SN55462 Dual High-Voltage, High-Current Peripheral Drivers
| SN55462 | JM38510/12908BPA | M38510/12908BPA | SNJ55462FK | SNJ55462JG | SN75462 | SN75463 | |
|---|---|---|---|---|---|---|---|
| 描述 | SN55462 Dual High-Voltage, High-Current Peripheral Drivers | Dual High-Voltage, High-Current Peripheral Drivers 8-CDIP -55 to 125 | Dual High-Voltage, High-Current Peripheral Drivers 8-CDIP -55 to 125 | Dual High-Voltage, High-Current Peripheral Drivers 20-LCCC -55 to 125 | Dual High-Voltage, High-Current Peripheral Drivers 8-CDIP -55 to 125 | SN75462 Dual High-Voltage, High-Current Peripheral Drivers | SN75463 Dual High-Voltage, High-Current Peripheral Drivers |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 零件包装代码 | - | DIP | DIP | QLCC | DIP | - | - |
| 包装说明 | - | DIP, | DIP, DIP8,.3 | QCCN, LCC20,.35SQ | DIP-8 | - | - |
| 针数 | - | 8 | 8 | 20 | 8 | - | - |
| Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | not_compliant | - | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
| 驱动器位数 | - | 2 | 2 | 2 | 2 | - | - |
| 输入特性 | - | GATED | GATED | STANDARD | STANDARD | - | - |
| 接口集成电路类型 | - | NAND GATE BASED PERIPHERAL DRIVER | NAND GATE BASED PERIPHERAL DRIVER | NAND GATE BASED PERIPHERAL DRIVER | NAND GATE BASED PERIPHERAL DRIVER | - | - |
| JESD-30 代码 | - | R-GDIP-T8 | R-GDIP-T8 | S-CQCC-N20 | R-CDIP-T8 | - | - |
| 长度 | - | 9.58 mm | 9.6 mm | 8.89 mm | 9.6 mm | - | - |
| 功能数量 | - | 2 | 1 | 2 | 2 | - | - |
| 端子数量 | - | 8 | 8 | 20 | 8 | - | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| 输出特性 | - | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | - | - |
| 输出电流流向 | - | SINK | SINK | SINK | SINK | - | - |
| 最大输出电流 | - | 0.4 A | 0.3 A | 0.4 A | 0.4 A | - | - |
| 标称输出峰值电流 | - | 0.5 A | 0.5 A | 0.5 A | 0.5 A | - | - |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | - |
| 封装代码 | - | DIP | DIP | QCCN | DIP | - | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - | - |
| 封装形式 | - | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | - | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 认证状态 | - | Not Qualified | Qualified | Not Qualified | Not Qualified | - | - |
| 筛选级别 | - | MIL-M-38510 Class B | MIL-STD-883 | MIL-PRF-38535 | MIL-PRF-38535 | - | - |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | 2.03 mm | 5.08 mm | - | - |
| 最大供电电压 | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| 标称供电电压 | - | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | - | NO | NO | YES | NO | - | - |
| 技术 | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - | - |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | - | - |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | - | - |
| 端子节距 | - | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | - | - |
| 端子位置 | - | DUAL | DUAL | QUAD | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 断开时间 | - | 0.065 µs | 0.065 µs | 0.065 µs | 0.065 µs | - | - |
| 接通时间 | - | 0.05 µs | 0.05 µs | 0.05 µs | 0.05 µs | - | - |
| 宽度 | - | 7.62 mm | 7.62 mm | 8.89 mm | 7.62 mm | - | - |
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