SN74CB3Q3244 8-Bit FET Bus Switch 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch
| 参数名称 | 属性值 |
| Supply current(Max)(uA) | 2000 |
| VIH(Min)(V) | 1.7 |
| VIL(Max)(V) | 0.8 |
| Bandwidth(MHz) | 500 |
| Rating | Catalog |
| Vdd(Min)(V) | 2.3 |
| Approx. price(US$) | 0.33 | 1ku |
| Supply current(Typ)(uA) | 1000 |
| Supply range(Max) | 3.6 |
| CON(Typ)(pF) | 9 |
| Ron(Typ)(Ohms) | 4 |
| OFF-state leakage current(Max)(μA) | 1 |
| Input/output continuous current(Max)(mA) | 64 |
| Vdd(Max)(V) | 3.6 |
| Number of channels(#) | 8 |
| Features | Powered-off protection,Supports input voltage beyond supply |
| Operating temperature range(C) | -40 to 85 |
| Package Group | SSOP|20,TSSOP|20,TVSOP|20,VQFN|20 |
| ESD CDM(kV) | 1 |
| COFF(Typ)(pF) | 3.5 |
| ESD HBM(kV) | 2 |
| Power supply type | Single |
| Ron(Max)(Ohms) | 9 |
| SN74CB3Q3244 | SN74CB3Q3244PWE4 | SN74CB3Q3244PWRG4 | |
|---|---|---|---|
| 描述 | SN74CB3Q3244 8-Bit FET Bus Switch 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch | Digital Bus Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch | Digital Bus Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch |
| 是否无铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | - | TSSOP | TSSOP |
| 包装说明 | - | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 |
| 针数 | - | 20 | 20 |
| Reach Compliance Code | - | unknown | unknown |
| 系列 | - | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B |
| JESD-30 代码 | - | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | - | e4 | e4 |
| 长度 | - | 6.5 mm | 6.5 mm |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | - | 1 | 1 |
| 位数 | - | 4 | 4 |
| 功能数量 | - | 2 | 2 |
| 端口数量 | - | 2 | 2 |
| 端子数量 | - | 20 | 20 |
| 最高工作温度 | - | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C |
| 输出特性 | - | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | TSSOP |
| 封装等效代码 | - | TSSOP20,.25 | TSSOP20,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 260 | 260 |
| 电源 | - | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | - | 0.2 ns | 0.2 ns |
| 认证状态 | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | - | 2.5 V | 2.5 V |
| 表面贴装 | - | YES | YES |
| 技术 | - | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | GULL WING |
| 端子节距 | - | 0.65 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 4.4 mm | 4.4 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
