FEATURES
APPLICATIONS
High dvdt
–
Good Pulse Current
–
Stable with Temperature and Frequency
Inverters/Converters
–
Power Semiconductor Circuits
–
Induction Heating
–
Switching Power Supplies
-55°C to +85°C
+10% at 1 kHz, 25°C
+5% optional
WVDC
700
850
SVDC
1000
1200
WVDC
700
850
VAC
420
450
Frequency
C<0.047uF
(kHz)
1
0.06%
1000
1400
1000
480
1200
1600
1200
500
1500
2000
1500
575
C>1uF
0.06%
2000
2400
2000
630
2500
3000
2500
700
3000
3500
3000
750
Operating Temperature Range
Capacitance Tolerance
Surge Voltage(SVDC)
AC voltage (50/60 Hz)
Dissipation Factor (MAX)
25°C
Insulation Resistance
@25°C (<70% RH)for 1 minute at
100VDC applied
Self Inductance
Capacitance Drift Factor
0.047>C>1uF
0.05%
30000 MΩxμF
(not to exceed 30GΩ)
<1 nano-Henry per mm of lead spacing
<0.5% after 2 years at 40°C
30000 hours @VAC, 70°C
100000 hours @VDC, 70°C
Capacitance Change
<3% of initially measured value
300/ billion component hours
56 days at 40°C with 90 to 95%RH, +40°C and no voltage applied
Capacitance Change
<2% of initially measured value
Dissipation Factor
<0.0001 at 1kHz and 25°C
Insulation Resistance
>50% of maximum specified value
<1 nano-Henry per mm of body length and lead length
<1.0% after 2 years at 40°C
-200 ppm/°C, +100ppm/°C
Terminal to case
3kVAC, 50/60Hz applied
160% of rated VDC or 200% VDC
between the leads and case for
applied for 2 Seconds and 25°C
60 seconds
Polypropylene
Double Metallized film with internal series connections
Flame Retardant polyester tape wrap (UL 501) with epoxy resin end
fill(UL94V0)
Lead free tinned copper leads
L MAX
D
d+0.05
29
<17.5
0.8
34
<18
0.8
34
>18
1.0
46
<25
1.0
46
>25
1.2
55
all
1.2
59
all
1.2
Life Expectancy
Failure Quota
Damp Heat test
Self Inductance
Capacitance Drift Factor
Capacitance Temperature
Coefficient
Dielectric Strength
Dielectric
Construction
Coating
Leads
Terminal to Terminal
Feb-17
FPGA/CPLD
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