│
│
│
V
│
│
│
│
│
mA
│
│
│
│
│
pF
│
│
│
Input leakage current
Output leakage current
Operating supply
current (active) 1/
Standby current,
TTL inputs
Standby current,
CMOS inputs
Input low voltage
Input high voltage
Output voltage low
Output voltage high
Output short circuit
current 2/ 3/
Input capacitance 3/
Output capacitance 3/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
B
5962-87515
SHEET
4
TABLE I. Electrical performance characteristics - Continued.
Test
│
│Symbol
│
│
│
│
│
│
│t
ACC
│
│
│
│
│
│
│
│
│t
CS
│
│
│
│
│
│
│
│
│t
DF
│
│
│
│
│
│
│t
OH
│
│
│
│
Conditions
│
-55°C
≤
T
C
≤+125°C
│
V
SS
= 0 V 4.5 V
≤
V
CC
≤
5.5 V
│
unless otherwise specified
│
│
│
│V
CC
= 4.5 V
│See
figures 3 and 4
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│Group
A
│subgroups
│
│
│
│
9,10,11
│
│
│
│
│
│
│
│
9,10,11
│
│
│
│
│
│
│
│
│
│
│
│
9,10,11
│
│
│
│
│
│
│
9,10,11
│
│
│
│Device
│types
│
│
│
│
11,12
│
07,08
│
01,05
│
09
│
02,06
│
10
│
03
│
04
│
11
│
08
│
12
│
09
│
01,02
│
10
│
07
│
05
│
03,04,
│
06
│
11
│
08,12
│
09
│
01,02
│
07,10
│
05
│
03,04,
│
06
│
│
All
│
│
│
│
Limits
│
│
│
│
Min
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
0
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Unit
│
Max
│
│
25
│
ns
35
│
│
45
│
│
55
│
70
│
90
│
15
│
ns
20
│
25
│
30
35
40
45
55
15
25
30
35
45
55
│
│
│
│
│
│
│
│
│
│
ns
│
│
│
│
│
│
│
ns
│
│
Address to output
delay
CS to output delay
CS high to output
float 3/ 4/
Address to output hold
3/
1/ TTL inputs: V
IL
≤
0.8 V, V
IH
≥
2.0 V.
2/ Not more than one output should be shorted at a time, and short circuit test (I
OS
) should not exceed 30 seconds.
3/ Tested initially and after any design or process changes which may affect that parameter, and therefore shall be guaranteed
to the limits specified in table I.
4/ Transition is measured at steady-state high level -500 mV or steady-state low level +500 mV on the output from the 1.5 V
level on the input with the output load in figure 3, circuit B.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
B
5962-87515
SHEET
5
聊聊、笑笑、闹闹
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
