2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 8-WSON -40 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | WSON-8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| Samacsys Confidence | 3 |
| Samacsys Status | Released |
| Samacsys PartID | 1134150 |
| Samacsys Pin Count | 9 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | Small Outline No-lead |
| Samacsys Footprint Name | TLV9002IDSGR |
| Samacsys Released Date | 2019-01-03 09:53:48 |
| Is Samacsys | N |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最小共模抑制比 | 63 dB |
| 标称共模抑制比 | 77 dB |
| 最大输入失调电压 | 2000 µV |
| JESD-30 代码 | S-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 2 mm |
| 湿度敏感等级 | 2 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 座面最大高度 | 0.8 mm |
| 标称压摆率 | 2 V/us |
| 最大压摆率 | 0.15 mA |
| 供电电压上限 | 6 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称均一增益带宽 | 1000 kHz |
| 宽度 | 2 mm |
| Base Number Matches | 1 |
| TLV9002IDSGR | TLV9002IDGKT | TLV9002IDSGT | TLV9002IPWR | PTLV9001IDBVR | PTLV9001IDCKR | PTLV9002IDDFR | TLV9002 | TLV9002IDDFR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 8-WSON -40 to 125 | 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 8-VSSOP -40 to 125 | 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 8-WSON -40 to 125 | 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 8-TSSOP -40 to 125 | 1 - channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 5-SOT-23 -40 to 125 | 1 - channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 5-SC70 -40 to 125 | 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 8-SOT-23-THIN -40 to 125 | 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 8-SOT-23-THIN -40 to 125 | 2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 8-SOT-23-THIN -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - | - | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - | - | - | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | - | - | - | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | - | - | Texas Instruments(德州仪器) |
| 包装说明 | WSON-8 | VSSOP-8 | WSON-8 | TSSOP-8 | - | - | - | - | SOT-23, 8 PIN |
| Reach Compliance Code | compliant | compliant | compliant | compliant | - | - | - | - | compliant |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 6 weeks | - | - | - | - | 8 weeks |
| Is Samacsys | N | N | N | N | - | - | - | - | N |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | - | - | - | OPERATIONAL AMPLIFIER |
| 最小共模抑制比 | 63 dB | 63 dB | 63 dB | 63 dB | - | - | - | - | 63 dB |
| 标称共模抑制比 | 77 dB | 77 dB | 77 dB | 77 dB | - | - | - | - | 95 dB |
| 最大输入失调电压 | 2000 µV | 2000 µV | 2000 µV | 2000 µV | - | - | - | - | 2000 µV |
| JESD-30 代码 | S-PDSO-N8 | S-PDSO-G8 | S-PDSO-N8 | R-PDSO-G8 | - | - | - | - | R-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | e3 | - | - | - | - | e4 |
| 长度 | 2 mm | 3 mm | 2 mm | 4.4 mm | - | - | - | - | 2.9 mm |
| 湿度敏感等级 | 2 | 2 | 2 | 2 | - | - | - | - | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | - | - | - | - | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | - | - | - | - | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | - | - | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | - | - | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | - | PLASTIC/EPOXY |
| 封装代码 | HVSON | TSSOP | HVSON | TSSOP | - | - | - | - | TSSOP |
| 封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | - | - | - | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 座面最大高度 | 0.8 mm | 1.1 mm | 0.8 mm | 1.2 mm | - | - | - | - | 1.1 mm |
| 标称压摆率 | 2 V/us | 2 V/us | 2 V/us | 2 V/us | - | - | - | - | 2 V/us |
| 最大压摆率 | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | - | - | - | - | 0.15 mA |
| 供电电压上限 | 6 V | 6 V | 6 V | 6 V | - | - | - | - | 6 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - | - | - | - | 5 V |
| 表面贴装 | YES | YES | YES | YES | - | - | - | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | - | - | - | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | - | - | - | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | - | - | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING | - | - | - | - | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | - | - | - | - | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | - | - | - | DUAL |
| 标称均一增益带宽 | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | - | - | - | - | 1000 kHz |
| 宽度 | 2 mm | 3 mm | 2 mm | 3 mm | - | - | - | - | 1.6 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - | - | 1 |
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