SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40
参数名称 | 属性值 |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 40 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
最长访问时间 | 30 ns |
JESD-30 代码 | R-CDFP-F40 |
内存密度 | 2097152 bit |
内存集成电路类型 | SRAM MODULE |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 40 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 128KX16 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
筛选级别 | MIL-PRF-38535 Class V |
最大供电电压 (Vsup) | 3.46 V |
最小供电电压 (Vsup) | 3.14 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子位置 | DUAL |
总剂量 | 1M Rad(Si) V |
Base Number Matches | 1 |
209A542-131 | 209A542-135 | 209A542-145 | 209A542-144 | 209A542-133 | 209A542-143 | 209A542-147 | 209A542-134 | 209A542-137 | 209A542-141 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 | SRAM Module, 128KX16, 30ns, CMOS, CDFP40, 0.855 X 0.710 INCH, CERAMIC, DFP-40 |
零件包装代码 | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP |
包装说明 | DFP, | DFP, | DFP, | DFP, | DFP, | DFP, | DFP, | DFP, | DFP, | DFP, |
针数 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
最长访问时间 | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns |
JESD-30 代码 | R-CDFP-F40 | R-CDFP-F40 | R-CDFP-F40 | R-CDFP-F40 | R-CDFP-F40 | R-CDFP-F40 | R-CDFP-F40 | R-CDFP-F40 | R-CDFP-F40 | R-CDFP-F40 |
内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 3.46 V | 3.46 V | 3.46 V | 3.46 V | 3.46 V | 3.46 V | 3.46 V | 3.46 V | 3.46 V | 3.46 V |
最小供电电压 (Vsup) | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
筛选级别 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | - | - | - | MIL-PRF-38535 Class Q | - | MIL-PRF-38535 Class V |
总剂量 | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V | - | - | - | 1M Rad(Si) V | - | 1M Rad(Si) V |
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