SN74LVTH574 3.3-V ABT Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs
| 参数名称 | 属性值 |
| 3-state output | Yes |
| Bits(#) | 8 |
| Rating | Catalog |
| Technology Family | LVT |
| tpd @ nom Voltage(Max)(ns) | 4.5 |
| IOH(Max)(mA) | -32 |
| VCC(Min)(V) | 2.7 |
| Operating temperature range(C) | -40 to 85 |
| Voltage(Nom)(V) | 3.3 |
| Schmitt trigger | No |
| Package Group | SOIC|20,SO|20,SSOP|20,TSSOP|20,VQFN|20 |
| IOL(Max)(mA) | 64 |
| VCC(Max)(V) | 3.6 |
| Approx. price(US$) | 0.26 | 1ku |
| ICC @ nom voltage(Max)(mA) | 5 |
| F @ nom voltage(Max)(Mhz) | 160 |
| SN74LVTH574 | SN74LVTH574DBG4 | SN74LVTH574DBE4 | 5962-9583201Q2A | 5962-9583201QSA | 5962-9583201VSA | SNJ54LVTH574FK | SNJ54LVTH574W | SN54LVTH574 | SN54LVTH574-SP | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | SN74LVTH574 3.3-V ABT Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs | Flip Flops 3.3V ABT Octal Edge Trgerd DTyp FlipFlop | Flip Flops 3.3V ABT Octal Edge Trgerd DTyp FlipFlop | 3.3-V ABT Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-LCCC -55 to 125 | 3.3-V ABT Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-CFP -55 to 125 | 3.3-V ABT Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-CFP -55 to 125 | 3.3-V ABT Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-LCCC -55 to 125 | 3.3-V ABT Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-CFP -55 to 125 | SN54LVTH574 3.3-V ABT Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs | SN54LVTH574-SP 3.3-V ABT Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs |
| 零件包装代码 | - | SSOP | SSOP | QLCC | DFP | DFP | QLCC | DFP | - | - |
| 包装说明 | - | SSOP, SSOP20,.3 | SSOP, SSOP20,.3 | QCCN, LCC20,.35SQ | DFP-20 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DFP, FL20,.3 | - | - |
| 针数 | - | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - | - |
| Reach Compliance Code | - | unknown | unknown | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - |
| 其他特性 | - | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | - | - |
| 系列 | - | LVT | LVT | LVT | LVT | LVT | LVT | LVT | - | - |
| JESD-30 代码 | - | R-PDSO-G20 | R-PDSO-G20 | S-CQCC-N20 | R-GDFP-F20 | R-GDFP-F20 | S-CQCC-N20 | R-GDFP-F20 | - | - |
| 长度 | - | 7.2 mm | 7.2 mm | 8.89 mm | 13.09 mm | 13.09 mm | 8.89 mm | 13.09 mm | - | - |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | - |
| 最大频率@ Nom-Sup | - | 150000000 Hz | 150000000 Hz | 150000000 Hz | 150000000 Hz | 150000000 Hz | 150000000 Hz | 150000000 Hz | - | - |
| 最大I（ol） | - | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | - | - |
| 位数 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 端口数量 | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - | - |
| 端子数量 | - | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - | - |
| 最高工作温度 | - | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | - | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
| 输出极性 | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | - | SSOP | SSOP | QCCN | DFP | DFP | QCCN | DFP | - | - |
| 封装等效代码 | - | SSOP20,.3 | SSOP20,.3 | LCC20,.35SQ | FL20,.3 | FL20,.3 | LCC20,.35SQ | FL20,.3 | - | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - | - |
| 封装形式 | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | FLATPACK | - | - |
| 包装方法 | - | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE | - | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| Prop。Delay @ Nom-Sup | - | 4.5 ns | 4.5 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | - | - |
| 传播延迟（tpd） | - | 5.3 ns | 5.3 ns | 5.9 ns | 5.9 ns | 5.9 ns | 5.9 ns | 5.9 ns | - | - |
| 认证状态 | - | Not Qualified | Not Qualified | Qualified | Qualified | Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | - | 2 mm | 2 mm | 2.03 mm | 2.45 mm | 2.54 mm | 2.03 mm | 2.45 mm | - | - |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - |
| 最小供电电压 (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | - |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | YES | - | - |
| 技术 | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | - | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | - |
| 端子形式 | - | GULL WING | GULL WING | NO LEAD | FLAT | FLAT | NO LEAD | FLAT | - | - |
| 端子节距 | - | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - |
| 端子位置 | - | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 触发器类型 | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | - |
| 宽度 | - | 5.3 mm | 5.3 mm | 8.89 mm | 6.92 mm | 6.92 mm | 8.89 mm | 6.92 mm | - | - |
FPGA/CPLD
嵌入式系统
微控制器 MCU
嵌入式系统
嵌入式系统
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