5% Thick Film Chip Resistors
(RoHS Compliant)
FEATURES
• Temperature Range: -55°C ~ +125°C
• High purity alumina substrate
• Wave or flow solderable
• Excellent high frequency characteristics
• Wrap around termination
• Inner electrode protection
• Resistance range 0Ω ~ 10MΩ
PART NUMBERING SYSTEM
CR5-RC Series
2
6
Series
0
-
1
0
Ohms
K
-
R
C
Suffix (RoHS Compliant)
C
t
t
.55 ± .10
.55 ± .10
.45 ± .10
D
L
W
SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS
Series
263
260
301
Case Size
1206
0805
0603
Power
Rating
1/8
1/10
1/16
Voltage (max.)
W.V.
O.V.
200
400
150
300
50
100
Dimensions (mm)
L
W
C
D
3.1 ± 0.15 1.55 ± .15 0.45 ± 0.2 0.45 ± 0.2
2.0 ± 0.15 1.25 ± .15 0.4 ± 0.2 0.4 ± 0.2
1.60 ± .10 0.8 ± .15 0.3 ± .20 0.30 ± .20
DERATING CURVE
REEL DIMENSIONS (mm)
Rated Load (%)
¿13 0.5
50
min.
178
2.0
10 1
Ambient Temperature (C)
STANDARD STOCKED VALUES (Ω)
0
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1K
1.1K
1.2K
1.3K
1.5K
1.6K
1.8K
2K
2.2K
2.4K
2.7K
3K
3.3K
3.6K
3.9K
4.3K
4.7K
5.1K
5.6K
6.2K
6.8K
7.5K
8.2K
9.1K
10K
11K
12K
13K
15K
16K
18K
20K
22K
24K
27K
30K
33K
36K
39K
43K
47K
51K
56K
62K
68K
75K
82K
91K
200K 430K 820K 1.8M 3.9M 8.2M
100K 220K 470K 910K 2M 4.3M 9.1M
110K 240K 510K 1M 2.2M 4.7M 10M
120K 270K 560K 1.1M 2.4M 5.1M
130K 300K 620K 1.2M 2.7M 5.6M
150K 330K 660K 1.3M 3M 6.2M
160K 360K 680K 1.5M 3.3M 6.8M
180K 390K 750K 1.6M 3.6M 7.5M
CONSTRUCTION
No.
1
2
3
4
5
6
Part Name
Protective coating: Epoxy
Al
2
O
3
high purity alumina substrate: Al 96fi
Resistive element: metal film
Termination (Inner): Ag/Pd
Termination (Between): Ni plating film
Termination (Outer): Sn plating film
2
3
1
4
4
5
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600033
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/30/05
5% Thick Film Chip Resistors
(RoHS Compliant)
CHARACTERISTICS
Characteristics
Limits
Test Methods
( JIS C 5201-1 )
CR5-RC Series
Temperature
coefficient
1Ω ~ 10Ω
≤
±400 PPM / °C
11Ω ~ 10MΩ
≤
±200 PPM / °C
5.2 Natural resistance change per temp.
degree centigrade.
R
2
-R
1
x10
6
(PPM/°C)
R
1
(t
2
-t
1
)
R
1
: Resistance value at room temperature (t
1
)
R
2
: Resistance value at room temp.plus 100°C (t
2
)
5.5 Permanent resistance change after the
application of a potential of 2.5 times RCWV
for 5 seconds.
5.6 Apply 500V DC between protective coating
and termination for 1 minute
5.7 Apply 500V AC between protective coating
and termination for 1 minute
Short time
overload
Resistance change rate is
± (2.0 % + 0.1Ω) Max.
Insulation
resistance
Dielectric
withstanding
voltage
Terminal bending
1,000M
Ω
or more
No evidence of flashover
mechanical damage,arcing or
insulation break down.
±(1.0% +0.05Ω) Max.
6.1.4 Twist of Test Board:
Y/X=5/90mm for 10 seconds
7.4 Resistance change after continuous
5 cycles for duty shown below:
Step
Temperature
1
-55°C ±3°C
2
Room temp.
3
+155°C ±2°C
4
Room temp.
7.9 Resistance change after 1,000 hours
(1.5 hours "on", 0.5 hour "off") at RCWV
in a humidity chamber controlled at
40°C ± 2°C and 90 to 95 % relative humidity
7.10 Permanent resistance change after 1,000 hours
operating at RCWV, with duty cycle of
( 1.5 hours "on", 0.5 hour "off" ) at 70°C ± 2°C ambient
Solder bath method
Pre-Heat: 100 to 105°C, 30 ±5 sec.
Temperature: 265 ± 3°C, 5 +1/-0 sec
Reflow soldering method
Peak: 250 +5/-0°C
230°C or higher, 30 ±10Sec.
Solder iron method
Bit temperature: 350° ±10°C
Application time of soldering iron: 3 +1/-0 seconds
Temperature
cycling
± (1.0% + 0.05Ω) Max.
Time
30 mins
10~15 mins
30 mins
10~15 mins
Load life in
humidity
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Load life
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Soldering Heat
Electrical characteristics shall be satisfied.
Without distinct deformation in
appearance.
Solderability
95% Coverage min.
6.5 Test temperature of solder: 245° ±3°C
Dipping them solder: 2~3 seconds
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600033
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/30/05
NXP MCU
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