REVISIONS
R E L or E C O
REV
D E S C R I P T I O N
D A T E
A P P R O V E D
ECO EOA20156
G
Refer to Document Change History herein
01-19-04
K. Mason
NOTES:
1.
2.
This is a TOP LEVEL DRAWING (TLD).
BAE SYSTEMS - Manassas, VA reference only.
All sheets are the same revision status.
3.
© Copyright 2003-2004, BAE SYSTEMS. Licensed Material.
Property of BAE SYSTEMS. All Rights Reserved.
Part Number - See Tabulation
C O N T R A C T
N O.
N/A
P R E P A R A T I O N
D A T E
9300 Wellington Road
Manassas, VA 20110
P. NIXON
D E S I G N C H E C K
D A T E
S. DOYLE
TECHNOLOGY CHECK
D A T E
T I T L E
D A T E
K. STURCKEN
RADIATION CHECK
MCM,CMOS,2.5V/3.3V,SRAM,512Kx40, STACKED, OPT
R. BROWN
D R A W I N G C H E C K
D A T E
P. NIXON
O T H E R
A P P R O V A L
D A T E
J. KRAUSE (BURNIN)
O T H E R
A P P R O V A L
D A T E
T. GREMBOWSKI (TEST)
O T H E R
A P P R O V A L
D A T E
S I Z E
C A G E
C O D E
D R A W I N G
N O .
R E V
A
S C A L E
1RU44
NONE
WT
251A137
S H E E T
G
1 of
36
C. SASSI (MILSCREEN)
FORM
NO W26MAN94 - 001-0
Table of Contents
Document Change History ................................................................................................................................. 4
1
SCOPE.................................................................................................................................................... 5
1.1
S
COPE
.................................................................................................................................................. 6
1.2
BAE SYSTEMS P
ART
N
UMBER AND
I
DENTIFICATION
............................................................................. 6
1.3
A
BSOLUTE
M
AXIMUM
R
ATINGS
............................................................................................................... 8
1.4
R
ECOMMENDED
O
PERATING
C
ONDITIONS
............................................................................................... 9
1.5
P
OWER
S
EQUENCING
............................................................................................................................. 9
2
Applicable Documents .......................................................................................................................... 10
2.1
G
OVERNMENT
S
PECIFICATIONS AND
S
TANDARDS
.................................................................................. 10
2.2
BAE SYSTEMS D
OCUMENTATION
...................................................................................................... 10
2.3
O
THER
D
OCUMENTS
............................................................................................................................ 10
2.4
O
RDER OF
P
RECEDENCE
...................................................................................................................... 10
3
Requirements ........................................................................................................................................ 11
3.1
I
TEM
R
EQUIREMENTS
........................................................................................................................... 11
3.2
D
ESIGN
, C
ONSTRUCTION
,
AND
P
HYSICAL
D
IMENSIONS
.......................................................................... 11
3.3
E
LECTRICAL
P
ERFORMANCE
C
HARACTERISTICS AND
P
OSTIRRADIATION
P
ARAMETER
L
IMITS
................... 14
3.4
E
LECTRICAL
T
EST
R
EQUIREMENTS
....................................................................................................... 16
3.5
M
ARKING
............................................................................................................................................. 26
4
Quality Assurance Provisions ............................................................................................................... 27
4.1
S
AMPLING AND
I
NSPECTION
.................................................................................................................. 27
4.2
S
CREENING
......................................................................................................................................... 27
4.3
T
ECHNOLOGY
C
ONFORMANCE
I
NSPECTION
(TCI)
FOR
D
EVICE
C
LASSES
H (T)
AND
K (T+) ..................... 29
4.4
Q
UALITY
C
ONFORMANCE
I
NSPECTION
(QCI) ......................................................................................... 29
4.5
B
URN
-
IN
C
IRCUIT
................................................................................................................................. 32
5
Packaging/Shipping............................................................................................................................... 34
5.1
P
ACKAGING
/S
HIPPING
R
EQUIREMENTS
................................................................................................. 34
SIZE
A
CAGE CODE
1RU44
REV
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DWG NO.
251A137
SHEET 2 of
36
2.5V/3.3V 512Kx40 SRAM MCM
SCALE
Figures
F
IGURE
1. C
ASE
O
UTLINE
: 84-
LEAD
FP P
ACKAGE
– T
OP
, S
IDE AND
B
OTTOM
V
IEWS
(D
RAWING
N
O
. -
249A428-1) ............................................................................................................................................... 12
F
IGURE
2. C
ASE
O
UTLINE
: 84-
LEAD
FP P
ACKAGE
C
ROSS
S
ECTION
.................................................................... 13
F
IGURE
3. S
INGLE
C
HIP
F
UNCTIONAL
B
LOCK
D
IAGRAM
....................................................................................... 15
F
IGURE
4. T
YPICAL
S
TANDBY
C
URRENT VS
. T
EMPERATURE FOR
P
ASS
2 ............................................................. 18
F
IGURE
5. O
UTPUT
L
OAD
C
IRCUIT
..................................................................................................................... 22
F
IGURE
6. R
EAD
C
YCLE
T
IMING
D
IAGRAM
.......................................................................................................... 23
F
IGURE
7. W
RITE
C
YCLE
T
IMING
D
IAGRAM
......................................................................................................... 24
F
IGURE
8. P
ART
M
ARK
(T
OP
L
ID
)....................................................................................................................... 26
F
IGURE
9. B
URN
-
IN
C
IRCUIT
D
IAGRAM FOR EACH
SRAM
DIE
............................................................................... 33
Tables
T
ABLE
1. T
ABULATION
......................................................................................................................................... 6
T
ABLE
2. A
BSOLUTE
M
AXIMUM
R
ATINGS
.............................................................................................................. 8
T
ABLE
3. R
ECOMMENDED
O
PERATING
C
ONDITIONS
.............................................................................................. 9
T
ABLE
4. T
RUTH
T
ABLE
..................................................................................................................................... 14
T
ABLE
5. C
HANGE IN
R
ISING
O
UTPUT
P
ERFORMANCE VS
. A
DDITIONAL
O
UTPUT
L
OADING
..................................... 17
T
ABLE
6. C
HANGE IN
F
ALLING
O
UTPUT
P
ERFORMANCE VS
. A
DDITIONAL
O
UTPUT
L
OADING
................................... 17
T
ABLE
IA. E
LECTRICAL
P
ERFORMANCE
C
HARACTERISTICS
.................................................................................. 19
T
ABLE
IB. R
ADIATION
R
EQUIREMENTS
(
TEST DATA
TBD) .................................................................................... 25
T
ABLE
7. S
CREENING
F
LOWS
............................................................................................................................. 28
T
ABLE
8. Q
UALIFICATION
T
ESTING
R
EQUIREMENTS
............................................................................................. 30
T
ABLE
IIA. E
LECTRICAL
T
EST
R
EQUIREMENTS
.................................................................................................... 31
T
ABLE
9. T
ERMINAL
C
ONNECTIONS FOR
512K
X
40 MCM
IN
84-FP .................................................................... 35
SIZE
A
CAGE CODE
1RU44
REV
G
DWG NO.
251A137
SHEET 3 of
36
2.5V/3.3V 512Kx40 SRAM MCM
SCALE
Document Change History
Date
02/2002
05/2002
10/23/02
R
e
v
+
+
−
ECO
N/A
N/A
EOA11044
Description of Changes
Advanced preliminary draft copy (unreleased).
Advanced preliminary draft copy; multiple updates (unreleased).
•
•
Delete all sections except 1.1 and 1.2 including Table 1.
Release Table 1 list of part numbers for Production Control ordering purposes. All technical requirements will
be released as Revision A or later.
This ECO releases -513, -522, -523, -527, -533 parts to Rev
−.
•
Add -53x dash level to Table 1 and Table IA to cover Pass 1 design.
•
Correct the part number for LICA capacitor in table in section 1.2.1.
•
In Table 2, added max burn-in temp and corrected max solder temp to 180C.
•
Correct VDD power supply range from 2.25-2.75V to 2.3-2.7V per IBM 6SF design rules maximum use
condition in Table 3, Table IA and throughout document.
•
Add individual chip identification to Figure 2 (U1-U5).
•
Add new section 3.4.4 Pass 1 Design Application Notes and renumbered subsequent section.
•
In Table IA, change VIL from 0.800V to 0.750V due to Pass 1 process splits.
•
Add ESD triangles to part mark section 3.5.
•
Update flows in Table 7 to remove rework and to streamline test requirements. Add Y2 direction to Mechanical
Shock test condition.
•
Update burn-in section 4.5 and Figure 7.
•
Updated Figure 1 cross sectional view.
This ECO releases only the -533 part to Rev A.
Originator
P. Nixon,
S. Doyle
P. Nixon,
S. Doyle
P. Nixon
11/18/02
A
EOA11596
P. Nixon
02/10/03
B
EOA12897
02/13/03
C
EOA13146
Update drawing for Pass 2 design and delete Pass 1 references.
Delete -53x dash parts from Table 1 and Table IA.
Correct capacitor part number and add note 1 to Manufacturing Tree table in section 1.2.1.
Correct maximum values for VDD and VDD2 to 3.80V and 5.70V respectively in Table 2.
Update theta-jc and note 6 based on ANSYS model data.
Correct minimum values VDD and VDD2 in Table 3 and in Table IA.
Clarify that Operating Temperature is based on TJ in Tables 2, 3, and IA.
Clarify Power Sequencing in section 1.5 that either power supply may be brought up or down in the
middle sequence.
Update Tables 5 and 6 and section 3.4.3 with Pass 2 values for change in performance based on
loading.
Delete section 3.4.4 and replace with new section and with Figure 4 to show change in standby
current over temperature.
Update Table IA for IDD1, IDR, VIL, Cin, Cout. Updated values for Read performance for tSLQX,
tGLQX, tAXQX, tSHQZ, tGHQZ. Add new Read performance parameter tLVQV. Update Write
performance for tWLWH, tWHDX, tAVWL, tWHAX, tWHQX, tWLQZ. Delete notes 8-11.
Add section 4.3.1 and Table 8
Add burn-in requirement for Prototype (-xx2) parts to Table 7. Add note 2 and 3 to Table 7 to
define accelerated burn-in conditions. Change pre-burnin to optional test. Change sequence to
move burn-in prior to lid seal to after lid seal for manufacturing ease.
This ECO releases only -523 part to Rev B.
Update Table 1 and Table IA to specify performance parameters, x1x becomes 14ns part (from
TBD) and x2x becomes 17ns part (from 20ns).
Update Table 3 and Table IA to change max temp to 110C from 125C.
Update Table 2, Table 3 and notes in Table 7 to clarify temperature references to case or junction.
Table IA clarify note 1 and add note 8.
Table IA remove note 4 and renumber notes 4 through 7.
Table IA change tDVWH from 8 ns to 6 ns.
Table IA reformat equation at end of notes section.
Update section 3.4.4 and Figure 4 with preliminary Iddq vs Temperature data for Pass 2.
Add section 4.2.2 to describe accelerated burn-in condition used in Table 7.
This ECO releases -512, -517, -519, -529 and updates, -513, -522, -523, -527 parts all to Rev C.
P. Nixon,
S. Doyle
P. Nixon,
S. Doyle
SIZE
A
CAGE CODE
1RU44
REV
G
DWG NO.
251A137
SHEET 4 of
36
2.5V/3.3V 512Kx40 SRAM MCM
SCALE
Date
04/08/03
R
e
v
D
ECO
EOA14096
Description of Changes
Add new dash levels –592, -593 to Table 1.
Correct typo for capacitor part number and description in section 1.2.1.
Table 2 update Power dissipation calculation and note 3. Table 2 update theta-jc calculation and
note 6. Table 2 update lead solder temperature to 265C.
Add notes 1 and 2 to section 1.5 Power Sequencing.
Delete cross-section at top of Figure 2. This was a duplication of the cross-section in Figure 1.
Add reference to Table 4 note 1 clarifying that the definitions of “Low” and “High” are shown in
Table 3.
Add clarification to section 3.4.4 that typical Iddq measurements are pre-irradiation.
Table IA updates for –x9x devices including Vil and note 8/. Delete room temp spec for Idd2 and
Idd3.
Correct TID maximum from 100Krad to 200Krad in Table IB and Table 1. Update Table IB for RS
to 1E+11, SEU to 1E-09, note 3 modeling information, note 4 LET to 80, and note 6 to technology
capability – all match customer requirements.
Update part mark diagram in section 3.5; correct line 6 sequence to line 2 (also, correct note 1/ in
Table 1). Add Figure caption for part mark diagram and renumber subsequent figures.
Add column to help clarify burn-in conditions table in section 4.2.2.
Correct typo for burn-in time tolerance in Table 7 note 2 and voltage tolerances in section 4.5.1.
This ECO updates -512, -513, -517, -519, -522, -523, -527 –529 and releases –592, -593 parts all to Rev
D.
Moved ‘Prototype’ and ‘Engineering’ part mark labels from line 5 to 4 in Table 1.
Corrected Input and Output Voltage reference to Vdd2 and clarified note 3/ in Table 2.
Updated note 2/ in section 1.5 to match wording in other R25 electrical spec documents.
Replaced case outline drawing in Figure 1 with updated drawing, including top, side and bottom
views. Dimensions are in mm. Moved cross-section view to top of Figure 2; added Note 3.
Moved Table 4 before Figure 3 to save layout space.
Corrected Voh at Ioh=-200uA to reference Vdd2 (vs Vdd) in Table IA.
Corrected Vdd=2.70V and Vdd2=3.60V for RTD test conditions in Table IB.
Updated Part Mark drawing in Figure 8 (added leads to top and bottom of drawing, moved serial
number to lid, removed Kovar Ring marking, updated Notes to clarify). Added line 5 customer
specific part number for NGST deliveries.
Added “Wafer Fabrication” row to Table 7 Screening Flows. Corrected note for pre-burnin option.
In Tables 7 and 8, changed Mechanical Shock from Cond B (1500g) to Cond C (3000g) to satisfy
customer request. Also, correct that Mechanical Shock is done in 6-axes instead of two.
Corrected and updated pin assignments in Table 9 for pins # 55,58,61,62,64,65,68,71.
This ECO updates -512, -513, -517, -519, -522, -523, -527 –529, –592, and -593 parts all to Rev E.
Delete dash levels –592, -593 from Table 1 and Table IA.
Updated Table 4 to set LS=LD to Don’t Care for Chip Selected Standby mode.
Update Figure 4 typical Iddq vs Temperature chart with Pass 2.1 data.
Update Table IA spec values for IDD1, IDD1S, IDD2, IDD3, IDR, tGLQV, tSHQZ, tGHQZ,
tAVWH, tSLWH, tWLWH. Added tLVQX, tLXQZ and tLVWH parameters and specs.
Updated Figure 6 Read Cycle and Figure 7 Write Cycle to include LD/LS signals.
Added accelerated life test time into table in section 4.2.2.
Rearrange assembly steps to match manufacturing production flow in Table 7.
This ECO updates -512, -513, -517, -519, -522, -523, -527 and –529 parts.
Clarified in Table 1 that –xx2, -xx7 and –xx9 are all processed with accelerated burn-in conditions
Update table in section 1.2.1 to add new part number for Class S capacitors.
Update Table 1 and Table IA for –51x devices from 14ns to 15ns (update parameters tAVAV,
tAVQV, tSLQV, tAVAV, tAVWH, tSLWH, tLVWH, tWLWH).
Delete static burn-in from section 4.5.
This ECO updates -512, -513, -517, -519, -522, -523, -527 and –529 parts all to Rev G.
Originator
P. Nixon
05/22/03
E
EOA14969
P. Nixon
09/30/03
F
EOA17810
P. Nixon
01/19/04
G
EOA20156
P. Nixon
SIZE
A
CAGE CODE
1RU44
REV
G
DWG NO.
251A137
SHEET 5 of
36
2.5V/3.3V 512Kx40 SRAM MCM
SCALE
NXP MCU
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