Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> SI52112-B4-GM2R

SI52112-B4-GM2R: 产品描述Processor Specific Clock Generator, 100MHz, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, MO-229, TDFN-10; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共20页; 制造商Silicon Laboratories Inc; 标准

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SI52112-B4-GM2R在线购买

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SI52112-B4-GM2R概述

Processor Specific Clock Generator, 100MHz, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, MO-229, TDFN-10

SI52112-B4-GM2R规格参数

参数名称	属性值
是否Rohs认证	符合
包装说明	HVSON,
Reach Compliance Code	compliant
ECCN代码	EAR99
Is Samacsys	N
JESD-30 代码	S-PDSO-N10
长度	3 mm
端子数量	10
最高工作温度	85 °C
最低工作温度	-40 °C
最大输出时钟频率	100 MHz
封装主体材料	PLASTIC/EPOXY
封装代码	HVSON
封装形状	SQUARE
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）	NOT SPECIFIED
主时钟/晶体标称频率	25 MHz
座面最大高度	0.8 mm
最大供电电压	3.46 V
最小供电电压	3.13 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	NO LEAD
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	3 mm
uPs/uCs/外围集成电路类型	CLOCK GENERATOR, PROCESSOR SPECIFIC
Base Number Matches	1

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S i 5 2 11 2 - B 3 / B 4

PCI-E

XPRESS

Features



DUAL

UTPUT

LOCK

ENERATOR

PCI-Express Gen 1 and Gen 2



compliant

Low power HCSL differential



output buffers



Supports Serial-ATA (SATA) at

100 MHz



No termination resistors required

25 MHz Crystal Input or Clock



input

Triangular spread spectrum



profile for maximum EMI

reduction (Si52112-B4)

Extended Temperature:

–40 to 85 °C

3.3 V Power supply

Small package 10-pin TDFN

(3x3 mm)

Si52112-B3 does not support

spread spectrum outputs

Si52112-B4 supports 0.5% down

spread outputs

For PCIe Gen3 applications, see

Si52112-B5/B6

Ordering Information:

See page 13

Applications

Network Attached Storage



Multi-function Printer



Pin Assignments

Wireless Access Point



Routers



VDD

XOUT

VDD

DIFF2

DIFF1

Description

XIN/CLKIN

Si52112-B3/B4 is a high-performance, PCIe clock generator that can

source two PCIe clocks from a 25 MHz crystal or clock input. The clock

outputs are compliant to PCIe Gen 1 and Gen 2 specifications. The ultra-

small footprint (3x3 mm) and industry leading low power consumption

make Si52112-B3/B4 the ideal clock solution for consumer and

embedded applications.

VSS

Patents pending

VDD

DIFF1

XIN/CLKIN

XOUT

PLL

Divider

DIFF2

VSS

Rev 1.2

Si52112-B3/B4

Si52112-B3/B4

ABLE

Section

ONTENTS

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Crystal Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

2.1. Crystal Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

2.2. Calculating Load Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

3. Test and Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

4. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1. 10-Pin TDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.2. 8-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6. Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

6.1. TDFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.2. TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7. Recommended Design Guideline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Rev 1.2

SI52112-B4-GM2R相似产品对比

	SI52112-B4-GM2R	SI52112-B3-GM2R	SI52112-B4-GM2	SI52112-B3-GT	SI52112-B3-GM2	SI52112-B4-GT	SI52112-B4-GTR	SI52112-B3-GTR
描述	Processor Specific Clock Generator, 100MHz, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, MO-229, TDFN-10	Processor Specific Clock Generator, 100MHz, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, MO-229, TDFN-10	Processor Specific Clock Generator, 100MHz, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, MO-229, TDFN-10	Processor Specific Clock Generator, 100MHz, CMOS, PDSO8, ROHS COMPLIANT, MO-153AA, TSSOP-8	Processor Specific Clock Generator, 100MHz, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, MO-229, TDFN-10	Processor Specific Clock Generator, 100MHz, CMOS, PDSO8, ROHS COMPLIANT, MO-153AA, TSSOP-8	Processor Specific Clock Generator, 100MHz, CMOS, PDSO8, ROHS COMPLIANT, MO-153AA, TSSOP-8	Processor Specific Clock Generator, 100MHz, CMOS, PDSO8, ROHS COMPLIANT, MO-153AA, TSSOP-8
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
包装说明	HVSON,	HVSON,	HVSON,	TSSOP,	HVSON,	TSSOP,	TSSOP,	TSSOP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 代码	S-PDSO-N10	S-PDSO-N10	S-PDSO-N10	R-PDSO-G8	S-PDSO-N10	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
长度	3 mm	3 mm	3 mm	4.4 mm	3 mm	4.4 mm	4.4 mm	4.4 mm
端子数量	10	10	10	8	10	8	8	8
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
最大输出时钟频率	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HVSON	HVSON	HVSON	TSSOP	HVSON	TSSOP	TSSOP	TSSOP
封装形状	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
主时钟/晶体标称频率	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
座面最大高度	0.8 mm	0.8 mm	0.8 mm	1.2 mm	0.8 mm	1.2 mm	1.2 mm	1.2 mm
最大供电电压	3.46 V	3.46 V	3.46 V	3.46 V	3.46 V	3.46 V	3.46 V	3.46 V
最小供电电压	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V	3.13 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.65 mm	0.5 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
uPs/uCs/外围集成电路类型	CLOCK GENERATOR, PROCESSOR SPECIFIC	CLOCK GENERATOR, PROCESSOR SPECIFIC	CLOCK GENERATOR, PROCESSOR SPECIFIC	CLOCK GENERATOR, PROCESSOR SPECIFIC	CLOCK GENERATOR, PROCESSOR SPECIFIC	CLOCK GENERATOR, PROCESSOR SPECIFIC	CLOCK GENERATOR, PROCESSOR SPECIFIC	CLOCK GENERATOR, PROCESSOR SPECIFIC
Base Number Matches	1	1	1	1	1	1	1	1
Is Samacsys	N	N	N	N	N	-	-	-

SI52112-B4-GM2R

SI52112-B4-GM2R在线购买

SI52112-B4-GM2R概述

SI52112-B4-GM2R规格参数

文档预览

SI52112-B4-GM2R相似产品对比

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