ISO7821LLS High-Performance, 8000 VPK Reinforced Isolated Dual LVDS Buffer
| 参数名称 | 属性值 |
| Data rate(Max)(Mbps) | 150 |
| Package Group | SOIC|16,SOIC|16 |
| Rating | Catalog |
| Default output | N/A |
| Forward/reverse channels | 1/1 |
| VCC(Min)(V) | 3 |
| VCC(Max)(V) | 5.5 |
| Operating temperature range(C) | -55 to 125 |
| Surge voltage rating(Vpk) | 8000 |
| Propagation delay(ns) | 17 |
| Propagation delay(Typ)(ns) | 17 |
| Isolation rating(Vrms) | 5700 |
| Number of channels(#) | 2 |
| ISO7821LLS | ISO7821LLSDWW | ISO7821LLSDWWR | ISO7821LLSDW | ISO7821LLSDWR | |
|---|---|---|---|---|---|
| 描述 | ISO7821LLS High-Performance, 8000 VPK Reinforced Isolated Dual LVDS Buffer | High-Performance, 8000 VPK Reinforced Isolated Dual LVDS Buffer 16-SOIC -55 to 125 | High-Performance, 8000 VPK Reinforced Isolated Dual LVDS Buffer 16-SOIC -55 to 125 | High-Performance, 8000 VPK Reinforced Isolated Dual LVDS Buffer 16-SOIC -55 to 125 | High-Performance, 8000 VPK Reinforced Isolated Dual LVDS Buffer 16-SOIC -55 to 125 |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | - | SOIC-16 | SOIC-16 | SOIC-16 | SOIC-16 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| Factory Lead Time | - | 1 week | 12 weeks | 6 weeks | 6 weeks |
| 模拟集成电路 - 其他类型 | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 |
| 长度 | - | 10.3 mm | 10.3 mm | 10.3 mm | 10.3 mm |
| 湿度敏感等级 | - | 3 | 3 | 2 | 2 |
| 信道数量 | - | 2 | 2 | 2 | 2 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 16 | 16 | 16 | 16 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | SOP | SOP | SOP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 座面最大高度 | - | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 宽度 | - | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
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