RM48L530 16/32-Bit RISC Flash Microcontroller
| 参数名称 | 属性值 |
| I2C | 1 |
| Approx. price(US$) | 17.02 | 1ku |
| CAN(#) | 3 |
| Rating | Catalog |
| CPU | Arm-Cortex - R4F |
| Flash (KB) | 2048 |
| UART(SCI) | 2 |
| RAM(KB) | 192 |
| HET channels | 40,44 |
| ADC | 2 x 12-Bit (24ch) |
| SPI | 1,2 |
| MibSPI | 3 |
| SCI/LIN | 2/1 |
| EMIF | 16-bit |
| GPIO | 64,144 |
| Frequency(MHz) | 200 |
| Data flash(KB) | 64 |
| Package Group | LQFP|144 |
| USB | 2 |
| RM48L530 | RM48L730ZWTT | RM48L730PGET | RM48L530ZWTT | RM48L730 | |
|---|---|---|---|---|---|
| 描述 | RM48L530 16/32-Bit RISC Flash Microcontroller | ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU | ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU | ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU | RM48L730 16/32-Bit RISC Flash Microcontroller |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | - | BGA | QFP | BGA | - |
| 包装说明 | - | LFBGA, BGA337,19X19,32 | LFQFP, QFP144,.87SQ,20 | LFBGA, BGA337,19X19,32 | - |
| 针数 | - | 337 | 144 | 337 | - |
| Reach Compliance Code | - | compliant | compliant | compliant | - |
| ECCN代码 | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | - |
| 具有ADC | - | YES | YES | YES | - |
| 其他特性 | - | ALSO REQURIES AT 3.3 V I/O SUPPLY | ALSO REQURIES AT 3.3 V I/O SUPPLY | ALSO REQURIES AT 3.3 V I/O SUPPLY | - |
| 位大小 | - | 32 | 32 | 32 | - |
| CPU系列 | - | CORTEX-R4F | CORTEX-R4F | CORTEX-R4F | - |
| 最大时钟频率 | - | 80 MHz | 80 MHz | 80 MHz | - |
| DAC 通道 | - | NO | NO | NO | - |
| DMA 通道 | - | YES | YES | YES | - |
| JESD-30 代码 | - | S-PBGA-B337 | S-PQFP-G144 | S-PBGA-B337 | - |
| JESD-609代码 | - | e1 | e4 | e1 | - |
| 长度 | - | 16 mm | 20 mm | 16 mm | - |
| 湿度敏感等级 | - | 3 | 3 | 3 | - |
| I/O 线路数量 | - | 16 | 10 | 16 | - |
| 端子数量 | - | 337 | 144 | 337 | - |
| 最高工作温度 | - | 105 °C | 105 °C | 105 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | - |
| PWM 通道 | - | YES | YES | YES | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | LFBGA | LFQFP | LFBGA | - |
| 封装等效代码 | - | BGA337,19X19,32 | QFP144,.87SQ,20 | BGA337,19X19,32 | - |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | - | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | - |
| 电源 | - | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - |
| RAM（字节） | - | 262144 | 262144 | 196608 | - |
| ROM（单词） | - | 2097152 | 2097152 | 2097152 | - |
| ROM可编程性 | - | FLASH | FLASH | FLASH | - |
| 座面最大高度 | - | 1.4 mm | 1.6 mm | 1.4 mm | - |
| 速度 | - | 200 MHz | 200 MHz | 200 MHz | - |
| 最大供电电压 | - | 1.32 V | 1.32 V | 1.32 V | - |
| 最小供电电压 | - | 1.14 V | 1.14 V | 1.14 V | - |
| 标称供电电压 | - | 1.2 V | 1.2 V | 1.2 V | - |
| 表面贴装 | - | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | - |
| 端子形式 | - | BALL | GULL WING | BALL | - |
| 端子节距 | - | 0.8 mm | 0.5 mm | 0.8 mm | - |
| 端子位置 | - | BOTTOM | QUAD | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 16 mm | 20 mm | 16 mm | - |
| uPs/uCs/外围集成电路类型 | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
