SN65LBC175 Quadruple Low-Power Differential Line Receiver
| 参数名称 | 属性值 |
| Supply voltage(s)(Nom)(V) | 5 |
| Package Group | PDIP|16,SOIC|16,SOIC|16 |
| Rating | Catalog |
| Number of TX | 0 |
| Common mode range | -7 to 12 |
| Number of nodes | 32 |
| Isolated | No |
| Supply voltage(s)(Min)(V) | 4.75 |
| Fault protection(V) | -10 to 15 |
| ICC(Max)(mA) | 20 |
| Number of RX | 4 |
| Duplex | N/A |
| Supply voltage(s)(Max)(V) | 5.25 |
| Signaling rate(Max)(Mbps) | 10 |
| Operating temperature range(C) | -40 to 85 |
| HBM ESD(kV) | 1 |
| Signaling rate(Mbps) | 10 |
| Approx. price(US$) | 1.27 | 1ku |
| IEC 61000-4-2 contact(+/- kV) | N/A |
| SN65LBC175 | SN65LBC175DWRG4 | SN75LBC175NE4 | SN65LBC175NE4 | SN75LBC175 | |
|---|---|---|---|---|---|
| 描述 | SN65LBC175 Quadruple Low-Power Differential Line Receiver | RS-422/RS-485 Interface IC Quadruple Low-Power Diff Line Receiver | RS-422/RS-485 Interface IC Quadruple Low-Power Diff Line Receiver | RS-422/RS-485 Interface IC Quadruple Low-Power Diff Line Receiver | SN75LBC175 Quadruple Low-Power Differential Line Receiver |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | - |
| 零件包装代码 | - | SOIC | DIP | DIP | - |
| 包装说明 | - | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 | - |
| 针数 | - | 16 | 16 | 16 | - |
| Reach Compliance Code | - | compliant | unknown | compliant | - |
| ECCN代码 | - | 5A991.B | EAR99 | EAR99 | - |
| 差分输出 | - | NO | NO | NO | - |
| 输入特性 | - | DIFFERENTIAL SCHMITT TRIGGER | DIFFERENTIAL SCHMITT TRIGGER | DIFFERENTIAL SCHMITT TRIGGER | - |
| 接口集成电路类型 | - | LINE RECEIVER | LINE RECEIVER | LINE RECEIVER | - |
| 接口标准 | - | V.11; EIA-422-A; EIA-423-A; EIA-485 | V.11; EIA-422-A; EIA-423-A; EIA-485 | V.11; EIA-422-A; EIA-423-A; EIA-485 | - |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | - |
| JESD-609代码 | - | e4 | e4 | e4 | - |
| 长度 | - | 10.285 mm | 19.305 mm | 19.305 mm | - |
| 功能数量 | - | 4 | 4 | 4 | - |
| 端子数量 | - | 16 | 16 | 16 | - |
| 最高工作温度 | - | 85 °C | 70 °C | 85 °C | - |
| 最大输出低电流 | - | 0.008 A | 0.016 A | 0.016 A | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | SOP | DIP | DIP | - |
| 封装等效代码 | - | SOP16,.4 | DIP16,.3 | DIP16,.3 | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | SMALL OUTLINE | IN-LINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | - | 260 | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | - | 5 V | 5 V | 5 V | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - |
| 最大接收延迟 | - | 30 ns | 30 ns | 30 ns | - |
| 接收器位数 | - | 2 | 2 | 2 | - |
| 座面最大高度 | - | 2.65 mm | 5.08 mm | 5.08 mm | - |
| 最大压摆率 | - | 20 mA | 20 mA | 20 mA | - |
| 最大供电电压 | - | 5.25 V | 5.25 V | 5.25 V | - |
| 最小供电电压 | - | 4.75 V | 4.75 V | 4.75 V | - |
| 标称供电电压 | - | 5 V | 5 V | 5 V | - |
| 表面贴装 | - | YES | NO | NO | - |
| 技术 | - | BICMOS | BICMOS | BICMOS | - |
| 温度等级 | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | - | 1.27 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 7.5 mm | 7.62 mm | 7.62 mm | - |
无线连接
PCB设计
无线连接
微控制器 MCU
嵌入式系统
stm32/stm8
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