High Speed MOSFET Drivers with Current Limit 16-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 高边驱动器 | NO |
| 输入特性 | STANDARD |
| 接口集成电路类型 | PUSH-PULL BASED MOSFET DRIVER |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.56 mm |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | TOTEM-POLE |
| 最大输出电流 | 1.5 A |
| 标称输出峰值电流 | 1.5 A |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 20 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 10 mA |
| 最大供电电压 | 40 V |
| 最小供电电压 | 5 V |
| 标称供电电压 | 20 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 断开时间 | 0.13 µs |
| 接通时间 | 0.14 µs |
| 宽度 | 7.62 mm |
| UC1706J883B | 5962-89611012A | 5962-8961101EA | UC1706J | UC1706L | UC2706J | UC1706 | UC2706 | UC2706M | UC3706 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | High Speed MOSFET Drivers with Current Limit 16-CDIP -55 to 125 | High Speed MOSFET Drivers with Current Limit 20-LCCC -55 to 125 | High Speed MOSFET Drivers with Current Limit 16-CDIP -55 to 125 | High Speed MOSFET Drivers with Current Limit 16-CDIP -55 to 125 | High Speed MOSFET Drivers with Current Limit 20-LCCC -55 to 125 | High Speed MOSFET Drivers with Current Limit 16-CDIP -40 to 85 | UC1706 High Speed MOSFET Drivers with Current Limit | UC2706 High Speed MOSFET Drivers with Current Limit | UC2706M High Speed MOSFET Drivers with Current Limit | UC3706 Dual High Speed MOSFET Drivers |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | - | - |
| 零件包装代码 | DIP | QLCC | DIP | DIP | QLCC | DIP | - | - | - | - |
| 包装说明 | DIP, DIP16,.3 | LCC-20 | DIP-16 | DIP, DIP16,.3 | HQCCN, LCC20,.35SQ | DIP, DIP16,.3 | - | - | - | - |
| 针数 | 16 | 20 | 16 | 16 | 20 | 16 | - | - | - | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - | - |
| Factory Lead Time | 1 week | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | - | - | - | - |
| 高边驱动器 | NO | NO | NO | NO | NO | NO | - | - | - | - |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | - | - | - | - |
| 接口集成电路类型 | PUSH-PULL BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | PUSH-PULL BASED MOSFET DRIVER | PUSH-PULL BASED MOSFET DRIVER | PUSH-PULL BASED MOSFET DRIVER | PUSH-PULL BASED MOSFET DRIVER | - | - | - | - |
| JESD-30 代码 | R-GDIP-T16 | S-CQCC-N20 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | R-GDIP-T16 | - | - | - | - |
| 长度 | 19.56 mm | 8.89 mm | 19.56 mm | 19.56 mm | 8.89 mm | 19.56 mm | - | - | - | - |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | - | - | - |
| 端子数量 | 16 | 20 | 16 | 16 | 20 | 16 | - | - | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | - | - | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | - | - | - | - |
| 最大输出电流 | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | - | - | - | - |
| 标称输出峰值电流 | 1.5 A | 1.5 A | 1 A | 1.5 A | 1.5 A | 1.5 A | - | - | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | - | - | - |
| 封装代码 | DIP | HQCCN | DIP | DIP | HQCCN | DIP | - | - | - | - |
| 封装等效代码 | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | - | - | - | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - | - | - | - |
| 封装形式 | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG | IN-LINE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG | IN-LINE | - | - | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
| 认证状态 | Not Qualified | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - | - |
| 座面最大高度 | 5.08 mm | 2.03 mm | 5.08 mm | 5.08 mm | 2.03 mm | 5.08 mm | - | - | - | - |
| 最大压摆率 | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | - | - | - | - |
| 最大供电电压 | 40 V | 40 V | 40 V | 40 V | 40 V | 40 V | - | - | - | - |
| 最小供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - | - |
| 标称供电电压 | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V | - | - | - | - |
| 表面贴装 | NO | YES | NO | NO | YES | NO | - | - | - | - |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - | - | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | - | - | - | - |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | - | - | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | - | - | - | - |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | - | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
| 断开时间 | 0.13 µs | 0.13 µs | 0.13 µs | 0.13 µs | 0.13 µs | 0.13 µs | - | - | - | - |
| 接通时间 | 0.14 µs | 0.14 µs | 0.14 µs | 0.14 µs | 0.14 µs | 0.14 µs | - | - | - | - |
| 宽度 | 7.62 mm | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm | 7.62 mm | - | - | - | - |
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